Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2008
10/09/2008US20080246141 Semiconductor device
10/09/2008US20080246140 Semiconductor device
10/09/2008US20080246139 Polar hybrid grid array package
10/09/2008US20080246138 Packed System of Semiconductor Chips Having a Semiconductor Interposer
10/09/2008US20080246137 Integrated circuit device and method for the production thereof
10/09/2008US20080246136 Chips having rear contacts connected by through vias to front contacts
10/09/2008US20080246135 Stacked package module
10/09/2008US20080246134 Package-Borne Selective Enablement Stacking
10/09/2008US20080246133 Flip-chip image sensor packages and methods of fabricating the same
10/09/2008US20080246132 Semiconductor device and method of manufacturing semiconductor device
10/09/2008US20080246131 Chip package structure
10/09/2008US20080246130 Semiconductor Package Structure Having Enhanced Thermal Dissipation Characteristics
10/09/2008US20080246129 Method of manufacturing semiconductor device and semiconductor device
10/09/2008US20080246128 Bent lead transistor
10/09/2008US20080246127 Arrangement for high frequency application
10/09/2008US20080246126 Stacked and shielded die packages with interconnects
10/09/2008US20080246125 Semiconductor device and method for manufacturing semiconductor device
10/09/2008US20080246124 Plasma treatment of insulating material
10/09/2008US20080246123 Methods for controlling catalyst nanoparticle positioning and apparatus for growing a nanowire
10/09/2008US20080246112 Semiconductor structure including laminated isolation region
10/09/2008US20080246110 Structure for spanning gap in body-bias voltage routing structure
10/09/2008US20080246108 Semiconductor device including power switch and power reinforcement cell
10/09/2008US20080246105 Detector System and Detector Subassembly
10/09/2008US20080246098 Split-channel antifuse array architecture
10/09/2008US20080246039 Method for producing a semiconductor integrated circuit including a thin film transistor and a capacitor
10/09/2008US20080246031 PCM pad design for peeling prevention
10/09/2008US20080246030 Test structures and methods for inspection of semiconductor integrated circuits
10/09/2008US20080245846 Electrical contactors; variations in melting point; heating
10/09/2008US20080245470 System and method for improved auto-boating
10/09/2008US20080245467 Low loss glass-ceramic materials, method of making same and electronic packages including same
10/09/2008DE202007004094U1 Transformator mit Schutzkühlsystem Transformer with protective cooling system
10/09/2008DE102007016061A1 Modul mit Halbleiterchip Module with semiconductor chip
10/09/2008DE102007015893A1 Opto-electronic arrangement, has radiation emitting component with radiation emission side and lower side that is opposite to radiation emission side, and heat conductive strip connecting radiation emission side and housing
10/08/2008EP1978560A1 Interconnection substrate, its manufacture and manufacture of a semiconductor device comprising an integrated circuit chip
10/08/2008EP1978559A2 Semiconductor device
10/08/2008EP1978558A1 Substrate and method for manufacturing the same
10/08/2008EP1978557A2 Semiconductor module in pressure contact design and method for production of the same
10/08/2008EP1978556A1 Printed-circuit board, and method for manufacturing the same
10/08/2008EP1978555A1 Microelectronic machine and method for manufacturing same
10/08/2008EP1978551A1 Substrate for thin chip packagings
10/08/2008EP1978549A1 Wiring structure and electronic device designed according to electronic pulsation and particle durability
10/08/2008EP1978544A1 Production of three-dimensional MIM capacitors in the last metal level of an integrated circuit
10/08/2008EP1978473A2 Manufacturing method for a wireless communication device and manufacturing apparatus
10/08/2008EP1977636A2 Microchannel heat sink manufactured from graphite materials
10/08/2008EP1977476A2 Attachment of deep drawn resonator shell
10/08/2008EP1874870B1 Curable silicone composition and electronic components
10/08/2008EP1589582B1 Wiring substrate and radiation detector using same
10/08/2008EP1415378A4 Voltage limiting protection for high frequency power device
10/08/2008EP1250713B1 System and method for contacting switching circuits
10/08/2008EP1028463B1 Method for manufacturing a module with a flexible package having a very thin semiconductor chip
10/08/2008CN201131113Y High-performance heat conducting device
10/08/2008CN201131112Y Radiating module with triangle heat tube
10/08/2008CN201131109Y 散热器 Heat sink
10/08/2008CN201131108Y Cooling device
10/08/2008CN201131107Y 散热器 Heat sink
10/08/2008CN201131106Y Ion type heat-chasing catalyst structure
10/08/2008CN201131083Y Circuit board moistureproof anti-dust device having components
10/08/2008CN201130926Y Ceramic packing piece for SMD crystal resonator
10/08/2008CN201130672Y High power LED
10/08/2008CN201130664Y Omnidirectional LED
10/08/2008CN201130663Y Integrated circuit linking structure
10/08/2008CN201130662Y Semiconductor device radiator
10/08/2008CN201129702Y Novel LED module group box body apparatus
10/08/2008CN201129701Y Lamp fitting heat radiation structure
10/08/2008CN201129700Y Open type multi-layer duplex heat radiation LED lamp
10/08/2008CN201129699Y Collective light beam orienting LED projector
10/08/2008CN201129698Y LED unit with heat radiation structure and lamp wick composed thereof
10/08/2008CN201129679Y LED lamp panel structure with patch type bracket
10/08/2008CN201129677Y Lamp fitting structure
10/08/2008CN201129674Y Power LED
10/08/2008CN201129668Y Light conducting plate
10/08/2008CN201129667Y Side light type back light module unit using LED light source
10/08/2008CN201129646Y LED plate lamp structure
10/08/2008CN201129630Y LED light fitting
10/08/2008CN101283631A Method for manufacturing printed wiring board
10/08/2008CN101283449A Complete power management system implemented in a single surface mount package
10/08/2008CN101283443A Process for production of devices
10/08/2008CN101283119A Method of surface treatment for the inhibition of whiskers
10/08/2008CN101283048A Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto
10/08/2008CN101283016A Thermosetting epoxy resin composition and semiconductor device
10/08/2008CN101282630A Radiator cooling base and method for manufacturing the same
10/08/2008CN101282629A Cooling device
10/08/2008CN101282628A Cooling device
10/08/2008CN101282620A Wiring board and method of manufacturing the same
10/08/2008CN101282075A Apparatus and method for cooling phase transition of electric and electronic equipment
10/08/2008CN101281989A Co-plane waveguide based on SOI substrate and manufacturing method thereof
10/08/2008CN101281924A Method, apparatus, and system for phase change memory packaging
10/08/2008CN101281923A Phase change memory cell with diode isolation device
10/08/2008CN101281919A MOS type solid-state image pickup device
10/08/2008CN101281913A Display device and sputtering target for producing the same
10/08/2008CN101281909A NMOS pipe built-in bidirectional thyristor electrostatic protection device
10/08/2008CN101281908A Semiconductor device equipped with thin-film circuit elements
10/08/2008CN101281906A Standard cell and semiconductor device including the same
10/08/2008CN101281904A Power semiconductor module for inverter circuit system
10/08/2008CN101281903A Multiple encapsulation structure
10/08/2008CN101281902A High power LED lighting lamp and radiating module thereof
10/08/2008CN101281901A Multi-chip conformity type image sensing chip module and encapsulating method thereof
10/08/2008CN101281900A Systematism package with structure for preventing ball pad from pollution as well as manufacturing method thereof
10/08/2008CN101281899A PMOS pipe built-in bidirectional thyristor electrostatic protection device
10/08/2008CN101281898A Structure for testing integrality of grid medium layer, forming method and test method thereof
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