Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2008
10/21/2008US7439607 Beta control using a rapid thermal oxidation
10/21/2008US7439603 Non-volatile memory device and fabricating method thereof
10/21/2008US7439598 Microelectronic imaging units
10/21/2008US7439592 ESD protection for high voltage applications
10/21/2008US7439591 Gate layer diode method and apparatus
10/21/2008US7439590 Semiconductor device
10/21/2008US7439589 Active matrix substrate and repairing method thereof
10/21/2008US7439587 Semiconductor device and method of manufacturing the same
10/21/2008US7439585 Silicon-on-insulator device
10/21/2008US7439575 Protection against in-process charging in silicon-oxide-nitride-oxide-silicon (SONOS) memories
10/21/2008US7439569 Semiconductor device manufacturing method and semiconductor device
10/21/2008US7439558 Method and system for controlled oxygen incorporation in compound semiconductor films for device performance enhancement
10/21/2008US7439538 Multi-purpose poly edge test structure
10/21/2008US7439531 Alignment systems and methods for lithographic systems
10/21/2008US7439475 Thermally conductive body and method of manufacturing the same
10/21/2008US7439452 Multi-chip module packaging with thermal expansion coefficiencies
10/21/2008US7439451 Tape carrier
10/21/2008US7439199 Capacitive element, method of manufacture of the same, and semiconductor device
10/21/2008US7439182 Semiconductor device and method of fabricating the same
10/21/2008US7439176 Semiconductor device multilayer structure, fabrication method for the same, semiconductor device having the same, and semiconductor device fabrication method
10/21/2008US7439167 Nonvolatile semiconductor memory and manufacturing method thereof
10/21/2008US7439160 Methods for producing a semiconductor entity
10/21/2008US7439146 Field plated resistor with enhanced routing area thereover
10/21/2008US7439102 Semiconductor fuse box and method for fabricating the same
10/21/2008US7439099 Thin ball grid array package
10/21/2008US7439097 Taped lead frames and methods of making and using the same in semiconductor packaging
10/21/2008US7439094 Method of manufacturing a semiconductor package
10/21/2008US7439083 Technique for compensating for substrate shrinkage during manufacture of an electronic assembly
10/21/2008US7438833 Organic species that facilitate charge transfer to or from nanostructures
10/21/2008US7438780 Manufacturing method for base piece made to adhere to adhesive sheet, manufacturing method for semiconductor wafer and manufacturing method for semiconductor device
10/21/2008US7438562 Universal-Serial-Bus (USB) flash-memory device with metal wrap formed over plastic housing
10/21/2008US7438448 Light set with heat dissipation means
10/21/2008US7437933 Micro-electro-mechanical structure having electrically insulated regions and manufacturing process thereof
10/16/2008WO2008124381A1 Polar hybrid grid array package
10/16/2008WO2008123488A1 Radiator for semiconductor device and method of producing the same
10/16/2008WO2008123481A1 Semiconductor device comprising circuit substrate with inspection connection pads and manufacturing method thereof
10/16/2008WO2008123414A1 Connection structure for flip-chip semiconductor package, buildup layer material, sealing resin composition and circuit board
10/16/2008WO2008123399A1 Three-dimensional structure semiconductor device
10/16/2008WO2008123233A1 Radiation-sensitive resin composition, active matrix substrate and method for producing the same
10/16/2008WO2008123172A1 Heat spreader module, heat sink and method for manufacturing the heat spreader module and the heat sink
10/16/2008WO2008123165A1 Functional element package and fabrication method therefor
10/16/2008WO2008123083A1 Semiconductor device and electric vehicle
10/16/2008WO2008123049A1 Method for film formation, resin composition for use in the method, structure having insulating film, process for producing the structure, and electronic component
10/16/2008WO2008123012A1 Method of manufacturing semiconductor chip
10/16/2008WO2008122959A2 Package, method of manufacturing a package and frame
10/16/2008WO2008122624A2 Method for producing an electric carrier wafer contact for a front-sided connection
10/16/2008WO2008122292A1 Diffusion-barrier coating for protection of moisture and oxygen sensitive devices
10/16/2008WO2008091987A3 Compression clamping of semiconductor components
10/16/2008WO2008057960A3 Preferentially deposited lubricant to prevent anti-stiction in micromechanical systems
10/16/2008WO2008036485A3 Heatsink attachment mechanism
10/16/2008WO2008013931A3 Bottom source ldmosfet structure and method
10/16/2008WO2008005327A3 Nanostructures and materials for photovoltaic devices
10/16/2008WO2007146310A3 Flash memory card
10/16/2008WO2007139730A3 Semiconductor input control device
10/16/2008WO2005084163A3 Method for creating flip-chip conductive polymer bumps using photolithography and polishing
10/16/2008US20080255283 Di- or polyester prepared from triglycidyl isocyanurate and an anhydride such as methylhexahydrophthalic anhydride, glyceride internal parting agent, reflective agent, inorganic filler, and a curing catalyst; encapsulated semiconductors
10/16/2008US20080254651 Spring interconnect structures
10/16/2008US20080254643 Structure to improve adhesion between top cvd low-k dielectric and dielectric capping layer
10/16/2008US20080254630 Device and methodology for reducing effective dielectric constant in semiconductor devices
10/16/2008US20080254614 Multilayered cap barrier in microelectronic interconnect structures
10/16/2008US20080254611 Interconnection designs and materials having improved strength and fatigue life
10/16/2008US20080254609 Apparatus and method for electronic fuse with improved esd tolerance
10/16/2008US20080254572 Vertical system integration
10/16/2008US20080254571 System in package (SIP) with dual laminate interposers
10/16/2008US20080254232 Cobalt nitride layers for copper interconnects and methods for forming them
10/16/2008US20080253054 Multi-Functional Energy Conditioner
10/16/2008US20080252331 Device for defeating reverse engineering of integrated circuits by optical means
10/16/2008US20080251951 Use of a dual tone resist to form photomasks and intermediate semiconductor device structures
10/16/2008US20080251950 Semiconductor device and processing method of the same
10/16/2008US20080251949 Molding apparatus, molded semiconductor package using multi-layered film, fabricating and molding method for fabricating the same
10/16/2008US20080251948 Chip package structure
10/16/2008US20080251947 Cof flexible printed wiring board and semiconductor device
10/16/2008US20080251946 Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus
10/16/2008US20080251945 Semiconductor package that has electronic component and its fabrication method
10/16/2008US20080251944 Semiconductor device
10/16/2008US20080251943 Flip chip with interposer, and methods of making same
10/16/2008US20080251942 Semiconductor Device and Manufacturing Method Thereof
10/16/2008US20080251941 Vertical system integration
10/16/2008US20080251940 Chip package
10/16/2008US20080251939 Chip stack package and method of fabricating the same
10/16/2008US20080251938 Semiconductor chip package and method of manufacture
10/16/2008US20080251937 Stackable semiconductor device and manufacturing method thereof
10/16/2008US20080251936 Semiconductor device
10/16/2008US20080251935 Low shrinkage polyester thermosetting resins
10/16/2008US20080251933 Metal interconnect structure
10/16/2008US20080251932 Method of forming through-silicon vias with stress buffer collars and resulting devices
10/16/2008US20080251931 Multi cap layer and manufacturing method thereof
10/16/2008US20080251930 Semiconductor device and dummy pattern arrangement method
10/16/2008US20080251929 Semiconductor Device and Semiconductor Device Manufacturing Method
10/16/2008US20080251928 Carbonization of metal caps
10/16/2008US20080251926 Method of Fabricating Organic Silicon Film, Semiconductor Device Including the Same, and Method of Fabricating the Semiconductor Device
10/16/2008US20080251925 Top layers of metal for integrated circuits
10/16/2008US20080251924 Post Passivation Interconnection Schemes On Top Of The IC Chips
10/16/2008US20080251923 Seal ring structures with reduced moisture-induced reliability degradation
10/16/2008US20080251922 Transitional Interface between metal and dielectric in interconnect structures
10/16/2008US20080251921 Structure for a Semiconductor Device and a Method of Manufacturing the Same
10/16/2008US20080251920 Dielectric film forming method
10/16/2008US20080251919 Ultra-low resistance interconnect
10/16/2008US20080251918 Wire Bonds Having Pressure-Absorbing Balls
10/16/2008US20080251917 Solder pad and method of making the same
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