Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2008
10/02/2008US20080237842 Thermally conductive molding compounds for heat dissipation in semiconductor packages
10/02/2008US20080237841 Microelectronic package, method of manufacturing same, and system including same
10/02/2008US20080237840 Flexible circuit electronic package with standoffs
10/02/2008US20080237839 Semiconductor apparatus and method of manufacturing same
10/02/2008US20080237838 Semiconductor device
10/02/2008US20080237837 Integrated Circuit Arrangement
10/02/2008US20080237836 Semiconductor chip embedding structure
10/02/2008US20080237835 Non-uniform feedthrough and lead configuration for a transistor outline package
10/02/2008US20080237834 Chip packaging structure and chip packaging process
10/02/2008US20080237833 Multi-chip semiconductor package structure
10/02/2008US20080237832 Multi-chip semiconductor package structure
10/02/2008US20080237831 Multi-chip semiconductor package structure
10/02/2008US20080237830 Semiconductor device
10/02/2008US20080237829 High current lead electrode for semiconductor device
10/02/2008US20080237828 Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for wlp and method of the same
10/02/2008US20080237827 Integrated circuit with flexible planer leads
10/02/2008US20080237826 Method for protecting encapsulated sensor structures using stack packaging
10/02/2008US20080237825 Stacked integrated circuit package system with conductive spacer
10/02/2008US20080237824 Stacked electronic component package having single-sided film spacer
10/02/2008US20080237823 Aluminum Based Bonding of Semiconductor Wafers
10/02/2008US20080237822 Microelectronic die having nano-particle containing passivation layer and package including same
10/02/2008US20080237821 Package structure and manufacturing method thereof
10/02/2008US20080237820 Package structure and method of manufacturing the same
10/02/2008US20080237819 Bipolar Carrier Wafer and Mobile Bipolar Electrostatic Wafer Arrangement
10/02/2008US20080237818 Methods and apparatus for multi-stage molding of integrated circuit package
10/02/2008US20080237817 Integrated circuit package system with heat sink spacer structures
10/02/2008US20080237816 Integrated circuit package system with encapsulating features
10/02/2008US20080237815 Tape carrier, semiconductor device, and method for manufacturing semiconductor device
10/02/2008US20080237814 Isolated solder pads
10/02/2008US20080237813 Circuit board and semiconductor device
10/02/2008US20080237812 Method of manufacturing semiconductor device and semiconductor device
10/02/2008US20080237811 Method for preserving processing history on a wafer
10/02/2008US20080237810 Controlling substrate surface properties via colloidal coatings
10/02/2008US20080237808 Semiconductor Device and Method of Manufacturing the Same
10/02/2008US20080237805 Semiconductor Device and Method for Manufacturing Semiconductor Device
10/02/2008US20080237804 Quality of a thin layer through high-temperature thermal annealing
10/02/2008US20080237792 Semiconductor capacitor structure and layout pattern thereof
10/02/2008US20080237787 Semiconductor integrated circuit
10/02/2008US20080237784 Semiconductor device and method of manufacturing a semiconductor device
10/02/2008US20080237781 Chip-stacked semiconductor device and manufacturing method thereof
10/02/2008US20080237780 SOI substrate and method for manufacturing SOI substrate
10/02/2008US20080237779 SOI substrate and method for manufacturing SOI substrate
10/02/2008US20080237778 Semiconductor device and method for manufacturing the same
10/02/2008US20080237768 Solid-state imaging apparatus
10/02/2008US20080237766 Image sensing devices including image sensor chips, image sensor package modules employing the image sensing devices, electronic products employing the image sensor package modules, and methods of fabricating the same
10/02/2008US20080237756 Microelectromechanical systems, and methods for encapsualting and fabricating same
10/02/2008US20080237721 Structure and circuit technique for uniform triggering of multifinger semiconductor devices with tunable trigger voltage
10/02/2008US20080237649 Integrated circuits and interconnect structure for integrated circuits
10/02/2008US20080237645 Semiconductor device
10/02/2008US20080237591 Vertical system integration
10/02/2008US20080237589 Semiconductor device comprising circuit substrate with inspection connection pads and manufacturing method thereof
10/02/2008US20080237588 Method and semiconductor structure for monitoring etch characteristics during fabrication of vias of interconnect structures
10/02/2008US20080237587 Method and circuit for stressing upper level interconnects in semiconductor devices
10/02/2008US20080237586 Semiconductor Integrated Test Structures For Electron Beam Inspection of Semiconductor Wafers
10/02/2008US20080237581 Device with phase-separated dielectric structure
10/02/2008US20080237053 Structure comprising a barrier layer of a tungsten alloy comprising cobalt and/or nickel
10/02/2008US20080236885 Thin film device and method for manufacturing the same
10/02/2008US20080236797 Cooling unit
10/02/2008US20080236796 Vapor Augmented Heatsink with Multi-Wick Structure
10/02/2008US20080236175 Microarchitecture control for thermoelectric cooling
10/02/2008DE202007007361U1 Lüfteraggregat Fan unit
10/02/2008DE112006003229T5 Verfahren zur Herstellung eines Körpers mit einem darin gebildeten Fließweg und Körper mit dem darin gebildeten Fließweg A method of producing a body having a flow path formed therein and the body with the flow path formed therein
10/02/2008DE112006002840T5 Kühlstruktur für eine elektrische Vorrichtung The cooling structure for an electric device
10/02/2008DE102008016960A1 Leistungshalbleitermodul und Leistungshalbleitervorrichtung mit dem darin befestigten Modul The power semiconductor module and power semiconductor device with the module mounted therein
10/02/2008DE102007030389A1 Wärmesenke sowie Bau- oder Moduleinheit mit einer Wärmesenke Heat sink as well as construction or modular unit with a heat sink
10/02/2008DE102007016126A1 Anordnung mit mindestens einem in Berührungskontakt mit mindestens einem Kunststoffbauelement stehenden Metallteil Arrangement with at least one stationary device with at least one plastic part in touching contact metal
10/02/2008DE102007015817A1 Systemträgerband für elektronische Bauteile System carrier tape for electronic components
10/02/2008DE102007015295A1 Temperatursensorstruktur für ein Halbleiterbauelement Temperature sensor structure for a semiconductor device
10/02/2008DE102007014969A1 Device for manufacturing semiconductor components, has radiation emission device and radiation recording device relative to semiconductor substrate arranged on same side
10/02/2008DE102007014363A1 Halbleitermodul Semiconductor module
10/02/2008CA2681666A1 Integrated circuit with flexible planer leads
10/01/2008EP1976351A2 Wiring structure and method of forming the same
10/01/2008EP1976041A2 Surface modifying carbon nanotube material, manufacturing method therefor, electronic component and electronic device
10/01/2008EP1976008A2 Inkjet Printed Wirings, Encapsulant and Shielding
10/01/2008EP1976007A2 Anisotropically conductive member and method of manufacture
10/01/2008EP1976006A2 System carrier tape for electronic components
10/01/2008EP1976005A2 Thermally conductive sheet and method of manufacturing the same
10/01/2008EP1976004A1 Semiconductor element mounting substrate, semiconductor device using the same, and process for producing semiconductor element mounting substrate
10/01/2008EP1976003A1 Base substrate for chip scale packaging
10/01/2008EP1975999A1 Electronic device and method of manufacturing the same
10/01/2008EP1975995A1 Method of welding two elements together by means of a brazing material
10/01/2008EP1975992A1 Self-supporting, photovoltaic passive refrigerator module
10/01/2008EP1975991A2 Diode having reduced on-resistance and associated method of manufacture
10/01/2008EP1975856A1 Thin electronic module for a microcircuit card
10/01/2008EP1975659A1 Photoelectric conversion module for direct optical interconnection and method of manufacturing the same
10/01/2008EP1974591A2 Mounting structure providing electrical surge protection
10/01/2008EP1974381A2 Package for a light emitting diode with integrated electrostatic discharge protection
10/01/2008EP1974380A2 Test pads on flash memory cards
10/01/2008EP1974379A2 Dual-damascene process to fabricate thick wire structure
10/01/2008EP1974378A2 Thermal interconnect and interface systems, methods of production and uses thereof
10/01/2008EP1973623A2 Semiconductor device fabricated using sublimation
10/01/2008EP1804296B1 Light-receiving device
10/01/2008EP1627430B1 An integrated circuit package employing a flexible substrate
10/01/2008EP1552555A4 An electronic and optoelectronic component packaging technique
10/01/2008EP1410701B1 Method of manufacturing an integrated circuit carrier
10/01/2008EP1366510B1 Ruthenium silicide wet etch
10/01/2008EP1226743B1 Method of fabricating a laminated printed circuit board
10/01/2008EP1038317B1 Integrated circuit header assembly and method for making same
10/01/2008EP0881680B1 Semiconductor device
10/01/2008CN201127160Y Wind scooper structure
1 ... 871 872 873 874 875 876 877 878 879 880 881 882 883 884 885 886 887 888 889 890 891 ... 2262