Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2008
11/13/2008US20080277800 Semiconductor package and method of forming the same
11/13/2008US20080277799 Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies
11/13/2008US20080277798 Semiconductor device and method for manufacturing the same
11/13/2008US20080277797 Interconnect structures
11/13/2008US20080277796 Electronic structures utilizing etch resistant boron and phosphorus materials and methods to form same
11/13/2008US20080277795 Semiconductor integrated circuit devices having upper pattern aligned with lower pattern molded by semiconductor substrate and methods of forming the same
11/13/2008US20080277794 semiconductor device and a method of manufacturing the same
11/13/2008US20080277793 Semiconductor Device and Manufacturing Method Thereof
11/13/2008US20080277792 Semiconductor Device and Method for Manufacturing the Same
11/13/2008US20080277791 Semiconductor Devices and Methods for Manufacturing the Same
11/13/2008US20080277790 Semiconductor Device
11/13/2008US20080277789 Damascene structure and opening thereof
11/13/2008US20080277788 Method for manufacturing a semiconductor device, and said semiconductor device
11/13/2008US20080277787 Method and pad design for the removal of barrier material by electrochemical mechanical processing
11/13/2008US20080277786 Semiconductor package substrate
11/13/2008US20080277785 Package structure for integrated circuit device and method of the same
11/13/2008US20080277784 Semiconductor chip and manufacturing method thereof
11/13/2008US20080277783 Printed circuit board and flip chip package using the same with improved bump joint reliability
11/13/2008US20080277782 Flash memory card
11/13/2008US20080277781 Multi-die molded substrate integrated circuit device
11/13/2008US20080277780 Electrical circuit device
11/13/2008US20080277779 Microelectronic package and method of manufacturing same
11/13/2008US20080277778 Layer Transfer Process and Functionally Enhanced Integrated Circuits Products Thereby
11/13/2008US20080277777 Heat dissipation semiconductor package
11/13/2008US20080277776 Substrate and multilayer circuit board
11/13/2008US20080277775 Ultra-thin near-hermetic package based on rainier
11/13/2008US20080277774 Power semiconductor device, electronic device, lead frame member, and method of making power semiconductor device
11/13/2008US20080277773 Circuit structures and methods with beol layer(s) configured to block electromagnetic interference
11/13/2008US20080277772 Methods of Packaging a Semiconductor Die and Package Formed by the Methods
11/13/2008US20080277771 Electronic Device Package Manufacturing Method and Electronic Device Package
11/13/2008US20080277770 Semiconductor device
11/13/2008US20080277769 Package Integrated Soft Magnetic Film for Improvement In On-Chip Inductor Performance
11/13/2008US20080277767 Semiconductor device including a planarized surface and method thereof
11/13/2008US20080277766 Polymer membranes for microcalorimeter devices
11/13/2008US20080277757 Ballasted polycrystalline fuse
11/13/2008US20080277755 Filling of Insulation Trenches Using Cmos-Standard Processes for Creating Dielectrically Insulated Areas on a Soi Disk
11/13/2008US20080277752 Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabrication
11/13/2008US20080277728 Semiconductor structure for protecting an internal integrated circuit and method for manufacturing the same
11/13/2008US20080277727 Apparatus and method for electrostatic discharge protection with p-well integrated components
11/13/2008US20080277715 Dielectric film and formation method thereof, semiconductor device, non-volatile semiconductor memory device, and fabrication method for a semiconductor device
11/13/2008US20080277661 Semiconductor device and method of manufacturing the same
11/13/2008US20080277660 Semiconductor Device, Manufacturing Method Thereof, and Measuring Method Thereof
11/13/2008US20080277659 Test structure for semiconductor chip
11/13/2008US20080277148 Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board
11/13/2008DE112006002983T5 Nanostrukturbasierte Verbindungsbaugruppe Nanostructure-based joint assembly
11/13/2008DE112006002916T5 Gestapelte Anordnung integrierter Schaltungsbausteine Stacked array integrated circuit chips
11/13/2008DE10330192B4 Verfahren zum Abscheiden einer porösen Haftvermittlungsschicht auf einer Oberfläche eines elektrisch leitenden Körpers sowie Verwendung des Verfahrens A method for depositing a porous adhesion-promoting layer on a surface of an electrically conductive body, and use of the method
11/13/2008DE10257681B4 Verfahren zum Herstellen einer integrierten Schaltungsanordnung, die eine Metallnitridschicht enthält, und integrierte Schaltungsanordnung A method of fabricating an integrated circuit arrangement that contains a metal nitride layer, and integrated circuit arrangement
11/13/2008DE102007021441A1 Electrically isolating heat conductor for heat dissipation of photovoltaic cells to heat sink, has body staying in good conductive connection with heat source, and another body separated from former body by good heat conducting layer
11/13/2008DE102007021073A1 Circuit configuration has two construction elements with contact surface in each element and contact surfaces is roughened and construction element is galvanically or mechanically connected
11/13/2008DE102006034175B4 Dichtes Hohlraumgehäuse für ein elektronisches Bauelement Dense cavity housing for an electronic component
11/13/2008DE102005038219B4 Integrierte Schaltungsanordnung mit Kondensator in einer Leitbahnlage und Verfahren zum Herstellen derselben Integrated circuit arrangement having a capacitor and interconnect layer in a method of manufacturing the same
11/13/2008DE102005012216B4 Oberflächenmontiertes Halbleiterbauteil mit Kühlkörper und Montageverfahren A surface mounted semiconductor component with the heat sink and mounting method
11/13/2008DE10126508B4 Vorrichtung mit mittels Spritzgusstechnik verpackten elektronischen Bauteilen, Spritzgusswerkzeug und Verfahren zum Verpacken von elektronischen Bauteilen Packaged device with electronic components by injection molding, injection-molding tool and method of packaging of electronic components
11/13/2008DE10105725B4 Halbleiterchip mit einem Substrat, einer integrierten Schaltung und einer Abschirmvorrichtung A semiconductor chip comprising a substrate, an integrated circuit and a shielding
11/13/2008DE10056387B4 Kühlvorrichtung und Verfahren zu deren Herstellung sowie Vorrichtung zur Durchführung des Verfahrens Cooling device and process for their preparation, and device for carrying out the method
11/13/2008CA2684916A1 Conductive ink and conductor
11/12/2008EP1991041A2 Spray cooling system
11/12/2008EP1990914A2 Integrated galvanic isolator using wireless transmission
11/12/2008EP1990834A2 Local Integration of Non-Linear Sheet in Integrated Circuit Packages for ESD/EOS Protection
11/12/2008EP1990833A2 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
11/12/2008EP1990832A2 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
11/12/2008EP1990831A2 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
11/12/2008EP1990830A1 Semi-conductor module
11/12/2008EP1990432A1 Semiconductor device, its manufacturing method, and sputtering target material for use in the method
11/12/2008EP1990389A1 Adhesive film
11/12/2008EP1989740A1 Solar cell marking method, and solar cell
11/12/2008EP1989735A2 No lead package with heat spreader
11/12/2008EP1989731A1 Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus
11/12/2008EP1576653A4 Semiconductor substrate having copper/diamond composite material and method of making same
11/12/2008EP1432528B1 Method for edge sealing barrier films
11/12/2008EP1402575B1 Vertically contacted stacked chips
11/12/2008EP1366522B1 Method of producing interconnects on an integrated circuit
11/12/2008EP1271647B1 Compound semiconductor device
11/12/2008EP1166354B1 Cooling system for pulsed power electronics
11/12/2008CN201150166Y Improved structure of radiating module
11/12/2008CN201150165Y Composite structure of plate-type heat conduction assembly
11/12/2008CN201150164Y Evacuation structure for heat between two sides of circuit board
11/12/2008CN201150163Y Water-cooled radiating module of electronic apparatus
11/12/2008CN201149874Y High-power LED support
11/12/2008CN201149869Y LED encapsulation structure
11/12/2008CN201149868Y Copper and aluminium composite plastic package crystal triode lead frame
11/12/2008CN201149867Y Non-pin semiconductor encapsulation structure
11/12/2008CN201149866Y Ceramic/metallic complex structure
11/12/2008CN201149230Y LED lamp chimney tube type pumping airflow heat radiating device
11/12/2008CN201149229Y LED lamp chimney tube type speed raising airflow heat radiating device
11/12/2008CN201149227Y LED lamp
11/12/2008CN201149226Y LED lamp water cooling heat radiating device
11/12/2008CN201149206Y Secondary optical designed LED
11/12/2008CN201149184Y Air convection cooling type high-power LED street light fitting
11/12/2008CN101305462A 物理上高度安全的多芯片组件 Physically highly secure multi-chip module
11/12/2008CN101305461A Leadframe-based IC-package with supply-reference comb
11/12/2008CN101305460A Cooling subassembly
11/12/2008CN101305459A IC component comprising a cooling arrangement
11/12/2008CN101305455A Package using array capacitor core
11/12/2008CN101305308A Diffusion barrier layer for mems devices
11/12/2008CN101304649A Radiating device and fan fixing rack thereof
11/12/2008CN101304648A Radiating device
11/12/2008CN101304644A Buckling device of radiator
11/12/2008CN101304062A Method for making soldering-free type LED and structure thereof
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