| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 11/11/2008 | US7449785 Solder bump on a semiconductor substrate |
| 11/11/2008 | US7449784 Device package and methods for the fabrication and testing thereof |
| 11/11/2008 | US7449783 Nonlinear via arrays for resistors to reduce systematic circuit offsets |
| 11/11/2008 | US7449781 Printed wiring board |
| 11/11/2008 | US7449780 Apparatus to minimize thermal impedance using copper on die backside |
| 11/11/2008 | US7449779 Wire bonded wafer level cavity package |
| 11/11/2008 | US7449778 Power semiconductor module as H-bridge circuit and method for producing the same |
| 11/11/2008 | US7449777 Circuit arrangement comprising a power component and a drive circuit integrated in two semiconductor bodies |
| 11/11/2008 | US7449776 Cooling devices that use nanowires |
| 11/11/2008 | US7449775 Integrated thermal solution for electronic packages with materials having mismatched coefficient of thermal expansion |
| 11/11/2008 | US7449774 Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same |
| 11/11/2008 | US7449773 Microelectromechanical device packages with integral heaters |
| 11/11/2008 | US7449772 Chip-type electronic component including thin-film circuit elements |
| 11/11/2008 | US7449771 Multiple leadframe laminated IC package |
| 11/11/2008 | US7449770 Substrate with slot |
| 11/11/2008 | US7449768 Electromagnetic wave shielding sheet |
| 11/11/2008 | US7449765 Semiconductor device and method of fabrication |
| 11/11/2008 | US7449762 Lateral epitaxial GaN metal insulator semiconductor field effect transistor |
| 11/11/2008 | US7449752 Post passivation interconnection schemes on top of the IC chips |
| 11/11/2008 | US7449751 High voltage operating electrostatic discharge protection device |
| 11/11/2008 | US7449750 Semiconductor protection device |
| 11/11/2008 | US7449744 Non-volatile electrically alterable memory cell and use thereof in multi-function memory array |
| 11/11/2008 | US7449716 Bond quality indication by bump structure on substrate |
| 11/11/2008 | US7449412 Interconnect circuitry, multichip module, and methods of manufacturing thereof |
| 11/11/2008 | US7449408 Method for manufacturing semiconductor device |
| 11/11/2008 | US7449407 Air gap for dual damascene applications |
| 11/11/2008 | US7449406 Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same |
| 11/11/2008 | US7449405 Method for producing bumps on an electrical component |
| 11/11/2008 | US7449370 Production process for manufacturing such semiconductor package |
| 11/11/2008 | US7449368 Technique for attaching die to leads |
| 11/11/2008 | US7449367 Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device |
| 11/11/2008 | US7449364 Device and method for including passive components in a chip scale package |
| 11/11/2008 | US7449363 Semiconductor package substrate with embedded chip and fabrication method thereof |
| 11/11/2008 | US7449362 One-component hot-setting epoxy resin composition and semiconductor mounting underfill material |
| 11/11/2008 | US7449076 Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame |
| 11/11/2008 | US7449067 Method and apparatus for filling vias |
| 11/11/2008 | US7448882 Connector |
| 11/11/2008 | US7448861 Resin molded semiconductor device and mold |
| 11/11/2008 | US7448439 Heat exchanger |
| 11/11/2008 | US7448396 Apparatus and method of removing particles |
| 11/11/2008 | US7448126 Coupler resource module |
| 11/06/2008 | WO2008134611A1 Radio frequency absorber |
| 11/06/2008 | WO2008134427A1 Leadframe configuration to enable strip testing of sot-23 packages and the like |
| 11/06/2008 | WO2008134426A2 Leadframe configuration to enable strip testing of sot-23 packages and the like |
| 11/06/2008 | WO2008134021A1 Active control of time-varying spatial temperature distribution |
| 11/06/2008 | WO2008133920A1 Thin-film aluminum nitride encapsulant for metallic structures on integrated circuits and method of forming same |
| 11/06/2008 | WO2008133832A1 A technique for enhancing transistor performance by transistor specific contact design |
| 11/06/2008 | WO2008133594A2 Cooling device for electronic components |
| 11/06/2008 | WO2008133403A1 Low-temperature-cofired-ceramic package and method of manufacturing the same |
| 11/06/2008 | WO2008133211A1 Thermally conductive compound and process for producing the same |
| 11/06/2008 | WO2008133210A1 Semiconductor device |
| 11/06/2008 | WO2008133108A1 Epoxy silicone and method for production thereof, and curable resin composition using the same and use thereof |
| 11/06/2008 | WO2008132997A1 Optical semiconductor device |
| 11/06/2008 | WO2008132814A1 Substrate with built-in component, electronic module using the same and electronic device |
| 11/06/2008 | WO2008132561A1 Integrated circuit, electronic device and esd protection therefor |
| 11/06/2008 | WO2008132056A1 Cooling box for components or circuits |
| 11/06/2008 | WO2008131713A2 Apparatus for the production of a rigid power module |
| 11/06/2008 | WO2008131587A1 Heat pipe and manufacturing method thereof |
| 11/06/2008 | WO2008099327A3 Embedded inductor and method of producing thereof |
| 11/06/2008 | WO2008093273A3 Sensing circuit for devices with protective coating |
| 11/06/2008 | WO2008091840A3 Stress free package and laminate-based isolator package |
| 11/06/2008 | WO2008087373B1 Structures with improved properties |
| 11/06/2008 | WO2008084272A3 Compact apparatus |
| 11/06/2008 | WO2008076080A3 A clamping assembly |
| 11/06/2008 | WO2008014163A3 Synergistically-modified surfaces and surface profiles for use with thermal interconnect and interface materials, methods of production and uses thereof |
| 11/06/2008 | WO2007034377A3 Composite layer having improved adhesion, and fluid focus lens incorporating same |
| 11/06/2008 | US20080274612 Shielded capacitor structure |
| 11/06/2008 | US20080274596 Semiconductor device and method of manufacturing the same |
| 11/06/2008 | US20080274588 Semiconductor device and method of fabricating the same, circuit board, and electronic instrument |
| 11/06/2008 | US20080273830 System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
| 11/06/2008 | US20080273411 Fuse of a semiconductor memory device and repair process for the same |
| 11/06/2008 | US20080273157 Display device having misalignment detection pattern for detecting misalignment between conductive layer and insulating layer |
| 11/06/2008 | US20080272504 Package-in-Package Using Through-Hole via Die on Saw Streets |
| 11/06/2008 | US20080272503 Semiconductor Device and Method for Making Same |
| 11/06/2008 | US20080272502 Packaging board and manufacturing method therefor, semiconductor module and manufacturing method therefor, and portable device |
| 11/06/2008 | US20080272501 Semiconductor package substrate structure and manufacturing method thereof |
| 11/06/2008 | US20080272500 Semiconductor device and method for manufacturing semiconductor device |
| 11/06/2008 | US20080272499 Through-wafer vias |
| 11/06/2008 | US20080272498 Method of fabricating a semiconductor device |
| 11/06/2008 | US20080272497 Methods of forming conductive vias through substrates, and structures and assemblies resulting therefrom |
| 11/06/2008 | US20080272496 Planar interconnect structure for hybrid circuits |
| 11/06/2008 | US20080272495 Semiconductor device having high-frequency interconnect |
| 11/06/2008 | US20080272494 Semiconductor device |
| 11/06/2008 | US20080272493 Semiconductor device |
| 11/06/2008 | US20080272492 Method of blocking a void during contact formation process and device having the same |
| 11/06/2008 | US20080272491 Manufacturing of a semiconductor device and the manufacturing method |
| 11/06/2008 | US20080272490 Semiconductor device including ruthenium electrode and method for fabricating the same |
| 11/06/2008 | US20080272489 Package substrate and its solder pad |
| 11/06/2008 | US20080272488 Semiconductor Device |
| 11/06/2008 | US20080272487 System for implementing hard-metal wire bonds |
| 11/06/2008 | US20080272486 Chip package structure |
| 11/06/2008 | US20080272485 Liquid cooled power electronic circuit comprising stacked direct die cooled packages |
| 11/06/2008 | US20080272484 Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips |
| 11/06/2008 | US20080272483 High power package with dual-sided heat sinking |
| 11/06/2008 | US20080272482 Integrated Circuit Package With Top-Side Conduction Cooling |
| 11/06/2008 | US20080272481 Pin grid array package substrate including slotted pins |
| 11/06/2008 | US20080272480 Land grid array semiconductor package |
| 11/06/2008 | US20080272479 Integrated circuit package system with device cavity |
| 11/06/2008 | US20080272478 Circuit and method for interconnecting stacked integrated circuit dies |
| 11/06/2008 | US20080272477 Package-on-Package Using Through-Hole Via Die on Saw Streets |