Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2008
11/05/2008CN101299428A Semiconductor capacitor structure
11/05/2008CN101299426A Module and electronic device
11/05/2008CN101299425A Etched leadframe structure
11/05/2008CN101299424A Integrated circuit lead frame copper strip and preparation method thereof
11/05/2008CN101299423A Amorphous tungsten-doped tin dioxide transparent conductive oxide thin film and preparation method thereof
11/05/2008CN101299422A Semiconductor-integrated electronic device having a plurality of leads
11/05/2008CN101299421A Semiconductor device including ruthenium electrode and manufacture method thereof
11/05/2008CN101299419A Semiconductor device and manufacture method thereof
11/05/2008CN101299418A Semiconductor device and manufacture method thereof
11/05/2008CN101299407A Process monitor and system for producing semiconductor
11/05/2008CN101298903A High-power LED light source with adjustable light beam
11/05/2008CN100431394C Substrate with composite medium and multilayer substrate made by the same
11/05/2008CN100431174C A packaging structure with a chip above a photosensitive element and electric packaging structure thereof
11/05/2008CN100431159C Image pick equipment and its manufacturing method
11/05/2008CN100431151C Integrated circuit capacitor
11/05/2008CN100431147C Poly-silicon stringer fuse
11/05/2008CN100431146C Semiconductor device
11/05/2008CN100431145C Semiconductor device and method for fabricating the same
11/05/2008CN100431144C Package substrate
11/05/2008CN100431143C Semiconductor encapsulation structure
11/05/2008CN100431142C Semiconductor device and its manufacturing method
11/05/2008CN100431141C Heat sink, heat interface and cooling method for resistor
11/05/2008CN100431140C Semiconductor device with a protective security coating and method of manufacturing the same
11/05/2008CN100431139C Method for mfg. thin film transistor array substrages
11/05/2008CN100431135C Chip of memory, chip-on-chip device of using same and its mfg. method
11/05/2008CN100431134C Method for fabricating metal interconnection line with use of barrier metal layer formed in low temperature
11/05/2008CN100431124C Wire bond pads and its producing method
11/05/2008CN100431121C Silicone adhesive agent
11/05/2008CN100431120C Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment
11/05/2008CN100431119C Manufacturing method of lead frame
11/05/2008CN100431110C Low-dielectric silicon nitride film and method of making the same, seimiconductor device and fabrication process thereof
11/05/2008CN100431106C Method for forming interconnected electroplating lead wire of nano-carbon tube and metal composite material
11/05/2008CN100431093C Space-efficient package for laterally conducting device
11/05/2008CN100431069C Thin film capacitor, and electronic circuit component
11/05/2008CN100431042C Semiconductor device and data writing method therefor
11/05/2008CN100430828C Composition having permitivity being radiation-sensitively changeable and method for forming permitivity pattern
11/05/2008CN100430451C Sprayable adhesive material for laser marking semiconductor wafers, dies and devices
11/04/2008US7447492 On chip transformer isolator
11/04/2008US7447035 Heat dissipation device assembly
11/04/2008US7447022 Rack-mount equipment bay cooling heat exchanger
11/04/2008US7447017 Computer having a heat discharging unit
11/04/2008US7446923 Semiconductor, functional device, electrochromic device, optical device, and image-taking unit
11/04/2008US7446639 Micro power converter and method of manufacturing same
11/04/2008US7446545 Anisotropically conductive sheet
11/04/2008US7446424 Interconnect structure for semiconductor package
11/04/2008US7446423 Semiconductor device and method for assembling the same
11/04/2008US7446421 Bonding structure with buffer layer and method of forming the same
11/04/2008US7446419 Semiconductor chip assembly with welded metal pillar of stacked metal balls
11/04/2008US7446418 Semiconductor device for preventing defective filling of interconnection and cracking of insulating film
11/04/2008US7446417 Semiconductor integrated circuit device and fabrication method thereof
11/04/2008US7446416 Barrier material formation in integrated circuit structures
11/04/2008US7446415 Method for filling electrically different features
11/04/2008US7446414 Semiconductor device
11/04/2008US7446413 Circuit apparatus and method for operating the same
11/04/2008US7446412 Heat sink design using clad metal
11/04/2008US7446411 Semiconductor structure and method of assembly
11/04/2008US7446410 Circuit module with thermal casing systems
11/04/2008US7446409 Cavity-down multiple-chip package
11/04/2008US7446408 Semiconductor package with heat sink
11/04/2008US7446407 Chip package structure
11/04/2008US7446406 Circuit device and manufacturing method thereof
11/04/2008US7446405 Wafer level chip scale package (WLCSP) with high reliability against thermal stress
11/04/2008US7446404 Three-dimensional package and method of making the same
11/04/2008US7446403 Carrier structure stacking system and method
11/04/2008US7446401 Structure of power semiconductor with twin metal and ceramic plates
11/04/2008US7446400 Chip package structure and fabricating method thereof
11/04/2008US7446399 Pad structures to improve board-level reliability of solder-on-pad BGA structures
11/04/2008US7446398 Bump pattern design for flip chip semiconductor package
11/04/2008US7446397 Leadless semiconductor package
11/04/2008US7446396 Stacked integrated circuit leadframe package system
11/04/2008US7446395 Device having dual etch stop liner and protective layer
11/04/2008US7446394 Semiconductor device fabricated by selective epitaxial growth method
11/04/2008US7446392 Electronic device and method for manufacturing the same
11/04/2008US7446390 Semiconductor device
11/04/2008US7446389 Semiconductor die package with internal bypass capacitors
11/04/2008US7446384 CMOS image sensor module with wafers
11/04/2008US7446378 ESD protection structure for I/O pad subject to both positive and negative voltages
11/04/2008US7446377 Transistors and manufacturing methods thereof
11/04/2008US7446364 Semiconductor memory device including multi-layer gate structure
11/04/2008US7446347 Optoelectronic component and method for the production thereof, module and device comprising a module of this type
11/04/2008US7446307 Sensor semiconductor device and fabrication method of the sensor semiconductor device
11/04/2008US7446284 Etch resistant wafer processing apparatus and method for producing the same
11/04/2008US7446277 Method for sorting integrated circuit devices
11/04/2008US7446262 Laminated electronic component and method for producing the same
11/04/2008US7446261 Flexible circuit boards with tooling cutouts for optoelectronic modules
11/04/2008US7446035 Post passivation interconnection schemes on top of IC chips
11/04/2008US7446031 Post passivation interconnection schemes on top of IC chips
11/04/2008US7446028 Multi-component integrated circuit contacts
11/04/2008US7445969 Method of manufacturing a semiconductor device
11/04/2008US7445966 Method and structure for charge dissipation during fabrication of integrated circuits and isolation thereof
11/04/2008US7445965 Method of manufacturing radiating plate and semiconductor apparatus using the same
11/04/2008US7445964 Semiconductor device and method of manufacturing the same
11/04/2008US7445963 Semiconductor package having an interfacial adhesive layer
11/04/2008US7445961 Semiconductor chip package and method for fabricating the same
11/04/2008US7445960 Adhesion by plasma conditioning of semiconductor chip
11/04/2008US7445958 Semiconductor device having a leading wiring layer
10/2008
10/30/2008WO2008130493A2 Connecting microsized devices using ablative films
10/30/2008WO2008130012A1 Power semiconductor module
10/30/2008WO2008129923A1 High frequency circuit board, high frequency circuit module, and radar device
10/30/2008WO2008129601A1 Semiconductor device manufacturing method, and semiconductor device
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