Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2008
10/01/2008CN201127159Y Portable electronic equipments radiating device
10/01/2008CN201127158Y Radiating device capable of prearranged with wind gap structure
10/01/2008CN201127157Y Pole-shaped radiator with radiation fin
10/01/2008CN201126828Y Encapsulation structure of luminescence chip
10/01/2008CN201126826Y Light emitting diode capable of bidirectional luminescence and heat radiation
10/01/2008CN201126825Y Encapsulation structure of LED light source
10/01/2008CN201126820Y Improved transistor stack encapsulation structure
10/01/2008CN201126819Y Novel eight-feed trinity LED
10/01/2008CN201126818Y 存储器散热装置 Memory cooling devices
10/01/2008CN201126817Y Luminescence crystal round heat-radiation fixed structure
10/01/2008CN201126173Y High-efficiency energy-saving road lamp
10/01/2008CN201126171Y High-power LED street light fitting
10/01/2008CN201126125Y High-power LED ceiling lamp
10/01/2008CN201126124Y High luminance LED module structure tunnel illuminator
10/01/2008CN201126122Y Modularized high-power LED road lamp and standardized LED light source module group unit
10/01/2008CN101278603A Method for fixing a light-emitting diode to a metallic heat-radiating element
10/01/2008CN101278478A Piezoelectric vibrating device
10/01/2008CN101278396A Plating seed layer including an oxygen/nitrogen transition region for barrier enhancement
10/01/2008CN101278395A Method of manufacturing laminated lead frame and laminated lead frame produced by the method
10/01/2008CN101278394A 半导体装置 Semiconductor device
10/01/2008CN101278393A Semiconductor package, substrate, electronic device using such semiconductor package or substrate, and method for correcting warping of semiconductor package
10/01/2008CN101278392A 多层印刷线路板 Multilayer printed circuit boards
10/01/2008CN101278387A Amine-free deposition of metal-nitride films
10/01/2008CN101278383A Electronic circuit device and method for manufacturing same
10/01/2008CN101278248A Semiconductor integrated circuit having current leakage reduction scheme
10/01/2008CN101277992A Epoxy resin composition and semiconductor device
10/01/2008CN101277603A Electromagnetic shield assembly
10/01/2008CN101277601A Laminated body
10/01/2008CN101277600A Cooling device
10/01/2008CN101277582A Printed circuit board and electronic apparatus
10/01/2008CN101277096A Semiconductor device
10/01/2008CN101276874A Semiconductor light-emitting device
10/01/2008CN101276869A Ceramic heat radiation substrate for sheet-shaped LED encapsulation
10/01/2008CN101276860A LED assembled body with ascendant light-permeating ratio and favorable heat radiation performance as well as assembled method
10/01/2008CN101276859A Semiconductor light emitting element
10/01/2008CN101276858A Radiator structure for semiconductor lamp body
10/01/2008CN101276840A Semiconductor memory device and method for manufacturing the same
10/01/2008CN101276838A Semiconductor device
10/01/2008CN101276834A Display apparatus and method for making the same
10/01/2008CN101276833A Organic electroluminescent display device and method of fabricating the same
10/01/2008CN101276832A LED chip with micro space connected in series through zinc oxide transparent electrodes and manufacturing process thereof
10/01/2008CN101276825A Semiconductor device
10/01/2008CN101276824A Semiconductor device and electronic device
10/01/2008CN101276820A Integrated circuit package body and manufacturing method thereof
10/01/2008CN101276818A Array of memory device and conductive line as well as method for manufacturing the same
10/01/2008CN101276816A Semiconductor device and method of manufacturing the same
10/01/2008CN101276812A Capacitor structure
10/01/2008CN101276811A Semiconductor device
10/01/2008CN101276810A Active array apparatus with electrostatic protection function
10/01/2008CN101276809A Semiconductor device and method of manufacturing the same
10/01/2008CN101276807A Semiconductor device and method of manufacturing the same
10/01/2008CN101276806A Bond wireless power module with double-sided single device cooling and immersion bath cooling
10/01/2008CN101276805A Semiconductor encapsulation structure with electromagnetic interference shield function and manufacturing method thereof
10/01/2008CN101276804A Semiconductor device test line structure integrated circuit test structure and test method
10/01/2008CN101276803A Semiconductor chip
10/01/2008CN101276802A Wiring structure and method of forming the same
10/01/2008CN101276801A Wafer with through-wafer vias and manufacture method thereof
10/01/2008CN101276800A Circuit board and method of manufacturing same
10/01/2008CN101276799A 半导体装置及其制造方法 Semiconductor device and manufacturing method
10/01/2008CN101276798A Isolated solder pads
10/01/2008CN101276797A Electric optical device
10/01/2008CN101276796A Carbon nanotube-reinforced solder caps methods of assembling same and chip packages and systems containing same
10/01/2008CN101276795A Semiconductor encapsulation construction
10/01/2008CN101276794A Flexible circuit electronic package with standoffs
10/01/2008CN101276793A Semiconductor device, heat sink, semiconductor chip, interposer substrate, and glass plate
10/01/2008CN101276792A Semicoductor epitaxy substrate, compound semiconductor device and manufacturing method thereof
10/01/2008CN101276791A Semiconductor wafer and process for its production
10/01/2008CN101276790A Method for preparing thin-film transistor array substrate and liquid crystal display panel
10/01/2008CN101276788A Method for improving electrostatic discharge protection performance of silicon circuit in insulators
10/01/2008CN101276780A Electronic device and method of manufacturing the same
10/01/2008CN101276779A Method of forming buried wiring lines, and substrate and display device using the same
10/01/2008CN101276763A Integrated circuit devices with integral heat sinks
10/01/2008CN101276762A 多芯片堆叠结构及其制法 Multi-chip stack structure Jiqizhifa
10/01/2008CN101276761A Method for manufacturing wiring board, method for manufacturing semiconductor device and wiring board
10/01/2008CN101276760A Method for manufacturing wiring substrate with solder protrusion; and wiring substrate
10/01/2008CN101276672A Inductive devices with granular magnetic materials
10/01/2008CN101276638A Semiconductor memory device using ferroelectric device and method for refresh thereof
10/01/2008CN101276548A Display apparatus, display apparatus driving method therefor and electronic equipment
10/01/2008CN101275736A Heat radiation structure
10/01/2008CN101275735A High-power LED lamp structure and manufacturing method thereof
10/01/2008CN101275734A High-power LED heat radiating device
10/01/2008CN101275209A Thermal interfacial material and method for preparing same
10/01/2008CN101274741A Micro movable device, wafer, and method of manufacturing wafer
10/01/2008CN100423562C 光学装置模块 The optical device module
10/01/2008CN100423304C Package for semiconductor light emitting element and semiconductor light emitting device
10/01/2008CN100423294C Semiconductor device exhibiting enhanced pattern recognition when illuminated
10/01/2008CN100423277C Manufacturing method of semiconductor wafer having lid part and manufacturing method of semiconductor device
10/01/2008CN100423276C Semiconductor device and its producing method
10/01/2008CN100423275C TFT LCD array substrate peripheral wiring structure and its producing method
10/01/2008CN100423269C Method for forming storage node of capacitor in semiconductor device
10/01/2008CN100423259C Stacked electronic part
10/01/2008CN100423258C Semiconductor device and its mfg. method
10/01/2008CN100423256C Low voltage silicon controlled rectifier (SCR) for electrostatic discharge (ESD) protection on silicon-on-insulator technologies
10/01/2008CN100423255C Semiconductor devices with wire bond inductor and method
10/01/2008CN100423254C Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same
10/01/2008CN100423253C Resin molded type semiconductor device and a method of manufacturing the same
10/01/2008CN100423252C Low profile integrated module interconnects
10/01/2008CN100423251C Semiconductor device package and lead frame with die overhanging lead frame pad
10/01/2008CN100423250C Double layer lead wire package structure and its producing method
10/01/2008CN100423249C N shape electric connectioned wafer stage chip size packaging structure and mfg. method thereof
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