Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2008
11/12/2008CN101304061A Method for making soldering-free type LED and structure thereof
11/12/2008CN101304060A White light LED and base thereof
11/12/2008CN101304044A Semiconductor device and method of forming the same
11/12/2008CN101304039A Advanced mram design
11/12/2008CN101304033A Display device and manufacturing method thereof
11/12/2008CN101304032A Pixel structure and drive method thereof
11/12/2008CN101304031A Ciucuit structure and manufacturing method thereof
11/12/2008CN101304026A Layout method for mask, semiconductor device and method for manufacturing the same
11/12/2008CN101304025A Mask layout method, and semiconductor device and method for fabricating the same
11/12/2008CN101304024A Semiconductor device and method for manufacturing the same
11/12/2008CN101304023A Passivation layer of IC chip
11/12/2008CN101304022A 多芯片电子系统 Multi-chip electronic system
11/12/2008CN101304020A Test mechanism for testing chip fabrication defect and manufacturing method thereof
11/12/2008CN101304019A Integrate circuit device and forming method thereof
11/12/2008CN101304018A Image display system
11/12/2008CN101304017A Sintered high performance semiconductor substrate and corresponding production method
11/12/2008CN101304016A All-purpose test encapsulation structure and method
11/12/2008CN101304015A Semiconductor device and manufacturing method thereof
11/12/2008CN101304014A Semiconductor chip and manufacturing method thereof
11/12/2008CN101304013A Method for preventing top layer metallic layer on encapsulation chip from fracturing
11/12/2008CN101304012A High performance semiconductor substrate with metal contact layer and corresponding production method
11/12/2008CN101304011A Power semiconductor device and manufacturing method thereof, electronic apparatus and lead frame component
11/12/2008CN101304010A Thin type power module
11/12/2008CN101304009A Semiconductor device and method for manufacturing the same
11/12/2008CN101304008A Stress layer structure
11/12/2008CN101303990A Manufacturing method of semiconductor module, semiconductor module and portable apparatus
11/12/2008CN101303984A Method of manufacturing semiconductor device
11/12/2008CN101303983A Heat radiation type semiconductor encapsulation structure and manufacturing method thereof
11/12/2008CN101303981A Wiring panel with build-in components and manufacturing method thereof
11/12/2008CN101303980A Surface adhesion type diode support and method for manufacturing the same
11/12/2008CN101303889A Memory cell and method for manufacturing non-volatile apparatus thereof
11/12/2008CN101303498A Liquid crystal display device
11/12/2008CN100433961C Electronic device cooling apparatus and method for forecasting and cooling temperature of electronic equipment
11/12/2008CN100433959C Rectifier module of using heat pipe for heat dispersion
11/12/2008CN100433955C Wiring plate and circuit module
11/12/2008CN100433951C Inductor element containing circuit board and power amplifier module
11/12/2008CN100433950C Film substrate, fabrication method thereof, and image display substrate
11/12/2008CN100433551C Surface acoustic wave device and its mfg. method
11/12/2008CN100433472C IC socket assembly
11/12/2008CN100433392C Special finned pipe shaped radiator for semiconductor refrigeration unit and its preparation method
11/12/2008CN100433391C A large power LED using porous metal material as heat emission device
11/12/2008CN100433390C Side-view light emitting diode having improved side-wall reflection structure
11/12/2008CN100433362C Organic electroluminescence device with plane sandwiched structure
11/12/2008CN100433344C Optical device
11/12/2008CN100433343C Solid-state imaging device and method for manufacturing the same
11/12/2008CN100433339C Solid-state imaging device and method for producing the same
11/12/2008CN100433338C Baseplate structure of thin film transistor device array, and preparation method
11/12/2008CN100433337C Structure of pixel electrode of preventing DGS, and fabricating method
11/12/2008CN100433335C Electronically programmable antifuse and circuits made therewith
11/12/2008CN100433331C Semiconductor device and manufacturing method therefor
11/12/2008CN100433327C Chip packaging body and stack chip packaging structure
11/12/2008CN100433325C Laser mark on integrated circuit element
11/12/2008CN100433324C Semiconductor device
11/12/2008CN100433323C Electronic member
11/12/2008CN100433322C The encapsulation of integrated circuit chip without lead
11/12/2008CN100433321C Circuit board and circuit apparatus using the same
11/12/2008CN100433320C Chip package structure and lug manufacturing process
11/12/2008CN100433319C Integrated connection arrangement and production method
11/12/2008CN100433318C Substrate for manufacturing semiconductor device, semiconductor device manufacturing method
11/12/2008CN100433317C Packaging module with metal studs formed on solder pads, packaging, base board structure and packaging method
11/12/2008CN100433316C Lead free alloys for column/ball grid arrays, organic interposers and passive component assembly
11/12/2008CN100433315C Radiator for semiconductor
11/12/2008CN100433314C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
11/12/2008CN100433313C Method and device for heat dissipation in semiconductor modules
11/12/2008CN100433312C Thermally conductive sheet and method for producing the same
11/12/2008CN100433311C Thermal interface material with aligned carbon nanotubes
11/12/2008CN100433310C Heat radiating member
11/12/2008CN100433309C Heat radiator
11/12/2008CN100433308C Radiating fin and its packing structure
11/12/2008CN100433307C Radiator fastening structure
11/12/2008CN100433306C Device mounting board and semiconductor apparatus using the same
11/12/2008CN100433305C Circuit-component carrying substrate
11/12/2008CN100433304C Basilar plate strip for transparent package
11/12/2008CN100433303C Semiconductor device, module for optical devices, and manufacturing method of semiconductor device
11/12/2008CN100433302C Semiconductor micro device
11/12/2008CN100433301C Solid-state imaging device
11/12/2008CN100433300C 封装组件和半导体封装 Package assembly and semiconductor packaging
11/12/2008CN100433296C Contactor device of semiconductor integrated element
11/12/2008CN100433293C Interconnection structure and method for forming the same
11/12/2008CN100433281C Semiconductor integrated circuit having connection pads over active elements
11/12/2008CN100433279C Manufacturing method of a semiconductor device
11/12/2008CN100433278C Radiation type packaging structure and its making method
11/12/2008CN100433277C Method for producing semiconductor device
11/12/2008CN100433178C Memory circuit element application apparatus
11/12/2008CN100433083C Drive chip and display device with the same
11/12/2008CN100432589C Expansion tank device, process for fabricating expansion tank device, and liquid cooling radiator
11/12/2008CN100432130C Epoxy resin compositions containing phosphorus and its uses
11/12/2008CN100432063C Epoxy compound, preparation method thereof, and use thereof
11/11/2008US7450393 Driver chip and display apparatus including the same
11/11/2008US7450389 Sub-assembly
11/11/2008US7450378 Power module having self-contained cooling system
11/11/2008US7450358 ESD protective circuit for an electronic circuit having two or more supply voltages
11/11/2008US7450174 Two-dimensional image detector with disturbance-blocking buffer
11/11/2008US7449910 Test system for semiconductor components having conductive spring contacts
11/11/2008US7449792 Pattern registration mark designs for use in photolithography and methods of using the same
11/11/2008US7449791 Printed circuit boards and method of producing the same
11/11/2008US7449790 Methods and systems of enhancing stepper alignment signals and metrology alignment target signals
11/11/2008US7449788 Chip structure with arrangement of side pads
11/11/2008US7449787 Liquid crystal display
11/11/2008US7449786 Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors
1 ... 854 855 856 857 858 859 860 861 862 863 864 865 866 867 868 869 870 871 872 873 874 ... 2262