Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2008
10/30/2008US20080265294 Semiconductor device manufacturing method including forming a metal silicide layer on an indium-containing layer
10/30/2008US20080265284 Semiconductor device
10/30/2008US20080265271 Light-emitting element package and light source apparatus using the same
10/30/2008US20080265252 Semiconductor device
10/30/2008US20080265251 Structure and method for determining a defect in integrated circuit manufacturing process
10/30/2008US20080265250 Active device array substrate
10/30/2008US20080265249 Stacked semiconductor device assembly and package
10/30/2008US20080265248 Leadframe Configuration to Enable Strip Testing of SOT-23 Packages and the Like
10/30/2008US20080265247 Unified test structure for stress migration tests
10/30/2008US20080265173 Microfabricated miniature grids
10/30/2008DE202008011121U1 Mikroelektronischer Verbinder Microelectronic connector
10/30/2008DE202008011119U1 Elastischer mikroelektronischer Verbinder Elastic microelectronic connectors
10/30/2008DE202008011118U1 Doppelendiger mikroelektronischer Verbinder Double Terminated microelectronic connectors
10/30/2008DE202008011116U1 Doppelendiger elastischer mikroelektronischer Verbinder Double Terminated elastic microelectronic connectors
10/30/2008DE202008009218U1 Wärmeübertragungsplatte in Art eines Kühlmoduls Heat transfer plate in the manner of a cooling module
10/30/2008DE202006020507U1 Umhülltes Bauelement An enclosed device
10/30/2008DE19937284B4 Elektrisch leitender Mehrschichtaufbau Electrically conductive multilayer structure
10/30/2008DE112007000175T5 Feldeffekttransistor Field-effect transistor
10/30/2008DE112006003372T5 Vorrichtung und Verfahren zur Montage eines oben und unten freiliegenden eingehausten Halbleiters Apparatus and method for mounting a top and bottom exposed is housed semiconductor
10/30/2008DE10317748B4 Verfahren zur Überprüfung von Isoliergrabenätzungen in SOI-Scheiben mittels einer Teststruktur Proceedings for review of Isoliergrabenätzungen in SOI wafers by means of a test structure
10/30/2008DE10297264B4 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation
10/30/2008DE102008019599A1 Verfahren zur Herstellung eines Bauelementes durch lokales Erwärmen einer oder mehrerer Metallisierungsschichten und mittels selektiven Ätzens A method for producing a component by locally heating one or more metal layers and by means of selective etching
10/30/2008DE102008019129A1 Bildsensor Image sensor
10/30/2008DE102008011187A1 Textile Halbleiter-Baugruppe und Verfahren zur Montage und zur Fertigung der Baugruppe Textile semiconductor assembly and method of assembling and manufacturing of the assembly
10/30/2008DE102008001230A1 Kühldose für Bauelemente oder Schaltungen Cooling box for devices and circuits
10/30/2008DE102008001224A1 Verfahren zur Herstellung eines metallisierten Bauteils, Bauteil sowie einen Träger zur Auflage des Bauteils bei der Metallisierung A method for producing a metallized component, component and a carrier for supporting the component in the metallization
10/30/2008DE102007040406A1 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation
10/30/2008DE102007023058A1 Cooling plate system has cooling plate with coolant channel, which is composed of multiple high-grade steel pipe and cooling plate is made of aluminum casting
10/30/2008DE102007020618B3 Verfahren zum Herstellen eines festen Leistungsmoduls und damit hergestelltes Transistormodul A method for producing a solid power module and thus produced transistor module
10/30/2008DE102007019552A1 Substrat mit Durchführung und Verfahren zur Herstellung desselben Of the same substrate with implementation and method for producing
10/30/2008DE102007017831A1 Semiconductor module, has carrier arranged on semiconductor chip such that one main surface of semiconductor chip faces carrier, where insulating layer and wiring layer covers another main surface of semiconductor chip and carrier
10/30/2008DE102007017546A1 Multichipmodul Multi-chip module
10/30/2008DE102007016901A1 Semiconductor component i.e. direct current-direct current converter, for use in electronic module, has power semiconductor chips applied on respective carriers that are arranged such that extensions point in different directions
10/30/2008DE102006041515B4 Verfahren zur Herstellung von ein- oder mehrwandigen, mit einem oder mehreren Übergangsmetallen beschichteten Kohlenstoff-Nanoröhren Process for the preparation of single- or multi-walled coated with one or more transition metals, carbon nanotubes
10/30/2008DE10103193B4 Verfahren zur Herstellung von Leiterbahnstrukturen A process for the production of conductor track structures
10/30/2008DE10019840B4 Mehrschichtkondensator, dessen Verwendung als Entkopplungskondensator und eine Verdrahtungsplatine mit dem Mehrschichtkondensator A multilayer capacitor, its use as a decoupling capacitor and a wiring board having the multilayer capacitor
10/30/2008CA2587225A1 A household media center/home automation unit
10/29/2008EP1986482A1 Additional device for electrically heating an air flow included in a ventilation, heating and/or air-conditioning installation of an automobile vehicle
10/29/2008EP1986244A2 Mounting structure
10/29/2008EP1986239A2 Method for producing a matrix for detecting electromagnetic radiation and, in particular, infrared radiation.
10/29/2008EP1986237A2 Method for creating a layout, use of a transistor layout, and semiconductor circuit
10/29/2008EP1986234A2 Power semiconductor module for inverter circuit system
10/29/2008EP1986232A2 Semiconductor device and method of manufacturing the same
10/29/2008EP1986231A1 Metallized ceramic board incorporating lead and package
10/29/2008EP1986048A1 Ultra thin image sensing chip package
10/29/2008EP1985718A1 Cr-Cu ALLOY, PROCESS FOR PRODUCING THE SAME, HEAT SINK FOR SEMICONDUCTOR, AND HEAT DISSIPATING COMPONENT FOR SEMICONDUCTOR
10/29/2008EP1985691A1 Heat dissipating silicone grease compositions
10/29/2008EP1984950A1 Component with integrated heating element and method for heating a semiconductor body
10/29/2008EP1984949A2 A sip module with a single sided lid
10/29/2008EP1984944A1 Method for making a neo-layer comprising embedded discrete components
10/29/2008EP1984939A1 Semiconductor device and method of manufacturing thereof
10/29/2008EP1984871A2 Circuit arrangement, data processing device comprising such circuit arrangement as well as method for identifying an attack on such circuit arrangement
10/29/2008EP1984699A2 Surface acoustic wave packages and methods of forming same
10/29/2008EP1649412B1 Chip card, chip card module and method for the production of a chip card module
10/29/2008EP1418617B1 Semiconductor device and method of manufacturing the same
10/29/2008EP1277278A4 Isolating energy conditioning shield assembly
10/29/2008EP1264377A4 Passive electrostatic shielding structure for electrical circuitry and energy conditioning with outer partial-shielded energy pathways
10/29/2008EP1240667B1 Integrated circuit package
10/29/2008EP1200992B1 Resilient interconnect structure for electronic components and method for making the same
10/29/2008CN201142813Y Heat pipe side direction extending heat radiating device
10/29/2008CN201142812Y Water cooled heat radiating device
10/29/2008CN201142811Y Water-cooled heat radiating device for cooling heavily hot electronic element
10/29/2008CN201142810Y Water cooled heat radiating device
10/29/2008CN201142806Y Radiation fin mechanism
10/29/2008CN201142334Y Chip bearing seat structure
10/29/2008CN201142333Y LED adopting alloy for die bonding
10/29/2008CN201142332Y LED apparatus
10/29/2008CN201142331Y Packaging structure of light emitting diode
10/29/2008CN201142329Y Plastic package type commutation module
10/29/2008CN201142328Y Chip module
10/29/2008CN201142327Y Rear panel structure
10/29/2008CN201142326Y Plastic package type cooling insulation commutation bridge
10/29/2008CN201142325Y Full-compression joint fast-cooling type ceramic casing base
10/29/2008CN201142324Y Novel ceramic casing of gatepole shut-off thyristor
10/29/2008CN201142045Y Heat conduction block for computer
10/29/2008CN201141578Y Heat conduction structure and heat radiating device of LED lamp
10/29/2008CN201141577Y Cooling structure of LED
10/29/2008CN201141576Y LED energy-conserving lamp
10/29/2008CN201141575Y LED daylight lamp
10/29/2008CN201141574Y LED daylight lamp
10/29/2008CN201141568Y Integration aluminum substrates for LED
10/29/2008CN201141548Y Diode illumination device
10/29/2008CN201141533Y High-power LED road lamp
10/29/2008CN201141526Y Novel LED daylight lamp
10/29/2008CN101297606A Lighting structure comprising at least one light-emitting diode, method for making same and uses thereof
10/29/2008CN101297403A Method for cutting solid-state image pickup device
10/29/2008CN101297401A Cooling structure of electric device
10/29/2008CN101297400A Cooling structure of electric device
10/29/2008CN101297066A Copper based composite base material for electronic part, electronic part and process for producing copper based composite base material for electronic part
10/29/2008CN101296603A Heat radiator and electronic apparatus
10/29/2008CN101296602A Recirculated water-cooling and air-cooling heat radiating device
10/29/2008CN101296601A Heat radiating device
10/29/2008CN101296600A Radiating assembly and electronic device using the same
10/29/2008CN101296597A Heat radiating device
10/29/2008CN101296596A Heat radiating device
10/29/2008CN101295854A Optoelectronic element encapsulation structure with temperature compensation
10/29/2008CN101295759A Power type LED encapsulation base plate
10/29/2008CN101295754A Flip-chip soldering encapsulation structure and method for light emitting diode
10/29/2008CN101295726A Image sensor and method of manufacturing the same
10/29/2008CN101295723A Thin image sensing chip encapsulation
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