Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2008
11/19/2008CN201153359Y Heat radiating fin
11/19/2008CN201153358Y Vortex guiding heat radiating device
11/19/2008CN201153357Y Cooling system of electronic element heat source
11/19/2008CN201153356Y Temperature equalizing heat transferring device
11/19/2008CN201153128Y Encapsulation construction of LED
11/19/2008CN201153127Y Sheet type LED with double side encapsulated
11/19/2008CN201153122Y Semiconductor rectifier device
11/19/2008CN201153121Y Omnidirectional luminous diode construction
11/19/2008CN201153120Y Wireless communication module encapsulation construction
11/19/2008CN201152512Y LED lamp chimney tube-type accelerated airflow heat radiating device
11/19/2008CN201152511Y Improved lamp set structure
11/19/2008CN201152510Y Fluorescent lamp type light-emitting diode lamp
11/19/2008CN201152509Y Straight-inserting type LED road lamp heat radiating device
11/19/2008CN201152508Y LED lamp improvement structure
11/19/2008CN201152507Y LED lamp
11/19/2008CN201152471Y LED illumination light tube
11/19/2008CN101310384A A method of substrate manufacture that decreases the package resistance
11/19/2008CN101310383A Enhancing shock resistance in semiconductor packages
11/19/2008CN101310382A 热交换增强 Heat exchange enhancement
11/19/2008CN101310381A Semiconductor package, method of producing the same, semiconductor module, and electronic apparatus
11/19/2008CN101310380A Semiconductor package, electronic parts, and electronic device
11/19/2008CN101310379A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
11/19/2008CN101310038A Composition for chemical vapor deposition film-formation and method for production of low dielectric constant film
11/19/2008CN101309577A Heat sink and method of making same
11/19/2008CN101309576A Thermally conductive sheet and method of manufacturing the same
11/19/2008CN101309575A Combination of cooling device and fastener thereof
11/19/2008CN101309574A Combination of cooling device
11/19/2008CN101309572A Heat radiating device
11/19/2008CN101309569A Fastener and combination of cooling device
11/19/2008CN101309568A Fastener
11/19/2008CN101309550A Circuit board and electronic device applying the same
11/19/2008CN101308886A Light-emitting component construction and manufacturing process
11/19/2008CN101308865A Organic electroluminescence display device
11/19/2008CN101308864A Electro-luminescence device and method of manufacturing electro-luminescence device
11/19/2008CN101308857A Image sensor and method for manufacturing the same
11/19/2008CN101308855A Electrode assembly, electronic paper and liquid crystal display
11/19/2008CN101308854A Thin film transistor array panel and method of manufacturing the same
11/19/2008CN101308852A Integrated circuit, method for manufacufacturing the circuit, storage module, computer system
11/19/2008CN101308851A Non-gate nonvolatile semiconductor memory and manufacturing method therefor
11/19/2008CN101308850A Storage having surface tape and forming method thereof
11/19/2008CN101308846A Semiconductor device
11/19/2008CN101308845A Semiconductor device and method for manufacturing the same
11/19/2008CN101308844A Semiconductor structure and manufacture method thereof
11/19/2008CN101308842A Stacked package, method of manufacturing the same, and memory card having the stacked package
11/19/2008CN101308841A Semiconductor light emitting diode
11/19/2008CN101308840A Multi-wafer 3d cam cell and manufacture process
11/19/2008CN101308839A Compact multi-port cam cell implemented in 3d vertical integration
11/19/2008CN101308838A Flip LED integrated chip with high break-over voltage
11/19/2008CN101308836A Light emitting diode, light emitting diode component and llight emitting diode lamp string
11/19/2008CN101308835A Semiconductor device and method of manufacturing the same
11/19/2008CN101308834A Integrated circuit construction
11/19/2008CN101308833A Circuit substrate, molding semiconductor device, tray and inspection socket
11/19/2008CN101308832A Lead frame for leadless encapsulation, encapsulation construction and manufacture method thereof
11/19/2008CN101308831A Lead frame of leadless encapsulation and encapsulation construction thereof
11/19/2008CN101308830A Lead frame for semiconductor encapsulation
11/19/2008CN101308829A Semiconductor device and method for manufacturing BOAC/COA
11/19/2008CN101308828A Great power LED cooling method
11/19/2008CN101308827A Cooling type semiconductor package
11/19/2008CN101308826A Novel integrated water-cooling thyristor ceramic housing
11/19/2008CN101308825A Integrated circuit contruction
11/19/2008CN101308823A Layout structure of nonvolatile semiconductor memory and preparation method thereof
11/19/2008CN101308812A Method of fabricating semiconductor device having self-aligned contact plug and related device
11/19/2008CN101308810A Semiconductor circuit construction and manufacturing process
11/19/2008CN101308804A Encapsulation construction of radio frequency module and manufacturing method thereof
11/19/2008CN101308803A 半导体器件 Semiconductor devices
11/19/2008CN101308802A Semiconductor device of sensing type and its manufacture
11/19/2008CN101308799A Wiring board connection method and wiring board
11/19/2008CN101308793A Integrated circuit construction and forming method thereof
11/19/2008CN101308728A Plated terminations
11/19/2008CN101308198A Magnetic sensor and method for compensating magnetic sensor temperature correlated characteristic
11/19/2008CN101308161A Electronic device having molded resin case, and molding tool and method of manufacturing the same
11/19/2008CN101307998A Heat pipe radiator
11/19/2008CN101307997A Heat pipe radiator
11/19/2008CN101307996A Flat-plate evaporators structure and loop type hot pipe possessing flat-plate evaporators structure
11/19/2008CN101307893A 照明装置 Lighting device
11/19/2008CN101307892A 大功率led灯 High power led lights
11/19/2008CN101307891A Highly effective radiation LED lamps
11/19/2008CN101307867A Liquid immersion type packaged large power LED light source
11/19/2008CN101307220A Organosilicon modified polyester electronic packaging material
11/19/2008CN101307183A Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method
11/19/2008CN100435609C Pulse heat pipe radiator for electronic cooling
11/19/2008CN100435604C Composite multi-layer substrate and module using the substrate
11/19/2008CN100435365C Light-emitting diode, backlight device and method of manufacturing the light-emitting diode
11/19/2008CN100435347C Fabrication of semiconductor devices
11/19/2008CN100435342C Contact image display structure
11/19/2008CN100435335C Method for manufacturing semiconductor device and semiconductor device
11/19/2008CN100435334C Semiconductor device and its mfg. method
11/19/2008CN100435333C 电力半导体装置 Power semiconductor devices
11/19/2008CN100435332C Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof
11/19/2008CN100435331C Method for producing microsystems
11/19/2008CN100435330C Integrated circuit with plane type connection
11/19/2008CN100435329C Micro lead frame package and method to manufacture the micro lead frame package
11/19/2008CN100435328C Molded package element
11/19/2008CN100435327C Semiconductor device having a bond pad and manufacturing method therefor
11/19/2008CN100435326C Integrated circuit die I/O cells
11/19/2008CN100435325C Semiconductor device and method of producing the semiconductor device
11/19/2008CN100435324C Semiconductor package structure having enhanced thermal dissipation characteristics
11/19/2008CN100435323C Heat radiator for wafer encapsulation and its making method
11/19/2008CN100435322C Heat radiation module
11/19/2008CN100435321C Process for preparing silumin electronic package materials
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