| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/24/2008 | CN201123204Y Heat radiator |
| 09/24/2008 | CN201123203Y Evaporation chamber used for capillary pump loop |
| 09/24/2008 | CN201122606Y Power type LED encapsulation base plate |
| 09/24/2008 | CN201122599Y Light emitting diode chip packaging structure with high efficiency illumination effect |
| 09/24/2008 | CN201122598Y Plate type LED light source chip |
| 09/24/2008 | CN201122597Y Light emitting diode chip packaging structure with thick guiding pin |
| 09/24/2008 | CN201122596Y Afterflow diode module of solar cell panel |
| 09/24/2008 | CN201122595Y LED capable of adjusting color temperature and developing color |
| 09/24/2008 | CN201122594Y Lead frame structure |
| 09/24/2008 | CN201122593Y Integrate circuit board |
| 09/24/2008 | CN201122592Y Memory bar cooling fan frame |
| 09/24/2008 | CN201122591Y Radiation fin component for chip encapsulation |
| 09/24/2008 | CN201122590Y Electronic device with cooling member |
| 09/24/2008 | CN201122589Y Internal memory heat radiating device with enlarged radiating area |
| 09/24/2008 | CN201122588Y High heat conductivity metal heat sink for light emitting diode |
| 09/24/2008 | CN201122587Y LED module group radiator |
| 09/24/2008 | CN201121868Y LED lamp core |
| 09/24/2008 | CN201121867Y LED lamp internal aluminum pipe gas flow speeding heat radiating device |
| 09/24/2008 | CN201121866Y Forced cooling type high power LED lighting lamp device |
| 09/24/2008 | CN201121865Y LED lamp capable of fast cooling |
| 09/24/2008 | CN201121863Y LED lamp exterior clamping metal cover heat radiating device |
| 09/24/2008 | CN201121860Y Power LED bright light device |
| 09/24/2008 | CN201121859Y High cooling property led lamp substrates |
| 09/24/2008 | CN201121835Y LED optical lens |
| 09/24/2008 | CN101273455A Wafer with scribe lanes comprising active circuits for die testing of complementary signal processing parts |
| 09/24/2008 | CN101273454A Wafer with scribe lanes comprising external pads and/or active circuits for die testing |
| 09/24/2008 | CN101273453A Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipating wiring board |
| 09/24/2008 | CN101273452A Die pad for semiconductor packages |
| 09/24/2008 | CN101273451A Microelectronic package having direct contact heat spreader and method of manufacturing same |
| 09/24/2008 | CN101273450A Heat sink module and process for producing the same |
| 09/24/2008 | CN101273089A Resin composition for sealing optical semiconductor element and optical semiconductor device obtained by using the same |
| 09/24/2008 | CN101272674A Three-dimensional uniform temperature heat transfer device |
| 09/24/2008 | CN101272673A Component package with heat converter |
| 09/24/2008 | CN101272672A Point static state radiator implementing method |
| 09/24/2008 | CN101272050A Integrated circuit with electrostatic protection structure |
| 09/24/2008 | CN101271954A Heat radiator of semiconductor refrigerating device |
| 09/24/2008 | CN101271951A LED chip encapsulation body and encapsulation thereof |
| 09/24/2008 | CN101271941A Encapsulation colloid structure of LED |
| 09/24/2008 | CN101271920A Pixel circuit and display apparatus as well as fabrication method for display apparatus |
| 09/24/2008 | CN101271917A Antistatic structure of semiconductor lighting device and manufacturing method thereof |
| 09/24/2008 | CN101271916A Electrostatic-resistant gallium nitride illumination device and production method thereof |
| 09/24/2008 | CN101271913A Optical device, camera module, mobile phone, digital still camera, and medical endoscope |
| 09/24/2008 | CN101271907A Floating node structure of complementary metal oxide semi-image sensor and manufacturing method thereof |
| 09/24/2008 | CN101271906A Photoreceptor integrated circuit and optoelectronic component comprising the same |
| 09/24/2008 | CN101271905A Pixel structure and active element array substrate |
| 09/24/2008 | CN101271904A Array substrate, LCD panel, optoelectronic device and its driving/production method |
| 09/24/2008 | CN101271903A Image element structure of active part array substrates |
| 09/24/2008 | CN101271902A Maintaining method of display electrode and its structure |
| 09/24/2008 | CN101271893A Semiconductor device |
| 09/24/2008 | CN101271892A Semiconductor device and manufacturing method of the same |
| 09/24/2008 | CN101271891A Electrostatic discharge protecting equipment and manufacturing method thereof |
| 09/24/2008 | CN101271890A Semiconductor device, method of manufacturing the same |
| 09/24/2008 | CN101271888A Integrated circuit package and manufacturing method thereof |
| 09/24/2008 | CN101271887A Semiconductor light emitting device |
| 09/24/2008 | CN101271886A High-density circuit module |
| 09/24/2008 | CN101271885A Image sensor encapsulation and image taking device using the same |
| 09/24/2008 | CN101271883A Production method of circuit substrates and inductor wire |
| 09/24/2008 | CN101271882A Semiconductor element |
| 09/24/2008 | CN101271881A Inverse fuse wire and memory cell without ability to cause non-linear current after fusing |
| 09/24/2008 | CN101271880A Semiconductor device and method of manufacturing the same |
| 09/24/2008 | CN101271879A Element-mounting board and semiconductor module |
| 09/24/2008 | CN101271878A Lead frame |
| 09/24/2008 | CN101271877A Flip chip encapsulation structure and carrier thereof |
| 09/24/2008 | CN101271876A Inductor encapsulation member |
| 09/24/2008 | CN101271875A Silicon-controlled rectifier with cooling structure |
| 09/24/2008 | CN101271874A Semiconductor element with noise suppressing function and its manufacturing method |
| 09/24/2008 | CN101271873A Semiconductor grain and package structure |
| 09/24/2008 | CN101271872A Wafer structure of projection definization |
| 09/24/2008 | CN101271871A Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device |
| 09/24/2008 | CN101271870A Silicon epitaxial wafer |
| 09/24/2008 | CN101271861A Multi-layer wiring structure forming method |
| 09/24/2008 | CN101271860A Self-aligning contact window and manufacturing method thereof |
| 09/24/2008 | CN101271856A Etch depth determination based on resistor in sgt technology |
| 09/24/2008 | CN101271855A Etch depth determination for sgt technology |
| 09/24/2008 | CN101271853A Method of manufacturing electronic device, substrate and semiconductor device |
| 09/24/2008 | CN101271669A Method for driving light emitting device, and light emitting device |
| 09/24/2008 | CN101271535A Storage medium with stack element structure |
| 09/24/2008 | CN101271235A Liquid crystal display device and method of fabricating the same |
| 09/24/2008 | CN101270867A Radiating plate structure capable of improving LED radiating effect |
| 09/24/2008 | CN101270864A Production method of illuminating device |
| 09/24/2008 | CN100421352C 高频功率放大器模块 High-frequency power amplifier module |
| 09/24/2008 | CN100421261C Bi-carrier scr circuit and method of forming the same |
| 09/24/2008 | CN100421257C TFT LCD array substrate structure and its producing method |
| 09/24/2008 | CN100421256C SOI LIGBT device unit of integrated ESD diode |
| 09/24/2008 | CN100421251C Semiconductor device and its producing method |
| 09/24/2008 | CN100421249C Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
| 09/24/2008 | CN100421248C Fuse circuit and electrical fuse circuit with electrostatic discharge (ESD) protection |
| 09/24/2008 | CN100421247C 半导体器件 Semiconductor devices |
| 09/24/2008 | CN100421246C Bonded copper wire and preparing method thereof |
| 09/24/2008 | CN100421245C Semiconductor device with low thermal expansion coefficient and use thereof |
| 09/24/2008 | CN100421244C 电子装置 Electronic devices |
| 09/24/2008 | CN100421243C Extensive use type chip capsulation structure |
| 09/24/2008 | CN100421242C Semiconductor device |
| 09/24/2008 | CN100421241C Semiconductor integrated circuit and method of manufacturing the same |
| 09/24/2008 | CN100421240C Semiconductor device having clips for connecting to external elements |
| 09/24/2008 | CN100421239C Thermal conductivity composite sheet materials |
| 09/24/2008 | CN100421238C Radiating device |
| 09/24/2008 | CN100421237C Chip package body of asymmetrical moudl |
| 09/24/2008 | CN100421232C Reduced splattering of unpassivated laser fuses |
| 09/24/2008 | CN100421230C High sensitivity testing structure for evaluating plasma antenna effect |