Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2008
10/23/2008US20080258294 Heat-dissipating semiconductor package structure and method for manufacturing the same
10/23/2008US20080258293 Semiconductor device package to improve functions of heat sink and ground shield
10/23/2008US20080258292 Macro-cell block and semiconductor device
10/23/2008US20080258291 Semiconductor Packaging With Internal Wiring Bus
10/23/2008US20080258290 Semiconductor device and method for manufacturing the same
10/23/2008US20080258289 Integrated circuit package system for package stacking
10/23/2008US20080258288 Semiconductor device stack package, electronic apparatus including the same, and method of manufacturing the same
10/23/2008US20080258287 Semiconductor device and method of manufacturing the same
10/23/2008US20080258286 High Input/Output, Low Profile Package-On-Package Semiconductor System
10/23/2008US20080258285 Simplified Substrates for Semiconductor Devices in Package-on-Package Products
10/23/2008US20080258284 Ultra-thin chip packaging
10/23/2008US20080258283 Wiring board and semiconductor package using the same
10/23/2008US20080258282 Lead frame free package and method of making
10/23/2008US20080258281 Process for Producing and Apparatus for Improving the Bonding Between a Plastic and a Metal
10/23/2008US20080258280 Lead frame, semiconductor device using the lead frame, and methods of manufacturing the same
10/23/2008US20080258279 Leadframe for leadless package, structure and manufacturing method using the same
10/23/2008US20080258278 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
10/23/2008US20080258277 Semiconductor Device Comprising a Semiconductor Chip Stack and Method for Producing the Same
10/23/2008US20080258276 Non-Leaded Semiconductor Package and a Method to Assemble the Same
10/23/2008US20080258275 Controlling warping in integrated circuit devices
10/23/2008US20080258274 Semiconductor Package and Method
10/23/2008US20080258273 Package Structure With Flat Bumps For Electronic Device and Method of Manufacture the Same
10/23/2008US20080258272 Etched leadframe structure
10/23/2008US20080258267 Method of Producing Semiconductor Device and Semiconductor Device
10/23/2008US20080258266 Semiconductor device and manufacturing method thereof
10/23/2008US20080258262 Semiconductor device with improved pads
10/23/2008US20080258256 Semiconductor electrically programmable fuse element with amorphous silicon layer after programming and method of programming the same
10/23/2008US20080258255 Electromigration Aggravated Electrical Fuse Structure
10/23/2008US20080258241 Integrated circuits and interconnect structure for integrated circuits
10/23/2008US20080258240 Integrated circuits and interconnect structure for integrated circuits
10/23/2008US20080258223 Esd protection device
10/23/2008US20080258176 Antimonide-based compound semiconductor with titanium tungsten stack
10/23/2008US20080258171 Semiconductor light emitting device excellent in heat radiation
10/23/2008US20080258144 Semiconductor wafer, semiconductor chip and method of manufacturing semiconductor chip
10/23/2008DE202004021510U1 Gehäusestruktur Housing structure
10/23/2008DE112006003451T5 Grabenfeldplattenabschluss für Leistungsvorrichtungen Grave field plate Statements for power devices
10/23/2008DE112006003405T5 Hochfrequenzsubstrat und Herstellungsverfahren dafür High-frequency substrate and manufacturing method thereof
10/23/2008DE112006003049T5 Package unter VErwendung eines Array-Kondensatorkerns Package Using an array capacitor core
10/23/2008DE10310809B4 Leistungshalbleitereinrichtung Power semiconductor device
10/23/2008DE102008015592A1 Cooling device for e.g. tablet personal computer, has cover fitting at cooling fins such that cooling channel is formed, where cooling medium flows through channel due to temperature differences within channel and/or by use of aerator
10/23/2008DE102008005607A1 Bildsensormodul und Verfahren desselben The same image sensor module and method
10/23/2008DE102007053560A1 Aluminum-cooling plate for use in converter i.e. voltage intermediate circuit-converter, has cooling medium pipes with inner surfaces provided with circular bulge, which axially runs along cooling medium pipes related to thread turn
10/23/2008DE102007018914A1 Halbleiterbauelement mit einem Halbleiterchipstapel und Verfahren zur Herstellung desselben Of the same semiconductor device with a semiconductor chip stack and processes for preparing
10/23/2008DE102007018237A1 Schaltung mit verbessertem ESD-Schutz bei repetierender Pulsbelastung Circuit with improved ESD protection for repetierender pulse load
10/23/2008DE102004025735B4 Optischer-Empfänger-Gehäuse und Verfahren zu dessen Herstellung Optical receiver package and process for its preparation
10/23/2008CA2682105A1 Semiconductor light engine using polymer light pipes and lighting systems constructed with the light engine
10/22/2008EP1983570A2 Integrated switching assembly with intermediate materials and accompanying components
10/22/2008EP1983569A1 Semicondutor body and method for voltage regulation
10/22/2008EP1983567A1 Hollow package made of resin, and manufacturing method therefor
10/22/2008EP1982355A2 Power electronics assembly
10/22/2008EP1982354A2 Electrical microfilament to circuit interface
10/22/2008EP1982353A2 Flip-attached and underfilled stacked semiconductor devices
10/22/2008EP1911096A4 Method and structure for forming slot via bitline for mram devices
10/22/2008EP1856728B1 A method of manufacturing semiconductor packages and packages made
10/22/2008EP1618570B1 Memory-circuit arrangement and method for the production thereof
10/22/2008EP1446993B1 I-channel surface-mount connector with extended flanges and method for interconnecting circuit boards
10/22/2008EP1231639B1 Power module
10/22/2008EP1157420A4 Light extractor apparatus
10/22/2008CN201138911Y Heat radiating device realizing heat transferring of high heat flow density
10/22/2008CN201138909Y Heat radiating module
10/22/2008CN201138908Y Air-guiding cover and heat radiating device having the same
10/22/2008CN201138907Y Housing of electronic device
10/22/2008CN201138906Y Fixing piece and heat radiating device
10/22/2008CN201138782Y Rectifier apparatus in resistance spot welding machine
10/22/2008CN201138661Y Electric property test key
10/22/2008CN201138660Y Column shaped heat-pipe radiator with inclined substrate for micro-processor
10/22/2008CN201138463Y Computer system with wind-guiding cowl
10/22/2008CN201137904Y Lamp radiating assembly
10/22/2008CN201137903Y LED lamp possessing high heat dispersion
10/22/2008CN201137902Y LED lamp light source module group
10/22/2008CN201137901Y LED lamp radiation structure
10/22/2008CN201137900Y Light-emitting diode fluorescent lamp
10/22/2008CN201137899Y LED lamp metal cover heat radiating device
10/22/2008CN201137897Y LED strip lamp
10/22/2008CN201137836Y Large power solid-state illumination street light fitting
10/22/2008CN201137834Y Stage lamp light source component
10/22/2008CN101292393A Vertical signal path, printed board provided with such vertical signal path, and semiconductor package provided with such printed board and semiconductor element
10/22/2008CN101292349A Device comprising an element with electrodes coupled to connections
10/22/2008CN101292348A Stackable wafer or die packaging with enhanced thermal and device performance
10/22/2008CN101292347A Circuit module and circuit device using such circuit module
10/22/2008CN101292344A Single crystal based through the wafer connections
10/22/2008CN101292335A Redistribution layer for wafer-level chip scale package and method therefor
10/22/2008CN101292330A Chemical-enhanced package singulation process
10/22/2008CN101292329A Registration mark within an overlap of dopant regions
10/22/2008CN101291973A 热固性树脂组合物和光半导体密封材料 The thermosetting resin composition and an optical semiconductor sealing material
10/22/2008CN101291769A Cladding material and its fabrication method, method for molding cladding material, and heat sink using cladding material
10/22/2008CN101291573A Water-cooling head structure
10/22/2008CN101291572A Heat radiating device
10/22/2008CN101291571A Heat radiating device
10/22/2008CN101291570A Heat pipe radiator and manufacturing method thereof
10/22/2008CN101291567A Fastener module
10/22/2008CN101291042A Encapsulation structure of optoelectronic component
10/22/2008CN101290953A Manufacturing method of infrared receiver and structure thereof
10/22/2008CN101290948A 4F square self-aligning side wall active phase change memory
10/22/2008CN101290947A Magnetic memory and method of manufacturing the same
10/22/2008CN101290945A Imager photodiode capacitor structure for reducing process change sensitivity
10/22/2008CN101290943A Photoelectric conversion device and image pickup device
10/22/2008CN101290940A Photoelectric conversion element comprising semiconductor and semiconductor device using the same
10/22/2008CN101290939A Liquid crystal display and it thin film transistor array substrate
10/22/2008CN101290937A Display device and its manufacture method
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