| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/25/2008 | US20080230927 Fully tested wafers having bond pads undamaged by probing and applications thereof |
| 09/25/2008 | US20080230926 Surface Treatments for Contact Pads Used in Semiconductor Chip Packagages and Methods of Providing Such Surface Treatments |
| 09/25/2008 | US20080230925 Solder-bumping structures produced by a solder bumping method |
| 09/25/2008 | US20080230924 Semiconductor device, semiconductor package for use therein, and manufacturing method thereof |
| 09/25/2008 | US20080230923 Chip stack package and method of manufacturing the chip stack package |
| 09/25/2008 | US20080230922 Semiconductor device and its manufacturing method |
| 09/25/2008 | US20080230921 Semiconductor device and method for manufacturing the same |
| 09/25/2008 | US20080230920 Wire-Bonded Semiconductor Component with Reinforced Inner Connection Metallization |
| 09/25/2008 | US20080230919 Dual damascene with via liner |
| 09/25/2008 | US20080230918 Semiconductor integrated circuit and design method of signal terminals on input/output cell |
| 09/25/2008 | US20080230917 method of fabricating two-step self-aligned contact |
| 09/25/2008 | US20080230916 Semiconductor integrated circuit device and fabrication process thereof |
| 09/25/2008 | US20080230915 SEMICONDUCTOR PACKAGE USING WIRES CONSISTING OF Ag OR Ag ALLOY |
| 09/25/2008 | US20080230914 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 09/25/2008 | US20080230913 Stackable semiconductor device and fabrication method thereof |
| 09/25/2008 | US20080230912 Wafer-level stack package and method of fabricating the same |
| 09/25/2008 | US20080230911 Method of forming a silicide layer on a thinned silicon wafer, and related semiconducting structure |
| 09/25/2008 | US20080230910 Integrated circuit and method for producing the same |
| 09/25/2008 | US20080230909 Method for forming anti-stiction bumps on a micro-electro mechanical structure |
| 09/25/2008 | US20080230908 Semiconductor device |
| 09/25/2008 | US20080230907 Integrated circuit system with carbon enhancement |
| 09/25/2008 | US20080230906 Contact structure having dielectric spacer and method |
| 09/25/2008 | US20080230905 Power Semiconductor Module, Method for Producing a Power Semiconductor Module, and Semiconductor Chip |
| 09/25/2008 | US20080230904 Gallium Nitride-Based III-V Group Compound Semiconductor Device and Method of Manufacturing the Same |
| 09/25/2008 | US20080230903 Semiconductor chip, semiconductor device and method for producing the same |
| 09/25/2008 | US20080230902 Method of Forming Solder Bump on High Topography Plated Cu |
| 09/25/2008 | US20080230901 Structure for controlled collapse chip connection with displaced captured pads |
| 09/25/2008 | US20080230900 Determining the placement of semiconductor components on an integrated circuit |
| 09/25/2008 | US20080230899 Semiconductor device and manufacturing method thereof |
| 09/25/2008 | US20080230898 Semiconductor device and method for manufacturing thereof |
| 09/25/2008 | US20080230897 Method of manufacturing electronic device, substrate and semiconductor device |
| 09/25/2008 | US20080230896 Copper die bumps with electromigration cap and plated solder |
| 09/25/2008 | US20080230895 Semiconductor package and the method for manufacturing the same |
| 09/25/2008 | US20080230894 Semiconductors encased in covering containing carbon nanotubes; circulation a fluid over nanothbes |
| 09/25/2008 | US20080230893 Integrated Circuit with Package Lid |
| 09/25/2008 | US20080230892 Chip package module |
| 09/25/2008 | US20080230891 Chip and wafer integration process using vertical connections |
| 09/25/2008 | US20080230890 Structure and electronics device using the structure |
| 09/25/2008 | US20080230889 Semiconductor package |
| 09/25/2008 | US20080230888 Semiconductor device |
| 09/25/2008 | US20080230887 Semiconductor package and the method of making the same |
| 09/25/2008 | US20080230886 Stacked package module |
| 09/25/2008 | US20080230885 Chip hermetic package device and method for producing the same |
| 09/25/2008 | US20080230884 Semiconductor device package having multi-chips with side-by-side configuration and method of the same |
| 09/25/2008 | US20080230883 Integrated circuit package system with molded strip protrusion |
| 09/25/2008 | US20080230882 Chip package structure |
| 09/25/2008 | US20080230881 Integrated circuit package system with lead support |
| 09/25/2008 | US20080230880 Leadframe Array with Riveted Heat Sinks |
| 09/25/2008 | US20080230879 Methods and apparatus for flip-chip-on-lead semiconductor package |
| 09/25/2008 | US20080230878 Leadframe based flip chip semiconductor package and lead frame thereof |
| 09/25/2008 | US20080230877 Semiconductor package having wire redistribution layer and method of fabricating the same |
| 09/25/2008 | US20080230876 Leadframe Design for QFN Package with Top Terminal Leads |
| 09/25/2008 | US20080230875 DUV LASER ANNEALING AND STABILIZATION OF SiCOH FILMS |
| 09/25/2008 | US20080230874 Semiconductor device and method of producing semiconductor device |
| 09/25/2008 | US20080230873 Semiconductor device with capacitor and/or inductor and method of making |
| 09/25/2008 | US20080230870 Input protection circuit preventing electrostatic discharge damage of semiconductor integrated circuit |
| 09/25/2008 | US20080230847 Semiconductor device and manufacturing method of the same |
| 09/25/2008 | US20080230845 Semiconductor device and method of forming the same |
| 09/25/2008 | US20080230807 Semiconductor Device |
| 09/25/2008 | US20080230515 Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof |
| 09/25/2008 | US20080230210 Thermosiphon boiler plate |
| 09/25/2008 | US20080230110 Thin film photodetector, method and system |
| 09/25/2008 | US20080230106 Forming a thin film electric cooler and structures formed thereby |
| 09/25/2008 | US20080229827 Electronic part, method for fabricating electronic part, acceleration sensor, and method for fabricating acceleration sensor |
| 09/25/2008 | US20080229822 Angular Velocity Measuring Device |
| 09/25/2008 | DE202008008083U1 Kühlrippe und Kühlmodul mit diesen Kühlrippen Fin and cooling module with these fins |
| 09/25/2008 | DE19749987B4 Gehäuse für Halbleiterbauelemente, insbesondere für Leistungshalbleiterbauelemente Enclosure for semiconductor devices, in particular for power semiconductor components |
| 09/25/2008 | DE10297642B4 Verfahren zum Steuern der Höhe der Chiphalterandnaht, um Chipscherungsbelastungen zu reduzieren A method for controlling the level of the chip holding edge seam to reduce Chipscherungsbelastungen |
| 09/25/2008 | DE102008014930A1 Ausgangsschaltung und Leistungsbauteil Output circuit and power device |
| 09/25/2008 | DE102008012834A1 Vorrichtung mit einem Bauelement und Verfahren zum Herstellen derselben A device with a device and method for manufacturing the same |
| 09/25/2008 | DE102008011631A1 Elektronische Einrichtung und Montageverfahren für Elektronische Komponenten Electronic device and method for assembling electronic components |
| 09/25/2008 | DE102008010532A1 Sensor für eine physikalische Größe und Halbleitervorrichtung mit einem Gehäuse und einer Abdeckung A physical quantity sensor and semiconductor device having a housing and a cover |
| 09/25/2008 | DE102007016288A1 Integrierter Schaltkreis und Verfahren zum Herstellen einer Kontaktanordnung und einer Verbindungsanordnung Integrated circuit and method for fabricating a contact assembly and a connector assembly |
| 09/25/2008 | DE102007014198A1 Integriertes Bauteil Integrated component |
| 09/25/2008 | DE102007013986A1 Optoelectronic component e.g. LED, has protective structure comprising material e.g. ceramic material or metal oxide e.g. zinc oxide, attached to structural element and/or to contact terminal, where material is provided as pasty mass |
| 09/25/2008 | DE102007012155A1 Formkörper und Nutzen mit Halbleiterchips, Gießform und Verfahren zur Herstellung des Formkörpers und des Nutzens Shaped body and benefits with semiconductor chips, mold and process for producing the shaped body and benefits |
| 09/25/2008 | DE102007010882A1 Solder connection for use between semiconductor chip and substrate, has soldering material layer arranged between power semiconductor chip and upper surface region of substrate, where layer exhibits repeatedly meltable soldering material |
| 09/25/2008 | DE102007002492A1 Plate type heat exchanger with a fixing surface and a heat exchange and/or cooling useful in production of electrical and electronic components has increased heat exchange efficiency |
| 09/25/2008 | DE102006059526B4 Halbleiterbauteil, Nutzen mit in Zeilen und Spalten angeordneten Halbleiterbauteilen und Verfahren zur Herstellung eines Halbleiterbauteils A semiconductor device, with the benefit arranged in rows and columns semiconductor devices and method of manufacturing a semiconductor device |
| 09/25/2008 | DE102006051496B4 Halbleiterbauelement mit einem porösen Materialschichtstapel mit kleinem ε mit reduzierter UV-Empfindlichkeit und Verfahren zu dessen Herstellung A semiconductor device having a porous material layer stack with a small ε with reduced UV sensitivity and process for its preparation |
| 09/25/2008 | DE102005049687B4 Leistungshalbleiterbauteil in Flachleitertechnik mit vertikalem Strompfad und Verfahren zur Herstellung Power semiconductor device in flat conductor technique with vertical current path and methods for preparing |
| 09/25/2008 | DE102005016511B4 Verfahren zum Herstellen einer Leiterstruktur auf einem Substrat A method for producing a conductor pattern on a substrate |
| 09/25/2008 | DE10159444B9 Flüssigkristallanzeige-Bildschirm und Verfahren zum Herstellen desselben Of the same liquid crystal display screen and methods of making |
| 09/25/2008 | CA2664872A1 Method and apparatus for making a radio frequency inlay |
| 09/24/2008 | EP1973159A2 Integrated resistor capacitator structure |
| 09/24/2008 | EP1973158A1 Electronic component |
| 09/24/2008 | EP1973157A1 Aluminum/silicon carbide composite and heat radiation part making use of the same |
| 09/24/2008 | EP1973156A2 Integrated circuit package with top-side conduction cooling |
| 09/24/2008 | EP1972976A2 Marked body and manufacturing method thereof |
| 09/24/2008 | EP1972010A2 Substrate and method for mounting silicon device |
| 09/24/2008 | EP1972009A2 Recyclying faulty multi-die packages |
| 09/24/2008 | EP1549472B1 Method for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method |
| 09/24/2008 | EP1506568A4 Direct-connect signaling system |
| 09/24/2008 | EP1472728B1 Thermal management materials having a phase change dispersion |
| 09/24/2008 | CN201123213Y Heat radiating unit |
| 09/24/2008 | CN201123210Y Snap-closing structure of radiating fin |
| 09/24/2008 | CN201123209Y Wind scooper |
| 09/24/2008 | CN201123208Y Radiation fin with gradual expansion cooling structure |
| 09/24/2008 | CN201123206Y Radiation fin connecting structure |
| 09/24/2008 | CN201123205Y Heat radiator |