Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2008
10/30/2008WO2008129525A1 A thermal interface material
10/30/2008WO2008129460A1 Camera module
10/30/2008WO2008129005A1 Semiconductor body and method for voltage regulation
10/30/2008WO2008128948A2 Component having a metalized ceramic base
10/30/2008WO2008128947A1 Method for producing a metalized component, corresponding component, and a substrate for supporting the component during metalization
10/30/2008WO2008128945A1 Component having a ceramic base with a metalized surface
10/30/2008WO2008128944A1 Component having a ceramic base the surface of which is metalized
10/30/2008WO2008128823A1 Fabricating a contact rhodium structure by electroplating and electroplating composition
10/30/2008WO2008128809A1 Electronic housing
10/30/2008WO2008101093B1 Post-seed deposition process
10/30/2008WO2008099348A3 Semiconductor device identifier generation
10/30/2008WO2008069832A3 Creating reliable via contacts for interconnect applications
10/30/2008WO2008036571A3 An integrated circuit micro-cooler with double-sided tubes of a cnt array
10/30/2008WO2004109753A3 Methods and apparatus for defining power grid structures having diagonal stripes
10/30/2008US20080269672 Analyte Monitoring Device and Methods of Use
10/30/2008US20080268666 Apparatus for providing controlled impedance in an electrical contact
10/30/2008US20080268645 Method for front end of line fabrication
10/30/2008US20080268638 Substrate with Feedthrough and Method for Producing the Same
10/30/2008US20080268634 Dopant diffusion barrier layer to prevent out diffusion
10/30/2008US20080268578 Manufacturing method of a semiconductor device
10/30/2008US20080268576 Method of manufacturing a semiconductor device
10/30/2008US20080268264 Curing a coating of a siloxane compound and a carbosilane compound using ultraviolet radiation; a low relative dielectric constant, excellent chemical resistance, plasma resistance, mechanical strength
10/30/2008US20080268257 Printed circuits; improved heat resistance, fireproofing and stability; epoxy resin with layered silicate dispersed in 5 layers or less
10/30/2008US20080268237 Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polyimide film for tab, and prepreg
10/30/2008US20080266821 Housing for an Electronic Circuit and Method for Sealing the Housing
10/30/2008US20080266032 Illuminable Gaas Switching Component With Transparent Housing And Associated Microwave Circuit
10/30/2008US20080265445 Marks for the Alignment of Wafer-Level Underfilled Silicon Chips and Method to Produce Same
10/30/2008US20080265444 Thin-film aluminum nitride encapsulant for metallic structures on integrated circuits and method of forming same
10/30/2008US20080265443 Semiconductor device and method of manufacturing the same
10/30/2008US20080265442 Semiconductor device, electronic device, and method of producing semiconductor device
10/30/2008US20080265441 Semiconductor device and method of manufacturing the same
10/30/2008US20080265440 Semiconductor Device with a Semiconductor Chip and Electrical Connecting Elements to a Conductor Structure
10/30/2008US20080265439 Die bonding agent and a semiconductor device made by using the same
10/30/2008US20080265438 Liquid epoxy resin composition and semiconductor device
10/30/2008US20080265437 Package Equipped with Semiconductor Chip and Method for Producing Same
10/30/2008US20080265436 Semiconductor for Device and Its Manufacturing Method
10/30/2008US20080265434 Semiconductor device having a sealing resin and method of manufacturing the same
10/30/2008US20080265433 Interposer, semiconductor chip mounted sub-board, and semiconductor package
10/30/2008US20080265432 Multi-chip package and method of manufacturing the multi-chip package
10/30/2008US20080265431 Semiconductor package and method of manufacturing the semiconductor package
10/30/2008US20080265430 Semiconductor Device an Process for Fabricating the Same
10/30/2008US20080265429 Electronic component and method for manufacturing the same
10/30/2008US20080265428 Via and solder ball shapes to maximize chip or silicon carrier strength relative to thermal or bending load zero point
10/30/2008US20080265427 Anchoring Structure and Intermeshing Structure
10/30/2008US20080265426 Semiconductor structure comprising an electrical connection and method of forming the same
10/30/2008US20080265425 Semiconductor Device and Method for Manufacturing the Same
10/30/2008US20080265424 Semiconductor device
10/30/2008US20080265423 Layered structure for corrosion resistant interconnect contacts
10/30/2008US20080265422 Structure for charge dissipation during fabrication of integrated circuits and isolation thereof
10/30/2008US20080265421 Structure for Electrostatic Discharge in Embedded Wafer Level Packages
10/30/2008US20080265420 Method of forming a fully silicided semiconductor device with independent gate and source/drain doping and related device
10/30/2008US20080265419 Semiconductor structure comprising an electrically conductive feature and method of forming the same
10/30/2008US20080265418 Method of Manufacturing Semiconductor Device, and Semiconductor Device
10/30/2008US20080265417 Semiconductor device and method of manufacturing the same
10/30/2008US20080265416 Metal line formation using advaced CMP slurry
10/30/2008US20080265415 Nonlithographic Method to Produce Self-Aligned Mask, Articles Produced by Same and Compositions for Same
10/30/2008US20080265414 Electrically Conductive Composite
10/30/2008US20080265413 Semiconductor chip with post-passivation scheme formed over passivation layer
10/30/2008US20080265412 Semiconductor device and method of manufacturing thereof
10/30/2008US20080265411 Structure of packaging substrate and method for making the same
10/30/2008US20080265410 Wafer level package
10/30/2008US20080265409 Integrated circuit hard mask processing system
10/30/2008US20080265408 Highly Reliable Low Cost Structure for Wafer-Level Ball Grid Array Packaging
10/30/2008US20080265407 Wafer-level bonding for mechanically reinforced ultra-thin die
10/30/2008US20080265406 Apparatus and methods for cooling semiconductor integrated circuit chip packages
10/30/2008US20080265404 Structure and Methods of Processing for Solder Thermal Interface Materials for Chip Cooling
10/30/2008US20080265403 Hybrid Metal Matrix Composite Packages with High Thermal Conductivity Inserts
10/30/2008US20080265402 Rework process and method for lead-free capped multi-core modules with organic substrates
10/30/2008US20080265401 Integrated chip package structure using organic substrate and method of manufacturing the same
10/30/2008US20080265400 Chip-Stacked Package Structure and Applications Thereof
10/30/2008US20080265399 Low-cost and ultra-fine integrated circuit packaging technique
10/30/2008US20080265398 Substrate with pin, wiring substrate and semiconductor device
10/30/2008US20080265397 Chip-Stacked Package Structure
10/30/2008US20080265396 Quad flat no-lead chip carrier with standoff
10/30/2008US20080265395 Semiconductor device and method of fabricating the semiconductor device
10/30/2008US20080265394 Wafer level package and fabricating method thereof
10/30/2008US20080265393 Stack package with releasing layer and method for forming the same
10/30/2008US20080265392 Semiconductor device and method for manufacturing the same
10/30/2008US20080265391 Etched interposer for integrated circuit devices
10/30/2008US20080265390 Semiconductor device
10/30/2008US20080265389 Substrate for multi-chip stacking, multi-chip stack package utilizing the substrate and its applications
10/30/2008US20080265388 Ultra thin image sensing chip package
10/30/2008US20080265387 Smudge resistant coating for electronic device displays
10/30/2008US20080265386 Semiconductor device
10/30/2008US20080265385 Semiconductor package using copper wires and wire bonding method for the same
10/30/2008US20080265384 Integrated Circuit Package Device With Improved Bond Pad Connections, a Lead-Frame and an Electronic Device
10/30/2008US20080265383 Workpiece with Semiconductor Chips, Semiconductor Device and Method for Producing a Workpiece with Semiconductor Chips
10/30/2008US20080265382 Nonlithographic Method to Produce Self-Aligned Mask, Articles Produced by Same and Compositions for Same
10/30/2008US20080265381 SiCOH DIELECTRIC
10/30/2008US20080265380 Method for fabricating a high-k dielectric layer
10/30/2008US20080265378 Scribe line layout design
10/30/2008US20080265366 Semiconductor device with improved contact fuse
10/30/2008US20080265360 Semiconductor Layer Structure And Method Of Making The Same
10/30/2008US20080265359 Semiconductor divice
10/30/2008US20080265352 Solid-state image capturing apparatus, method for manufacturing the same, and electronic information device
10/30/2008US20080265334 Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage
10/30/2008US20080265327 Substrate Isolated Intergrated High Voltage Diode Integrated Within A Unit Cell
10/30/2008US20080265326 Structure and method for self protection of power device with expanded voltage ranges
10/30/2008US20080265324 Semiconductor device and method of manufacturing the same
10/30/2008US20080265300 Semiconductor device having plural dram memory cells and a logic circuit and method for manufacturing the same
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