| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/24/2008 | CN100421229C Method for manufacturing semiconductor device, semiconductor device and apparatus comprising same |
| 09/24/2008 | CN100421227C Manufacturing method of electronic part and wiring substrate |
| 09/24/2008 | CN100421174C Stacked layered type semiconductor memory device |
| 09/24/2008 | CN100420524C Droplet discharge method, electro optical device and electronic apparatus |
| 09/23/2008 | USRE40512 Acoustic convection apparatus |
| 09/23/2008 | US7428675 Testing using independently controllable voltage islands |
| 09/23/2008 | US7428154 Package structure, printed circuit board mounted with the same, electronic apparatus having the printed circuit board |
| 09/23/2008 | US7428152 Localized thermal management system |
| 09/23/2008 | US7428150 Computing platform component cooling with quick disconnect |
| 09/23/2008 | US7427822 Piezoelectric resonator element package, and piezoelectric resonator |
| 09/23/2008 | US7427813 Structure, material, and design for assembling a low-K Si die to achieve an industrial grade reliability wire bonding package |
| 09/23/2008 | US7427812 Semiconductor device with increased number of external connection electrodes |
| 09/23/2008 | US7427811 Semiconductor substrate |
| 09/23/2008 | US7427810 Semiconductor device including semiconductor element mounted on another semiconductor element |
| 09/23/2008 | US7427809 Repairable three-dimensional semiconductor subsystem |
| 09/23/2008 | US7427808 Micro-sensor |
| 09/23/2008 | US7427807 Chip heat dissipation structure and manufacturing method |
| 09/23/2008 | US7427806 Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component |
| 09/23/2008 | US7427803 Electromagnetic shielding using through-silicon vias |
| 09/23/2008 | US7427802 Irreversible reduction of the value of a polycrystalline silicon resistor |
| 09/23/2008 | US7427787 Guardringed SCR ESD protection |
| 09/23/2008 | US7427784 COB-typed LED package with phosphor |
| 09/23/2008 | US7427774 Targets for measurements in semiconductor devices |
| 09/23/2008 | US7427716 Microvia structure and fabrication |
| 09/23/2008 | US7427568 Method of forming an interconnect structure |
| 09/23/2008 | US7427563 Dielectric barrier films for use as copper barrier layers in semiconductor trench and via structures |
| 09/23/2008 | US7427560 Top layers of metal for high performance IC's |
| 09/23/2008 | US7427557 Methods of forming bumps using barrier layers as etch masks |
| 09/23/2008 | US7427551 High tolerance TCR balanced high current resistor for RF CMOS and RF SiGe BiCMOS applications and cadenced based hierarchical parameterized cell design kit with tunable TCR and ESD resistor ballasting feature |
| 09/23/2008 | US7427535 Semiconductor/printed circuit board assembly, and computer system |
| 09/23/2008 | US7427532 Method of manufacturing a device having a contacting structure |
| 09/23/2008 | US7427443 Low dielectric constant insulating material and semiconductor device using the material |
| 09/23/2008 | US7427423 potential plane element thus performs the functions of a solder mask to prevent solder from forming short circuits between adjacent pads, and may also act as a ground plane, power plane or shielding element |
| 09/23/2008 | US7427031 Semiconductor memory device |
| 09/18/2008 | WO2008112825A1 System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices |
| 09/18/2008 | WO2008112725A1 A method of making reliable wafer level chip scale package semiconductor devices |
| 09/18/2008 | WO2008112463A1 Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces |
| 09/18/2008 | WO2008112082A1 Integrated passive cap in a system-in-package |
| 09/18/2008 | WO2008111977A1 Method of teaching eyepoints for wire bonding and related semiconductor processing operations |
| 09/18/2008 | WO2008111914A1 An integrated circuit structure and a method of forming the same |
| 09/18/2008 | WO2008111640A1 Oxethane resin composition |
| 09/18/2008 | WO2008111408A1 Multilayer wiring board and method for manufacturing the same |
| 09/18/2008 | WO2008111393A1 Resin composition comprising empty silicone fine particles and organic polymer, and interlayer insulating film |
| 09/18/2008 | WO2008111391A1 High frequency package |
| 09/18/2008 | WO2008111345A1 Electronic device, and electronic device manufacturing method |
| 09/18/2008 | WO2008111305A1 Method for manufacturing semiconductor device, optical pickup module and semiconductor device |
| 09/18/2008 | WO2008111304A1 Method for manufacturing semiconductor device, semiconductor device and optical pickup module |
| 09/18/2008 | WO2008111303A1 Semiconductor device, its manufacturing method and optical pickup module |
| 09/18/2008 | WO2008111302A1 Semiconductor device, its manufacturing method and optical pickup module |
| 09/18/2008 | WO2008111205A1 Process for producing semiconductor device, wafer and wafer cleaning apparatus |
| 09/18/2008 | WO2008110511A1 Integrated circuit housing particularly for an image sensor and positioning method |
| 09/18/2008 | WO2008110412A1 Method for producing artificial defects in semiconductor surfaces |
| 09/18/2008 | WO2008091221A3 Micropackaging method and devices |
| 09/18/2008 | WO2008085559A9 Integrated circuit micro-cooler having tubes of a cnt array in essentially the same height over a surface |
| 09/18/2008 | WO2008060447A3 Microcircuit package having ductile layer |
| 09/18/2008 | WO2007089366A3 Warpage-reducing packaging design |
| 09/18/2008 | US20080228419 Process condition sensing wafer and data analysis system |
| 09/18/2008 | US20080227902 comprising epoxy and cyanate ester resins, flexibilizers comprises bis(2,3-epoxy-2-methylpropyl)ether, a polyphenylene ether and silicon carbide fillers, having a higher fracture toughness, low viscosity and freeze resistance, used in electronic packages |
| 09/18/2008 | US20080227289 Method of Fabricating Integrated Circuitry |
| 09/18/2008 | US20080227285 Wirebond structure and method to connect to a microelectronic die |
| 09/18/2008 | US20080227245 Thin film transistor array panel and a method for manufacturing the same |
| 09/18/2008 | US20080227238 Integrated circuit package system employing multi-package module techniques |
| 09/18/2008 | US20080227237 Method of assembling chips |
| 09/18/2008 | US20080226896 Nanoparticles with covalently bonded stabilizer |
| 09/18/2008 | US20080226877 Method for mounting a semiconductor package onto PCB |
| 09/18/2008 | US20080226815 Novel thin laminate as embedded capacitance material in printed circuit boards |
| 09/18/2008 | US20080225485 Distributed transmit/receive integrated microwave module chip level cooling system |
| 09/18/2008 | US20080225185 Video Processor Alignment Clamping |
| 09/18/2008 | US20080224605 White organic light emitting device including color control layer |
| 09/18/2008 | US20080224334 Molded Beam for Optoelectronic Sensor Chip Substrate |
| 09/18/2008 | US20080224333 Semiconductor device and method of manufacturing the same |
| 09/18/2008 | US20080224330 Power delivery package having through wafer vias |
| 09/18/2008 | US20080224329 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices |
| 09/18/2008 | US20080224328 Temporary chip attach using injection molded solder |
| 09/18/2008 | US20080224327 Microelectronic substrate including bumping sites with nanostructures |
| 09/18/2008 | US20080224326 Chip structure with bumps and testing pads |
| 09/18/2008 | US20080224325 Wiring board, mounting structure for electronic components, and semiconductor device |
| 09/18/2008 | US20080224324 Semiconductor device and method of manufacturing the same |
| 09/18/2008 | US20080224323 Semiconductor Module With Semiconductor Chips And Method For Producing It |
| 09/18/2008 | US20080224322 Semiconductor device and manufacturing method thereof |
| 09/18/2008 | US20080224321 Cell data for spare cell, method of designing a semiconductor integrated circuit, and semiconductor integrated circuit |
| 09/18/2008 | US20080224320 Silicon chip having inclined contact pads and electronic module comprising such a chip |
| 09/18/2008 | US20080224319 Micro electro-mechanical system and method of manufacturing the same |
| 09/18/2008 | US20080224318 System and method for integrated circuit arrangement having a plurality of conductive structure levels |
| 09/18/2008 | US20080224317 Stable silicide films and methods for making the same |
| 09/18/2008 | US20080224316 Electronic device and method for producing electronic devices |
| 09/18/2008 | US20080224315 Semiconductor device and manufacturing method thereof |
| 09/18/2008 | US20080224314 Method and Apparatus for Forming a Noble Metal Layer, Notably on Inlaid Metal Features |
| 09/18/2008 | US20080224313 Method for forming a seed layer for damascene copper wiring, and semiconductor wafer with damascene copper wiring formed using the method |
| 09/18/2008 | US20080224312 Device having a bonding structure for two elements |
| 09/18/2008 | US20080224311 Semiconductor device |
| 09/18/2008 | US20080224310 Method for manufacturing semiconductor device and semiconductor device |
| 09/18/2008 | US20080224309 Semiconductor device mounted on substrate, and manufacturing method thereof |
| 09/18/2008 | US20080224308 Semiconductor package and fabricating method thereof |
| 09/18/2008 | US20080224307 Semiconductor die with mask programmable interface selection |
| 09/18/2008 | US20080224306 Multi-chips package and method of forming the same |
| 09/18/2008 | US20080224305 Method, apparatus, and system for phase change memory packaging |
| 09/18/2008 | US20080224304 Physical quantity sensor and semiconductor device having package and cover |
| 09/18/2008 | US20080224303 Power Semiconductor Module |
| 09/18/2008 | US20080224302 Semiconductor Module |