Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2008
10/22/2008CN101290934A 半导体装置 Semiconductor device
10/22/2008CN101290933A Electrostatic discharge protection device
10/22/2008CN101290931A Self-cooled thyristor valve of high power and mounting vehicle
10/22/2008CN101290930A Semiconductor device comprising a semiconductor chip stack and method for producing the same
10/22/2008CN101290929A Stack type chip packaging structure
10/22/2008CN101290926A 半导体装置 Semiconductor device
10/22/2008CN101290925A Single-encapsulated LED and illuminating device
10/22/2008CN101290924A Luminous diode
10/22/2008CN101290923A Test base, test base mask and forming method of test base
10/22/2008CN101290922A System realizing three-dimensional interconnection between multi-systems
10/22/2008CN101290921A Package base with wafer covered with thin membrane preventing deformation of thin membrane
10/22/2008CN101290920A 半导体装置 Semiconductor device
10/22/2008CN101290919A Memory encapsulation component and module card using the same
10/22/2008CN101290918A Chip packaging structure
10/22/2008CN101290917A Structure of welding mat
10/22/2008CN101290916A Film device and its manufacture method
10/22/2008CN101290915A 布局电路 The layout of the circuit
10/22/2008CN101290914A Semiconductor device and method for manufacturing the same
10/22/2008CN101290913A Electronic element component having compound material base
10/22/2008CN101290912A 半导体装置及其制造方法 Semiconductor device and manufacturing method
10/22/2008CN101290911A Flash memory and preparation method thereof
10/22/2008CN101290905A Display panel and wire manufacturing method thereof
10/22/2008CN101290897A Contact mat and method of manufacturing the same
10/22/2008CN101290896A Stackable semiconductor device and manufacture thereof
10/22/2008CN101290895A Manufacturing method of semiconductor package and applied heat radiating structure therein
10/22/2008CN101290894A Semiconductor device and its manufacture method
10/22/2008CN101290892A Sensing type semiconductor device and its manufacture
10/22/2008CN101290890A Circuit board with internally embedded conductive wire and manufacturing method therefor
10/22/2008CN101290889A Wiring board manufacturing method, semiconductor device manufacturing method and wiring board
10/22/2008CN101290874A Forming method of grooves with shallow groove isolation and semiconductor structure
10/22/2008CN101290799A Non-volatile memory devices and methods of operating the same
10/22/2008CN101290639A Semiconductor integrated circuit and layout method for the same
10/22/2008CN101290406A Line and liquid crystal display panel applying same
10/22/2008CN101290106A Semiconductor LED lamp heat radiator
10/22/2008CN100428617C Temperature detection method of semiconductor device and power conversion apparatus
10/22/2008CN100428591C Encapsulation structure and method of the high-speed semiconductor light emission component
10/22/2008CN100428514C Light emitting diode package having recess in heat conducting part
10/22/2008CN100428512C Light-emitting diode apparatus
10/22/2008CN100428482C Solid-state imaging device and method for manufacturing the same
10/22/2008CN100428481C Thin film transistor array base board and its repairing method
10/22/2008CN100428472C Static discharging device for low voltage triggering and maintaining area
10/22/2008CN100428469C Method and structure for detection of residual liner materials after polishing in damascene process
10/22/2008CN100428465C Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument
10/22/2008CN100428464C ESD protection circuit for high voltage of power supply by electrostatic elimination with low voltage component
10/22/2008CN100428463C Electrostatic discharge protection element and producing method thereof
10/22/2008CN100428462C Semiconductor integrated circuit device
10/22/2008CN100428461C Semiconductor device and method for manufacturing the same
10/22/2008CN100428460C Bonded copper wire and preparing method thereof
10/22/2008CN100428459C Contact pad
10/22/2008CN100428458C A flexible substrate for packaging
10/22/2008CN100428457C Light-emitting diodes surface-adhered foundation support and its production
10/22/2008CN100428456C Semiconductor device and manufacturing method of the same
10/22/2008CN100428455C Semiconductor device and manufacturing method of the same
10/22/2008CN100428454C Tape lower chip packaging structure and its producing method
10/22/2008CN100428453C Interconnect structures incorporating low-k dielectric barrier films
10/22/2008CN100428452C Package structure
10/22/2008CN100428451C Heat radiator with magnetized heat-conducting liquid
10/22/2008CN100428450C Heat pipe radiator
10/22/2008CN100428449C Semiconductor device and method for mfg. same
10/22/2008CN100428448C Circuit apparatus and method of manufacturing the same
10/22/2008CN100428447C Chip packaging signal transmission structure and substrate
10/22/2008CN100428444C Memory cell arrangement with a folded bit line arrangement and relevant manufacturing method
10/22/2008CN100428440C Use of voids between elements in semiconductor structures for isolation
10/22/2008CN100428433C Structure of electric connection pad
10/22/2008CN100428432C Substrate for bonding element and method of manufacturing the same
10/22/2008CN100428431C Combining method and its device for radiating fin and heat pipe
10/22/2008CN100428430C Copper depression technology applied to selective top and chemical cladding material
10/22/2008CN100428422C Device and methodology for reducing effective dielectric constant in semiconductor devices
10/22/2008CN100428414C Method for forming low-stress multi-layer metallized structure and leadless solder end electrode
10/22/2008CN100428408C Electrostatic discharge protection method and structure for photomask
10/22/2008CN100428367C Aluminum alloy wiring material having high resistance to heat and target material
10/22/2008CN100427849C Improved efficiency thermoelectrics utilizing thermal isolation
10/21/2008US7440861 Concept of compensating for piezo influences on integrated circuitry
10/21/2008US7440860 Sequential unique marking
10/21/2008US7440284 Holding device for a heat sink
10/21/2008US7440278 Water-cooling heat dissipator
10/21/2008US7440277 Method and apparatus for venting a chassis
10/21/2008US7440276 Cooling-fan-free system module
10/21/2008US7440256 Laminated ceramic substrate and manufacturing method therefor
10/21/2008US7440247 Gate coupling electrostatic discharge protection circuit with redundant structures
10/21/2008US7440105 Continuously varying offset mark and methods of determining overlay
10/21/2008US7439628 Method for improved process latitude by elongated via integration
10/21/2008US7439627 Post passivation interconnection schemes on top of the IC chips
10/21/2008US7439626 Post passivation interconnection schemes on top of IC chip
10/21/2008US7439625 Circuit board
10/21/2008US7439624 Enhanced mechanical strength via contacts
10/21/2008US7439623 Semiconductor device having via connecting between interconnects
10/21/2008US7439622 Semiconductor device
10/21/2008US7439621 Radio frequency signal processing device
10/21/2008US7439620 Integrated circuit package-in-package system
10/21/2008US7439619 Electronic package structure and the packaging process thereof
10/21/2008US7439618 Integrated circuit thermal management method and apparatus
10/21/2008US7439617 Capillary underflow integral heat spreader
10/21/2008US7439616 Miniature silicon condenser microphone
10/21/2008US7439615 Semiconductor component comprising an integrated semiconductor chip and a chip housing, and electronic device
10/21/2008US7439614 Circuit device with dummy elements
10/21/2008US7439613 Substrate based unmolded package
10/21/2008US7439612 Integrated circuit package structure with gap through lead bar between a die edge and an attachment point corresponding to a conductive connector
10/21/2008US7439611 Circuit board with auxiliary wiring configuration to suppress breakage during bonding process
10/21/2008US7439610 High power shunt switch with high isolation and ease of assembly
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