Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2008
11/19/2008CN100435308C Improved semiconductor wafer structure and its producing method
11/19/2008CN100435305C Method for manufacturing protection assembly for preventing electronic component from static discharge and electronic component of corresponding conformation
11/19/2008CN100435302C Method of fabricating a built-in chip type substrate
11/19/2008CN100435301C Fabrication method of semiconductor integrated circuit device
11/19/2008CN100435299C Method for preparing wiring placode
11/19/2008CN100435298C Wafer structure and bumping manufacturing process
11/19/2008CN100435297C 半导体装置及其制造方法 Semiconductor device and manufacturing method
11/19/2008CN100435284C Semiconductor device with low contact resistance and method for fabricating the same
11/19/2008CN100435275C Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, semiconductor chip mounting method and semiconductor chip packaging body and method
11/19/2008CN100435271C Alignment method, method for manufacturing a semiconductor device, substrate for a semiconductor device, electronic equipment
11/19/2008CN100435240C Semiconductor device
11/19/2008CN100435170C 存储卡 Memory Card
11/19/2008CN100434262C Carbon-carbon and/or metal-carbon fiber composite heat spreaders
11/18/2008US7454637 Voltage regulator having reduced droop
11/18/2008US7453302 Temperature compensated delay signals
11/18/2008US7453272 Electrical open/short contact alignment structure for active region vs. gate region
11/18/2008US7453162 Systems and methods for performing quantum computations
11/18/2008US7453161 Marker for alignment of non-transparent gate layer, method for manufacturing such a marker, and use of such a marker in a lithographic apparatus
11/18/2008US7453160 Simplified wafer alignment
11/18/2008US7453159 Semiconductor chip having bond pads
11/18/2008US7453158 Pad over active circuit system and method with meshed support structure
11/18/2008US7453157 Microelectronic packages and methods therefor
11/18/2008US7453156 Wire bond interconnection
11/18/2008US7453155 Method for fabricating a flip chip package
11/18/2008US7453153 Circuit device
11/18/2008US7453152 Device having reduced chemical mechanical planarization
11/18/2008US7453150 Three-dimensional face-to-face integration assembly
11/18/2008US7453149 Composite barrier layer
11/18/2008US7453148 Structure of dielectric layers in built-up layers of wafer level package
11/18/2008US7453147 Semiconductor device, its manufacturing method, and radio communication device
11/18/2008US7453146 High power MCM package with improved planarity and heat dissipation
11/18/2008US7453145 Electronics unit
11/18/2008US7453144 Thin film capacitors and methods of making the same
11/18/2008US7453143 High speed electronics interconnect and method of manufacture
11/18/2008US7453142 System and method for implementing transformer on package substrate
11/18/2008US7453141 Semiconductor device package, method of manufacturing the same, and semiconductor device
11/18/2008US7453140 Semiconductor chip assembly with laterally aligned filler and insulative base
11/18/2008US7453139 Compliant terminal mountings with vented spaces and methods
11/18/2008US7453138 Electronic circuit device and manufacturing method thereof
11/18/2008US7453136 Methods, systems, and apparatus for integrated circuit capacitors in capacitor arrays
11/18/2008US7453133 Silicide/semiconductor structure and method of fabrication
11/18/2008US7453128 Semiconductor device and method for fabricating the same
11/18/2008US7453105 Integrated circuit power supply network
11/18/2008US7453093 LED package and fabricating method thereof
11/18/2008US7452828 plural nanotubes mutually cross-link, formed in an arbitrary pattern on a surface of a base body; extremely fine and excellent in electrical characteristics
11/18/2008US7452808 Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding
11/18/2008US7452803 Method for fabricating chip structure
11/18/2008US7452802 Method of forming metal wiring for high voltage element
11/18/2008US7452798 Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip
11/18/2008US7452797 Solder deposition method and solder bump forming method
11/18/2008US7452756 Semiconductor device and manufacturing process thereof
11/18/2008US7452751 Semiconductor device and method of manufacturing the same
11/18/2008US7452747 Semiconductor package with contact support layer and method to produce the package
11/18/2008US7452734 Method of making a monitoring pattern to measure a depth and a profile of a shallow trench isolation
11/18/2008US7452732 Comparing identifying indicia formed using laser marking techniques to an identifying indicia model
11/18/2008US7452571 coating a semiconductor element mounted on a gold-plated printed circuit board with a curable silicone resin; andthen curing; board is subjected to preliminary treatment with a treatment agent comprising an acid anhydride group-containing alkoxysilane or a partial hydrolysis-condensation product thereof
11/18/2008US7451936 Module for contactless chip cards or identification systems
11/18/2008CA2467690C Hot melt conductor paste composition
11/18/2008CA2345463C Metal-carbon composite powders, methods for producing powders and devices fabricated from same
11/13/2008WO2008138011A1 Electronic assemblies without solder and methods for their manufacture
11/13/2008WO2008137731A1 Methods of forming conductive vias through substrates, and structures and assemblies resulting therefrom
11/13/2008WO2008137585A2 Circuit and method for interconnecting stacked integrated circuit dies
11/13/2008WO2008137511A1 Accessing or interconnecting integrated circuits
11/13/2008WO2008137288A1 Semiconductor packaging with internal wiring bus
11/13/2008WO2008137001A2 Semiconductor package having dimpled plate interconnections
11/13/2008WO2008136930A1 Lid structure for microdevice and method of manufacture
11/13/2008WO2008136543A1 Pcm attachment method and automatic machine thereof
11/13/2008WO2008136524A1 Solder bump forming method and solder bump forming apparatus
11/13/2008WO2008136454A1 Adamantane derivative, method for producing the same, resin composition containing the adamantane derivative and use thereof
11/13/2008WO2008136327A1 Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package
11/13/2008WO2008136272A1 Hydrotalcite compound, method for producing the same, inorganic ion scavenger, composition, and resin composition for sealing electronic component
11/13/2008WO2008136158A1 Substrate unit for display device, display device and wiring substrate unit
11/13/2008WO2008135806A1 Leaded stacked packages having integrated upper lead
11/13/2008WO2008135632A1 Conductive ink and conductor
11/13/2008WO2008135164A1 Cooling body
11/13/2008WO2008135142A2 Method for producing a circuit board having a cavity for the integration of components and circuit board and application
11/13/2008WO2008115608A3 Method and apparatus for cooling integrated circuit chips using recycled power
11/13/2008WO2008114208A3 Metal pads with reduced parasitic capacitance
11/13/2008WO2008112318A3 Fine pitch microcontacts and method for forming thereof
11/13/2008WO2008085559A3 Integrated circuit micro-cooler having tubes of a cnt array in essentially the same height over a surface
11/13/2008WO2007127770A3 Improved cmos diodes with dual gate conductors, and methods for forming the same
11/13/2008WO2004095524A3 Semiconductor alignment aid
11/13/2008US20080282210 System And Method For Product Yield Prediction
11/13/2008US20080280446 Method of producing a microscopic hole in a layer and integrated device with a microscopic hole in a layer
11/13/2008US20080280395 Semiconducting device with stacked dice
11/13/2008US20080280394 Systems and methods for post-circuitization assembly
11/13/2008US20080280393 Methods for forming package structures
11/13/2008US20080280381 Method of forming a fine pattern of a semiconductor device using a resist reflow measurement key
11/13/2008US20080280105 Etch Method
11/13/2008US20080279252 Apparatus and method for measuring local surface temperature of semiconductor device
11/13/2008US20080279239 Semiconductor Laser Device and Method of Manufacturing the Same
11/13/2008US20080278241 Device Comprising an Element with Electrodes Coupled to Connections
11/13/2008US20080278190 Testing fuse configurations in semiconductor devices
11/13/2008US20080277841 Ceramic base material
11/13/2008US20080277806 Semiconductor wafer with assisting dicing structure and dicing method thereof
11/13/2008US20080277805 Semiconductor Device
11/13/2008US20080277804 Mask Layout Method, and Semiconductor Device and Method for Fabricating the Same
11/13/2008US20080277803 Semiconductor device
11/13/2008US20080277802 Flip-chip semiconductor package and package substrate applicable thereto
11/13/2008US20080277801 Semiconductor component and production method
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