| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/18/2008 | US20080224301 Lead Structure for a Semiconductor Component and Method for Producing the Same |
| 09/18/2008 | US20080224300 Semiconductor Module With Semiconductor Chips And Method For Producing It |
| 09/18/2008 | US20080224299 Base substrate for chip scale packaging |
| 09/18/2008 | US20080224298 Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components |
| 09/18/2008 | US20080224297 Apparatus comprising a device and method for producing it |
| 09/18/2008 | US20080224296 Article and Panel Comprising Semiconductor Chips, Casting Mold and Methods of Producing the Same |
| 09/18/2008 | US20080224295 Package structure and stacked package module using the same |
| 09/18/2008 | US20080224294 Multi-chip package with a single die pad |
| 09/18/2008 | US20080224293 Method And Apparatus For Fabricating A Plurality Of Semiconductor Devices |
| 09/18/2008 | US20080224292 Interposer structure with embedded capacitor structure, and methods of making same |
| 09/18/2008 | US20080224291 Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components |
| 09/18/2008 | US20080224290 Low cost lead-free preplated leadframe having improved adhesion and solderability |
| 09/18/2008 | US20080224289 Multi-chip stack structure and fabrication method thereof |
| 09/18/2008 | US20080224288 Portable Object Connectable Package |
| 09/18/2008 | US20080224287 Optoelectronic device alignment in an optoelectronic package |
| 09/18/2008 | US20080224286 Vertically mountable semiconductor device package |
| 09/18/2008 | US20080224285 Power module having stacked flip-chip and method of fabricating the power module |
| 09/18/2008 | US20080224284 Chip package structure |
| 09/18/2008 | US20080224283 Leadframe-based semiconductor package and fabrication method thereof |
| 09/18/2008 | US20080224282 Semiconductor device and method of manufacturing the same |
| 09/18/2008 | US20080224281 Semiconductor device and method of manufacturing same |
| 09/18/2008 | US20080224280 Lead frame, semiconductor device, and method of manufacturing the semiconductor device |
| 09/18/2008 | US20080224279 Vertical electrical interconnect formed on support prior to die mount |
| 09/18/2008 | US20080224278 Circuit component and method of manufacture |
| 09/18/2008 | US20080224277 Chip package and method of fabricating the same |
| 09/18/2008 | US20080224276 Semiconductor device package |
| 09/18/2008 | US20080224273 Chemical oxide removal of plasma damaged sicoh low k dielectrics |
| 09/18/2008 | US20080224271 Semiconductor Device and Method of Manufacturing Same, Wiring Board and Method of Manufacturing Same, Semiconductor Package, and Electronic Device |
| 09/18/2008 | US20080224262 Semiconductor device |
| 09/18/2008 | US20080224261 Fuse/anti-fuse structure and methods of making and programming same |
| 09/18/2008 | US20080224260 Programmable Vias for Structured ASICs |
| 09/18/2008 | US20080224257 Semiconductor device |
| 09/18/2008 | US20080224256 Semiconductor-on-insulator(soi) structures including gradient nitrided buried oxide (box) |
| 09/18/2008 | US20080224254 Glass-based SOI structures |
| 09/18/2008 | US20080224253 Semiconductor device |
| 09/18/2008 | US20080224220 Electrostatic Discharge Protection Device |
| 09/18/2008 | US20080224219 Semiconductor device and method for manufacturing same |
| 09/18/2008 | US20080224149 Silicon Carbide Semiconductor Device and Manufacturing Method Thereof |
| 09/18/2008 | US20080224148 Semiconductor sensing device |
| 09/18/2008 | US20080224135 Method and structure for determining thermal cycle reliability |
| 09/18/2008 | US20080224134 Test Structures for Identifying an Allowable Process Margin for Integrated Circuits and Related Methods |
| 09/18/2008 | US20080224093 a mixture of phosphoric acid, nitric acid, acetic acid, water and a stabilizer agent comprising a metal oxyhydride inorganic acid |
| 09/18/2008 | US20080223556 Pump-free water-cooling system |
| 09/18/2008 | US20080223132 Vibration Piezoelectric Acceleration Sensor |
| 09/18/2008 | US20080222876 System for attaching electronic components to molded interconnection devices |
| 09/18/2008 | DE202008009197U1 Ventilator Fan |
| 09/18/2008 | DE112006002909T5 Geschichtetes Wafer- oder Die-Packaging mit verbesserter Wärme- und Bauteil-Leistungsfähigkeit Layered wafer or die packaging with improved thermal efficiency and component |
| 09/18/2008 | DE112006002839T5 Kühlstruktur für eine elektrische Vorrichtung The cooling structure for an electric device |
| 09/18/2008 | DE10344605B4 Leitbahn-Verbindungsstruktur sowie zugehöriges Herstellungsverfahren Interconnect connection structure and manufacturing method thereof |
| 09/18/2008 | DE102008014323A1 Bildsensormodul mit einer Packageeinbauausnehmung und Verfahren zu deren Herstellung Image sensor module with a process for their preparation and Packageeinbauausnehmung |
| 09/18/2008 | DE102008000582A1 LED-Verbindungsfederbügelbauteil LED connector spring clip member |
| 09/18/2008 | DE102007022425A1 Beleuchtungsmodule Lighting Modules |
| 09/18/2008 | DE102007013186A1 Halbleitermodul mit Halbleiterchips und Verfahren zur Herstellung desselben The same semiconductor module with a semiconductor chip and method for producing |
| 09/18/2008 | DE102007012732A1 Electrostatic discharge method for protecting internal circuit against electrostatic discharge effect and damage, involves receiving electrostatic discharge current over electrostatic discharge connection |
| 09/18/2008 | DE102007012464A1 Micromechanical or electronic component producing method, involves providing molding tool for relative positioning between substrate material and cover material during attachment of substrate material and cover material |
| 09/18/2008 | DE102007012344A1 Navigation device position error minimizing method, involves specifying time for position determination based on probability of successful positioning for implementing successful and unsuccessful position determination |
| 09/18/2008 | DE102007012335A1 Sensorbauteil und Verfahren zur Herstellung eines Sensorbauteils Sensor component and method of producing a sensor component |
| 09/18/2008 | DE102007011163A1 Verbindungsstruktur und Verfahren zum Herstellen derselben Connection structure and method of manufacturing the same |
| 09/18/2008 | DE102007011126A1 Halbleiterbauelement mit Anschlusskontaktfläche Semiconductor component with terminal contact surface |
| 09/18/2008 | DE102007010883A1 Leistungshalbleiteranordnung und Verfahren zu dessen Herstellung A power semiconductor device and process for its preparation |
| 09/18/2008 | CA2680247A1 Integrated circuit package, notably for image sensor, and method of positioning |
| 09/17/2008 | EP1970968A1 Light emitting device, semiconductor device, and its manufacturing method |
| 09/17/2008 | EP1970967A1 Package structure of light-emitting diode |
| 09/17/2008 | EP1970962A1 Semiconductor device and its manufacturing method |
| 09/17/2008 | EP1970956A2 Semiconductor device and manufacturing method thereof |
| 09/17/2008 | EP1970955A1 Semiconductor module |
| 09/17/2008 | EP1970954A2 Fibrous laminate interface for security coatings on an integrated circuit |
| 09/17/2008 | EP1970953A1 Encapsulated electronic device and method for encapsulating an electronic device containing at least one electronic component |
| 09/17/2008 | EP1970950A2 Method of manufacturing an interconnection structure with cavities for an integrated circuit |
| 09/17/2008 | EP1970947A1 METHOD FOR FORMING Cu FILM |
| 09/17/2008 | EP1969646A1 Peltier cooling systems with high aspect ratio |
| 09/17/2008 | EP1969631A2 Microelectronic intercionnect substrate and packaging techniques |
| 09/17/2008 | EP1969628A2 Leadframe based flash memory cards |
| 09/17/2008 | EP1969627A2 Semiconductor devices including voltage switchable materials for over-voltage protection |
| 09/17/2008 | EP1969626A1 Electronic module, and method for producing one |
| 09/17/2008 | EP1969625A1 Circuit arrangement comprising a heat exchanging device |
| 09/17/2008 | EP1969624A1 Integrated electronic device and cooling device for an integrated electronic device |
| 09/17/2008 | EP1969623A2 Strip for integrated circuit packages having a maximized usable area |
| 09/17/2008 | EP1883957A4 Forming of local and global wiring for semiconductor product |
| 09/17/2008 | EP1858983B1 Curable silicone composition and electronic device produced therefrom |
| 09/17/2008 | EP1745506A4 Semiconductor die attachment for high vaccum tubes |
| 09/17/2008 | CN201119248Y Heat radiation device |
| 09/17/2008 | CN201119247Y Liquid cooling auxiliary heat radiation device |
| 09/17/2008 | CN201119246Y Water cooling auxiliary heat radiation device |
| 09/17/2008 | CN201119245Y Stack heat radiation device and its heat radiation slice |
| 09/17/2008 | CN201119244Y Protection device for electronic heat radiation component |
| 09/17/2008 | CN201119243Y Cover wind heat radiation device |
| 09/17/2008 | CN201119242Y Heat radiator and buckle combined structure |
| 09/17/2008 | CN201119240Y Heat radiator |
| 09/17/2008 | CN201119239Y Water cooling heat radiator |
| 09/17/2008 | CN201119238Y Heat radiation slice for liquid cooling heat radiator |
| 09/17/2008 | CN201119237Y Novel heat radiator |
| 09/17/2008 | CN201119235Y Wind guide cover device |
| 09/17/2008 | CN201119232Y Heat conduction device |
| 09/17/2008 | CN201119230Y Heat radiation module |
| 09/17/2008 | CN201119229Y Flat plate thermal tube integrated heat radiation device |
| 09/17/2008 | CN201119228Y A buckle heat radiation device |
| 09/17/2008 | CN201119227Y A heat radiator for aluminum semiconductor part |
| 09/17/2008 | CN201119226Y A thermal tube-reinforced electronic part heat radiator |
| 09/17/2008 | CN201119225Y Fixer structure for cooling device |