Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2008
11/06/2008US20080272476 Through-Hole Via On Saw Streets
11/06/2008US20080272475 Air Cavity Package for a Semiconductor Die and Methods of Forming the Air Cavity Package
11/06/2008US20080272474 Apparatus for integrated circuit cooling during testing and image based analysis
11/06/2008US20080272473 Optical device and method of manufacturing the same
11/06/2008US20080272472 Semiconductor packaging device comprising a semiconductor chip including a MOSFET
11/06/2008US20080272471 Electro-optical device and electronic apparatus
11/06/2008US20080272470 Same Size Through-Hole Via Die Stacked Package
11/06/2008US20080272469 Semiconductor die package and integrated circuit package and fabricating method thereof
11/06/2008US20080272468 Grounded shield for blocking electromagnetic interference in an integrated circuit package
11/06/2008US20080272466 Semiconductor substrates including vias of nonuniform cross section and associated structures
11/06/2008US20080272465 Semiconductor Die with Through-Hole Via on Saw Streets and Through-Hole Via in Active Area of Die
11/06/2008US20080272464 Semiconductor Wafer Having Through-Hole Vias on Saw Streets with Backside Redistribution Layer
11/06/2008US20080272461 Capture of residual refractory metal within semiconductor device
11/06/2008US20080272456 Semiconductor device and method of manufacturing the same
11/06/2008US20080272440 Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage
11/06/2008US20080272385 Light emitting diode
11/06/2008US20080272371 Resistance-based etch depth determination for sgt technology
11/06/2008US20080272333 Hydrogen Getter
11/06/2008US20080272297 Scanning electron microscope and CD measurement calibration standard specimen
11/06/2008US20080272180 Method of manufacturing heat spreader module
11/06/2008DE112007000161T5 Halbleitergerät für Hochfrequenz Semiconductor device for high frequency
11/06/2008DE102008020452A1 Verfahren zur Erzeugung eines Layouts, Verwendung eines Transistorlayouts und Halbleiterschaltung A method of generating a layout, using a transistor and semiconductor circuit layouts
11/06/2008DE102008019336A1 Halbleiterbausteinpackung zur Verbesserung der Funktion von Wärmeableitung und Erdungsabschirmung Semiconductor device package to improve the function of heat dissipation and ground shield
11/06/2008DE102008015709A1 Elektrische Einrichtung mit Abdeckung An electrical device with cover
11/06/2008DE102008000261A1 Semiconductor device has cap electrical conductivity regions that function as draw-out electrical conductivity regions of cap substrate, are electrically connected to movable and fixed base semiconductor regions of base substrate
11/06/2008DE102007021402A1 Integrierter Verstärkerschaltkreis Integrated amplifier circuit
11/06/2008DE102007021206A1 Heat sink for semiconductor component, has electrical or electronic component, which is thermally connected with heat sink, and medium is provided, for supplying of coolant by force
11/06/2008DE102007020288A1 Elektrisches Bauelement Electrical component
11/06/2008DE102007020269A1 Halbleiterstruktur mit einer elektrischen Verbindung und Verfahren zu ihrer Herstellung Semiconductor structure having an electrical connection and processes for their preparation
11/06/2008DE102007020263A1 Verankerungsstruktur und Verkrallungsstruktur Anchoring structure and Verkrallungsstruktur
11/06/2008DE102007020257A1 Vereinheitlichte Teststruktur für belastungsabhängige Materialwanderungsprüfungen Standardized test structure for load-dependent migration of material tests
11/06/2008DE102007020252A1 Technik zur Herstellung von Metallleitungen in einem Halbleiter durch Anpassen der Temperaturabhängigkeit des Leitungswiderstands Art for the preparation of metal lines in a semiconductor by adjusting the temperature dependence of the cable resistance
11/06/2008DE102007020249A1 Semiconductor component e.g. power field effect transistor, has contact surface enclosing opening region exhibits transverse opening region with elongated extension that cuts measuring strip transversely or perpendicularly
11/06/2008DE102007019885A1 Kühlkörper Heat Sink
11/06/2008DE102007019811A1 Crcuit for use with system with received signal way or transmission signal path, has contact for electrically attaching circuit, and coil, which is arranged around contact
11/06/2008DE102007019795A1 Chipmodul und Verfahren zum Herstellen dieses Chipmoduls Chip module and method of manufacturing this chip module
11/06/2008DE102007019093A1 Room temperature regulator, has temperature sensor for delivering electric signal, and active unit i.e. Peltier element, for cooling electronic component and CPU, which are provided for evaluating electrical signal of temperature sensor
11/06/2008DE102007016222B3 Leistungshalbleitermodul in Druckkontaktausführung sowie Verfahren zur Herstellung desselben The power semiconductor module in pressure contact design of the same and processes for preparing
11/06/2008DE102007014789B3 Anordnung mindestens eines Leistungshalbleitermoduls und einer Leiterplatte und Leistungshalbleitermodul Arranging at least one power semiconductor module and a printed circuit board and the power semiconductor module
11/05/2008EP1988762A2 Phase change cooled power electronic module
11/05/2008EP1988761A2 Phase change cooled electrical connections for power electronic devices
11/05/2008EP1988580A1 Optical device cooling apparatus and method
11/05/2008EP1988575A2 Semiconductor device
11/05/2008EP1988574A1 Semiconductor device
11/05/2008EP1988573A2 Highly reliable low-cost structure for wafer-level ball grid array packaging
11/05/2008EP1988572A1 Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips
11/05/2008EP1988571A2 High power semiconductor package with dual-sided heat sinking
11/05/2008EP1988569A2 Method of manufacturing a terminal of a power semiconductor component and electronic component with a terminal manufactured in this manner
11/05/2008EP1987536A2 Method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding device
11/05/2008EP1987535A1 Vias and method of making
11/05/2008EP1987532A1 Method for producing planar insulating layers with breakthroughs at the correct position by means of laser cutting and devices produced accordingly
11/05/2008EP1987169A1 Bonding wire
11/05/2008EP1824779B1 Device and method for hermetically sealing a cavity in an electronic component
11/05/2008EP1602130A4 Lead frame with included passive devices
11/05/2008EP1507267B1 Wiring material and wiring board using the same
11/05/2008EP1430551B1 Improved sealing method for oled devices
11/05/2008EP1357597B1 Voltage converter module
11/05/2008CN201146662Y Radiator
11/05/2008CN201146661Y Heat radiation structure for module power supply
11/05/2008CN201146660Y Multi-direction type hot pipe composite structure and radiating device with the structure
11/05/2008CN201146658Y Radiating device for bare element slot
11/05/2008CN201146657Y Electronic component and radiator for electronic chip
11/05/2008CN201146452Y Control box for mining flame-proof type industrial-mineral electric locomotive
11/05/2008CN201146197Y Led device and fluorescence casing thereof
11/05/2008CN201146196Y Encapsulation structure of LED
11/05/2008CN201146192Y High-power P type MOS device for deep groove
11/05/2008CN201146191Y High-power N type MOS device for deep groove
11/05/2008CN201146190Y Lead frame
11/05/2008CN201146188Y Side edge type LED structure
11/05/2008CN201146186Y Electrostatic discharge protecting circuit
11/05/2008CN201146185Y Carrier plate for packaging semiconductor
11/05/2008CN201146184Y Radiator for glass heat pipe
11/05/2008CN201146183Y 半导体功率模块 Semiconductor power module
11/05/2008CN201146182Y CPU fan
11/05/2008CN201146181Y Inclined-tower type heat pipe radiator for micro-processor
11/05/2008CN201146180Y Ceramic casing of integral water-cooling heat radiation thyristor
11/05/2008CN201146179Y Complete-crimp-connection rapid heat radiation type ceramic casing
11/05/2008CN201145875Y Radiating fin
11/05/2008CN201145249Y High cooling package substrate of high luminance LED
11/05/2008CN201145248Y LED lighting lamp with cooling structure
11/05/2008CN201145246Y Light emitting diode component
11/05/2008CN201145245Y LED cup lamp
11/05/2008CN201145244Y Self-refrigeration cooling LED lamp
11/05/2008CN201145221Y LED lamp
11/05/2008CN201145190Y Novel power type hot pipe cooling structure of LED automobile lamp
11/05/2008CN201145180Y LED ceiling lamp
11/05/2008CN201145167Y Integral ventilated water proof heat radiating device road lamp with high-power LED
11/05/2008CN101300913A Spaced, bumped component structure
11/05/2008CN101300911A Circuit module and method for manufacturing circuit module
11/05/2008CN101300677A Electrically programmable fuse
11/05/2008CN101300676A Surface treatments for contact pads used in semiconductor chip packages and methods of providing such surface treatments
11/05/2008CN101300675A Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed fingers
11/05/2008CN101300674A An air cavity package for a semiconductor die and methods of forming the air cavity package
11/05/2008CN101300671A Method for bonding electronic components
11/05/2008CN101299441A Thin-film transistor, thin-film transistor array substrate, display panel and optoelectronic device
11/05/2008CN101299439A High pressure resistant constant-current source device and production method
11/05/2008CN101299435A Organic electro luminescent display and method for fabricating the same
11/05/2008CN101299433A Image pickup member module, lens unit using the same and portable electronic device
11/05/2008CN101299432A Optical device and method of manufacturing the same
11/05/2008CN101299431A Display panel and method for producing thin-film transistor substrate
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