Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2008
10/29/2008CN101295722A Semiconductor device, optical measuring and detecting device, and method of manufacturing the same
10/29/2008CN101295720A Active element array substrate
10/29/2008CN101295719A LED panel and its active element array substrate
10/29/2008CN101295718A LED panel and its active element array substrate
10/29/2008CN101295717A Thin-film transistor panel and its production method
10/29/2008CN101295715A High-voltage wireless radio frequency power element
10/29/2008CN101295711A Semiconductor device and method for manufacturing the same
10/29/2008CN101295710A 半导体器件 Semiconductor devices
10/29/2008CN101295708A Stacked semiconductor device assembly and package
10/29/2008CN101295707A Image capturing device
10/29/2008CN101295706A Test substrate, test substrate mask and test substrate forming method
10/29/2008CN101295705A Test substrate, test substrate mask and test substrate forming method
10/29/2008CN101295704A Ta-Al-N diffusion blocking layer thin film for copper wiring and preparation thereof
10/29/2008CN101295703A Electromigration aggravated electrical fuse structure
10/29/2008CN101295702A Substrate with feedthrough and method for producing the same
10/29/2008CN101295701A Package for semiconductor devices
10/29/2008CN101295700A Package for semiconductor devices
10/29/2008CN101295699A Substrate with pin, wiring substrate and semiconductor device
10/29/2008CN101295698A Flip-chip substrate structure and production method thereof
10/29/2008CN101295697A Semiconductor encapsulation construction
10/29/2008CN101295696A Semi-conductor package structure and lead frame
10/29/2008CN101295695A Lead frame with welding flux flow control
10/29/2008CN101295694A Semiconductor device and method for producing the same
10/29/2008CN101295693A 半导体器件 Semiconductor devices
10/29/2008CN101295692A 半导体装置 Semiconductor device
10/29/2008CN101295691A 半导体封装结构 The semiconductor package structure
10/29/2008CN101295690A Wafer encapsulation construction and wafer carrier for reducing substrate circuit layer
10/29/2008CN101295689A Semiconductor device and package including the same
10/29/2008CN101295688A Redistribution structure and production method thereof, redistribution convex point and production method thereof
10/29/2008CN101295687A 半导体器件 Semiconductor devices
10/29/2008CN101295686A Semiconductor device and method of manufacturing the same
10/29/2008CN101295685A Heat pipe and manufacturing method thereof
10/29/2008CN101295684A Cooling encapsulation of heating element
10/29/2008CN101295683A Semiconductor device package to improve functions of heat sink and ground shield
10/29/2008CN101295682A Thin film flip-chip encapsulation structure
10/29/2008CN101295681A Water-cooling radiating module device of display card
10/29/2008CN101295680A Active-matrix substrate and method for producing the same, electrooptical device and method for producing the same, and electronic apparatus
10/29/2008CN101295673A Method for forming bit line contact plug and transistor structure
10/29/2008CN101295672A Compound covering layer and production method thereof
10/29/2008CN101295668A Filling method for hatch and connecting structure of semiconductor device
10/29/2008CN101295656A Semiconductor device and manufacturing method thereof
10/29/2008CN101295651A Semiconductor device and its manufacturing method
10/29/2008CN101295650A Semiconductor device and its manufacturing method
10/29/2008CN101295649A Packaging method for LED with high cooling efficiency and structure thereof
10/29/2008CN101295648A Packaging method for low thermoresistance LED and its structure
10/29/2008CN101295635A Method and device for improving capacity of MIM capacitance
10/29/2008CN101295634A Method and device for improving capacity of MIM capacitance
10/29/2008CN101295633A Metal-insulator-metal capacitor and its manufacture process
10/29/2008CN101295624A Defect detecting structure, and production method and detection method thereof
10/29/2008CN101295585A Capacitor, circuit board containing the capacitor, and integrated circuit bearing substrate
10/29/2008CN101295184A Integrated circuit with temperature control function, temperature-controlled heating circuit and constant temperature retaining device
10/29/2008CN101295072A Method for producing optical device
10/29/2008CN101294698A Luminous diode lighting device
10/29/2008CN101294694A Power type LED lead frame piece and process technique thereof
10/29/2008CN101294693A Production method of white LED
10/29/2008CN101294678A Wind-electricity complementary LED road lamp heat radiating device
10/29/2008CN101294065A Enhanced thermal conducting formulations and methods for cooling electronic parts
10/29/2008CN100429963C Semiconductor device and manufacturing method of the same
10/29/2008CN100429840C Electric connector and its system arrangement method
10/29/2008CN100429776C Trimmer impedance component, semiconductor device and trimming method
10/29/2008CN100429775C Packaging device of ic circuit and its producing method
10/29/2008CN100429774C Semiconductor packaging device and its manufacturing method
10/29/2008CN100429773C Module and mounting structure using the same
10/29/2008CN100429772C Semiconductor device and its manufacture method
10/29/2008CN100429771C Semiconductor device and method for making the same
10/29/2008CN100429770C Semiconductor device and manufacturing method of the same
10/29/2008CN100429769C Method and system for a semiconductor package with an air vent
10/29/2008CN100429768C Vice mounting board and semiconductor apparatus using device mounting board
10/29/2008CN100429767C Device mounting board
10/29/2008CN100429766C Circuit device and method of manufacturing the same
10/29/2008CN100429765C An array substrate of thin-film transistor and its manufacture method
10/29/2008CN100429762C Microelectronic structure comprising hydrogen barrier layer
10/29/2008CN100429756C Composite material and chip holding component and making method thereof
10/29/2008CN100429755C Semiconductor device manufacturing method, semiconductor device, laminated semiconductor device, circuit substrate, and electronic apparatus
10/29/2008CN100429743C Method of making a semiconductor device
10/29/2008CN100429664C Method and apparatus for performing power routing on a voltage island within an integrated circuit chip
10/28/2008US7444614 Computer-readable recording medium storing semiconductor designing program for improving both integration and connection of via-contact and metal
10/28/2008US7444253 Air bridge structures and methods of making and using air bridge structures
10/28/2008US7444209 Miniature cooling device
10/28/2008US7444041 System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
10/28/2008US7443711 Non-volatile programmable impedance nanoscale devices
10/28/2008US7443693 Electromagnetic interference shielding for a printed circuit board
10/28/2008US7443684 Heat sink apparatus
10/28/2008US7443681 Heat dissipator for display apparatus and plasma display apparatus including the heat dissipator
10/28/2008US7443678 Flexible circuit board with heat sink
10/28/2008US7443677 Heat dissipation device
10/28/2008US7443675 Heat pipe with guided internal grooves and heat dissipation module incorporating the same
10/28/2008US7443673 Cooling function power adapter
10/28/2008US7443671 Axial duct cooling fan
10/28/2008US7443665 Lock for notebook computer or other personal electronic device
10/28/2008US7443647 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
10/28/2008US7443264 Compact impedance transformation circuit
10/28/2008US7443043 Circuit device and method of manufacture thereof
10/28/2008US7443042 Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit
10/28/2008US7443041 Packaging of a microchip device
10/28/2008US7443040 Aluminum cap with electroless nickel/immersion gold
10/28/2008US7443039 System for different bond pads in an integrated circuit package
10/28/2008US7443038 Flip-chip image sensor packages
10/28/2008US7443037 Stacked integrated circuit package system with connection protection
10/28/2008US7443036 Manufacturing method of semiconductor device
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