Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2008
10/28/2008US7443035 Method of forming a penetration electrode and substrate having a penetration electrode
10/28/2008US7443034 Post passivation interconnection schemes on top of the IC chips
10/28/2008US7443033 Post passivation interconnection schemes on top of the IC chips
10/28/2008US7443031 Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation
10/28/2008US7443029 Adhesion of copper and etch stop layer for copper alloy
10/28/2008US7443028 Imaging module and method for forming the same
10/28/2008US7443027 Electronic device having coalesced metal nanoparticles
10/28/2008US7443026 IC chip package having force-adjustable member between stiffener and printed circuit board
10/28/2008US7443025 Thermally improved placement of power-dissipating components onto a circuit board
10/28/2008US7443024 Micro-electro-mechanical system (MEMS) package having side double-sealing member and method of manufacturing the same
10/28/2008US7443023 High capacity thin module system
10/28/2008US7443022 Board-on-chip packages
10/28/2008US7443021 Electronic component packaging structure and method for producing the same
10/28/2008US7443020 Minimizing number of masks to be changed when changing existing connectivity in an integrated circuit
10/28/2008US7443018 Integrated circuit package system including ribbon bond interconnect
10/28/2008US7443017 Package having bond-sealed underbump
10/28/2008US7443016 Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant
10/28/2008US7443014 Electronic module and method of assembling the same
10/28/2008US7443013 Flexible substrate for package of die
10/28/2008US7443012 Semiconductor device
10/28/2008US7443011 System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices
10/28/2008US7443010 Matrix form semiconductor package substrate having an electrode of serpentine shape
10/28/2008US7443007 Trench isolation structure having an implanted buffer layer
10/28/2008US7442978 Semiconductor memory device including multi-layer gate structure
10/28/2008US7442969 Top layers of metal for high performance IC's
10/28/2008US7442968 Chip on film (COF) package having test pad for testing electrical function of chip and method for manufacturing same
10/28/2008US7442959 Semiconductor device having identification number, manufacturing method thereof and electronic device
10/28/2008US7442756 Polymer for sealing porous materials during chip production
10/28/2008US7442729 Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt
10/28/2008US7442656 Method and apparatus for forming silicon oxide film
10/28/2008US7442643 Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials
10/28/2008US7442641 Integrated ball and via package and formation process
10/28/2008US7442626 Rectangular contact used as a low voltage fuse element
10/28/2008US7442619 Method of forming substantially L-shaped silicide contact for a semiconductor device
10/28/2008US7442593 Method of manufacturing semiconductor device having conductive thin films
10/28/2008US7442582 Method for producing a chip-substrate connection
10/28/2008US7442578 Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling micoelectronic devices
10/28/2008US7442324 Etching reagent, and method for manufacturing electronic device substrate and electronic device
10/28/2008CA2488257C Connecting a solenoid to a lead frame
10/23/2008WO2008127985A1 Flip chip with interposer, and methods of making same
10/23/2008WO2008127313A2 Electrically conducting and optically transparent nanowire networks
10/23/2008WO2008127267A1 Package-on-package secure module having bga mesh cap
10/23/2008WO2008127219A1 Hybrid solder pad
10/23/2008WO2008126926A1 Exposure method and electronic device manufacturing method
10/23/2008WO2008126925A1 Exposure apparatus, exposure method, and electronic device manufacturing method
10/23/2008WO2008126914A1 Electrode structure and semiconductor device
10/23/2008WO2008126829A1 Highly thermally conductive compound
10/23/2008WO2008126776A1 Fabrication method of a semiconductor device and a semiconductor device
10/23/2008WO2008126738A1 Interposer
10/23/2008WO2008126564A1 Radiating member, circuit board using the member, electronic part module, and method for manufacturing the module
10/23/2008WO2008126468A1 Semiconductor device and method for manufacturing semiconductor device
10/23/2008WO2008126448A1 Heat transfer sheet and radiator structure
10/23/2008WO2008126447A1 Wiring structure of electronic apparatus and method for manufacturing electronic apparatus package
10/23/2008WO2008126268A1 Semiconductor device
10/23/2008WO2008126206A1 Process for producing semiconductor device
10/23/2008WO2008126043A1 Method for manufacturing an element having electrically conductive members for application in a microelectronic package
10/23/2008WO2008125440A1 Electrical interconnect structure and method of forming the same
10/23/2008WO2008125010A1 A method of manufacturing the high heat conductive circuit substrate
10/23/2008WO2008125009A1 A high heat conductive circuit substrate
10/23/2008WO2008124926A1 Semiconductor light engine using polymer light pipes and lighting systems constructed with the light engine
10/23/2008WO2008021860A3 Process for precision placement of integrated circuit overcoat material
10/23/2008WO2007130643A9 Die-on-leadframe (dol) with high voltage isolation
10/23/2008WO2006009781A3 Dynamic p-n junction growth
10/23/2008US20080262329 Analyte Monitoring Device and Methods of Use
10/23/2008US20080261511 Wireless local loop antenna
10/23/2008US20080261395 Semiconductor Device, Method for Manufacturing Semiconductor Devices and Mask Systems Used in the Manufacturing of Semiconductor Devices
10/23/2008US20080261380 Semiconductor Layer Structure And Method Of Making The Same
10/23/2008US20080261352 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
10/23/2008US20080261338 Method For Manufacturing an Electronics Module Comprising a Component Electrically Connected to a Conductor-Pattern Layer
10/23/2008US20080261336 Semiconductor device and manufacturing method thereof
10/23/2008US20080261155 Metallic Air-Bridges
10/23/2008US20080261071 Depositing a metal layer of nickel and phosphorus onto a metal surface, depositing the tin-based coating over the first metal; establishing a diffusion couple
10/23/2008US20080261039 Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device
10/23/2008US20080260982 Sheet to Form a Protective Shield for Chips
10/23/2008US20080260498 Atmosphere Purge-Port Connecting Device for Wafer Storage Container
10/23/2008US20080260050 On chip transformer isolator
10/23/2008US20080259558 Heat-Receiving Apparatus and Electronic Equipment
10/23/2008US20080258318 Semiconductor device
10/23/2008US20080258317 Semiconductor device
10/23/2008US20080258316 Power Semiconductor Module
10/23/2008US20080258315 Semiconductor device and production method of the same semiconductor device
10/23/2008US20080258314 Fabric type semiconductor device package and methods of installing and manufacturing same
10/23/2008US20080258313 Connecting microsized devices using ablative films
10/23/2008US20080258312 Semiconductor device
10/23/2008US20080258311 Semiconductor device and method of manufacturing the same
10/23/2008US20080258310 Semiconductor device having a tapered plug
10/23/2008US20080258309 Three-dimensional semiconductor device
10/23/2008US20080258307 Integration type semiconductor device and method for manufacturing the same
10/23/2008US20080258306 Semiconductor Device and Method for Fabricating the Same
10/23/2008US20080258305 Low fabrication cost, fine pitch and high reliability solder bump
10/23/2008US20080258304 Semiconductor device having multiple wiring layers
10/23/2008US20080258303 Novel structure for reducing low-k dielectric damage and improving copper EM performance
10/23/2008US20080258302 Methods of forming a denuded zone in a semiconductor wafer using rapid laser annealing
10/23/2008US20080258301 Semiconductor device and manufacturing method of the same
10/23/2008US20080258300 Wiring board manufacturing method, semiconductor device manufacturing method and wiring board
10/23/2008US20080258299 Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device
10/23/2008US20080258298 Semiconductor devices and methods of fabricating the same
10/23/2008US20080258297 Method of making solder pad
10/23/2008US20080258296 Cut-Out Heat Slug for Integrated Circuit Device Packaging
10/23/2008US20080258295 Self-Contained Cooling Mechanism for Integrated Circuit Using a Reversible Endothermic Chemical Reaction
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