Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2008
10/15/2008CN201133609Y LED streamer light
10/15/2008CN101288351A Printed wiring board and method for manufacturing printed wiring board
10/15/2008CN101288350A Multilayered printed circuit board and method for manufacturing the same
10/15/2008CN101288168A 印刷线路板 Printed circuit boards
10/15/2008CN101288167A Chip-scale package
10/15/2008CN101287350A Heat sink
10/15/2008CN101287349A Heat radiating device
10/15/2008CN101287348A Heat sink assembly
10/15/2008CN101287347A Heat pipe radiating device
10/15/2008CN101286542A LED apparatus
10/15/2008CN101286525A Electro-optical device and electronic instrument
10/15/2008CN101286521A Encapsulation structure for image sensor
10/15/2008CN101286520A 影像感测晶片封装结构及其封装方法 Image sensing chip package and packaging method
10/15/2008CN101286516A Active matrix subtrate, liquid crystal display panel and method of manufacturing the same
10/15/2008CN101286514A Nonvolatile memory element, and manufacturing method of the same
10/15/2008CN101286512A Semiconductor device
10/15/2008CN101286509A Electrostatic protection circuit
10/15/2008CN101286508A High-power LED encapsulation structure
10/15/2008CN101286507A Semiconductor apparatus and mobile apparatus
10/15/2008CN101286506A Multi-chip encapsulation structure having single chip support base
10/15/2008CN101286505A Semi-conductor encapsulation structure having an antenna
10/15/2008CN101286504A Light-emitting device with power supply structure
10/15/2008CN101286503A Semiconductor device package having multi-chips with side-by-side configuration and method of the same
10/15/2008CN101286502A Semiconductor encapsulation structure
10/15/2008CN101286501A Electron Image sensor and image pickup device applying image sensor
10/15/2008CN101286500A Semiconductor module and mobile apparatus
10/15/2008CN101286499A Electronic packing structure and method
10/15/2008CN101286498A Semiconductor structure and semiconductor wafer
10/15/2008CN101286497A Chip packaging structure and manufacture process thereof
10/15/2008CN101286496A Electrically conductive barrier material for copper wiring and preparing method thereof
10/15/2008CN101286495A Semiconductor element and internal connector for semiconductor
10/15/2008CN101286494A Semiconductor structure and its manufacture method
10/15/2008CN101286493A Integrated circuit chip and power line structure thereof
10/15/2008CN101286492A 半导体封装及层叠型半导体封装 The semiconductor package and the laminated semiconductor package
10/15/2008CN101286491A Semiconductor device and its manufacture method
10/15/2008CN101286490A Substrate surface processing structure and method for production thereof
10/15/2008CN101286489A Lead frame, molding die, and molding method
10/15/2008CN101286488A Leadframe and flip chip type semiconductor package using leadframe as chip supporter
10/15/2008CN101286487A Semiconductor device, led head and image forming apparatus
10/15/2008CN101286486A Radiating unit and semiconductor package having the same
10/15/2008CN101286485A Semi-conductor module
10/15/2008CN101286484A Semiconductor device and fabrication method
10/15/2008CN101286483A 半导体芯片及集成电路结构 The semiconductor chip and integrated circuit structure
10/15/2008CN101286482A Pixel structure and transistor therein and method for making the same
10/15/2008CN101286480A Structures for and method of silicide formation on memory array and peripheral logic devices
10/15/2008CN101286472A Metallic conducting wire structure with improved transmission performance and manufacturing method therefor
10/15/2008CN101286463A Semiconductor device and manufacturing method thereof
10/15/2008CN101286460A Integrated circuit package system with heat sink spacer structures
10/15/2008CN101286459A Stacktable semiconductor apparatus and manufacturing method
10/15/2008CN101286457A Wiring board and method of manufacturing the same
10/15/2008CN101286456A Wiring board manufacturing method, semiconductor device manufacturing method and wiring board
10/15/2008CN101286455A Manufacturing method for heat radiating base of surface adhesive diode support and construction thereof
10/15/2008CN100426639C High-tension integral gate change transistor three-level frequency-converter power cabinet
10/15/2008CN100426590C Electronic part and surface treatment method of the same
10/15/2008CN100426540C Optical semiconductor module and semiconductor device including the same
10/15/2008CN100426536C Semiconductor package
10/15/2008CN100426523C In-line inserted semiconductor device
10/15/2008CN100426522C Negative electrode branching semiconductor device
10/15/2008CN100426511C Baseplate structure of thin film transistor device array, and preparation method
10/15/2008CN100426507C Chip of overvoltage protector of semiconductor in low capacitance
10/15/2008CN100426504C Single grid double tunnel pixel
10/15/2008CN100426502C Method for forming semiconductor device and its structure
10/15/2008CN100426501C Power supply bus static discharge protection device and process
10/15/2008CN100426500C Multilayer inner-dielectric-ayer of semiconductor component and manufacture method of the same
10/15/2008CN100426499C An electronic assembly and circuit board for same
10/15/2008CN100426498C Substrate of display device for packaging driving integrated circuit
10/15/2008CN100426497C Semiconductor device and manufacturing process therefor
10/15/2008CN100426496C Semiconductor device and method for manufacturing the same
10/15/2008CN100426495C Electronic device and producing method thereof
10/15/2008CN100426494C Heat radiator of heat pipe
10/15/2008CN100426493C Boiling cavity type radiator
10/15/2008CN100426492C Direct build-up layer on encapsulated die package
10/15/2008CN100426491C Package substrate
10/15/2008CN100426489C Semiconductor device and method of manufacturing thereof
10/15/2008CN100426481C Semiconductor device and method of manufacturing the device
10/15/2008CN100426478C Three-dimensional interconnection interpolator applied in system packaging and its producing method
10/15/2008CN100426477C Method for manufacturing carrying-plate for packaging flat plastic-sealed ball grid array and its carrying plate
10/15/2008CN100426476C Planar magnetic tunnel junction substrate having recessed alignment marks
10/15/2008CN100426189C Radiating apparatus
10/15/2008CN100426134C Light source device, method for manufacturing light source device, and projection type display apparatus
10/15/2008CN100426032C Optoelectronic flip-chip package with optical waveguide accomodated in upper layers of substrate board
10/15/2008CN100425650C Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device
10/14/2008US7437260 Concept of compensating for piezo influences on integrated circuitry
10/14/2008US7437252 Configurable voltage regulator
10/14/2008US7437207 Method and apparatus for automatically processing multiple applications in a predetermined order to affect multi-application sequencing
10/14/2008US7436673 Heat sink fixing assembly
10/14/2008US7436669 3D multi-layer heat conduction diffusion plate
10/14/2008US7436664 Electronic appliance
10/14/2008US7436640 Booster power management integrated circuit chip with ESD protection between output pads thereof
10/14/2008US7436513 Wafer pre-alignment apparatus and method
10/14/2008US7436199 Stack-type semiconductor package sockets and stack-type semiconductor package test systems
10/14/2008US7436078 Line layout structure of semiconductor memory device
10/14/2008US7436077 Semiconductor device and method of manufacturing the same
10/14/2008US7436076 Micromechanical component having an anodically bonded cap and a manufacturing method
10/14/2008US7436074 Chip package without core and stacked chip package structure thereof
10/14/2008US7436073 Junction structure for a terminal pad and solder, and semiconductor device having the same
10/14/2008US7436072 Protected chip stack
10/14/2008US7436071 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
10/14/2008US7436070 Semiconductor device
10/14/2008US7436069 Semiconductor device, having a through electrode semiconductor module employing thereof and method for manufacturing semiconductor device having a through electrode
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