Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2008
11/20/2008US20080284016 Reliable metal bumps on top of I/O pads after removal of test probe marks
11/20/2008US20080284015 Bump on via-packaging and methodologies
11/20/2008US20080284014 Chip assembly
11/20/2008US20080284013 Method for manufacturing semiconductor device, and semiconductor device
11/20/2008US20080284012 Semiconductor module manufacturing method, semiconductor module, and mobile device
11/20/2008US20080284011 Bump structure
11/20/2008US20080284010 Apparatus for connecting integrated circuit chip to power and ground circuits
11/20/2008US20080284009 Dimple free gold bump for drive IC
11/20/2008US20080284008 Semiconductor device
11/20/2008US20080284007 Semiconductor module and method for manufacturing semiconductor module
11/20/2008US20080284006 Semiconductor devices including interlayer conductive contacts and methods of forming the same
11/20/2008US20080284005 Fastener for heat sinks
11/20/2008US20080284004 Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication
11/20/2008US20080284003 Semiconductor Packages And Method For Fabricating Semiconductor Packages With Discrete Components
11/20/2008US20080284002 Integrated circuit package system with thin profile
11/20/2008US20080284001 Semiconductor device and fabrication method
11/20/2008US20080284000 Integrated Circuit Packages, Methods of Forming Integrated Circuit Packages, And Methods of Assembling Integrated Circuit Packages
11/20/2008US20080283999 Chip Package with Pin Stabilization Layer
11/20/2008US20080283998 Electronic system with expansion feature
11/20/2008US20080283997 Electronic Device and Pressure Sensor
11/20/2008US20080283996 Semiconductor package using chip-embedded interposer substrate
11/20/2008US20080283995 Compact multi-port cam cell implemented in 3d vertical integration
11/20/2008US20080283994 Stacked package structure and fabrication method thereof
11/20/2008US20080283993 Die stacking system and method
11/20/2008US20080283992 Multi layer low cost cavity substrate fabrication for pop packages
11/20/2008US20080283991 Housed active microstructures with direct contacting to a substrate
11/20/2008US20080283990 Method of fabrication of ai/ge bonding in a wafer packaging environment and a product produced therefrom
11/20/2008US20080283989 Wafer level package and wafer level packaging method
11/20/2008US20080283988 Package and packaging assembly of microelectromechanical sysyem microphone
11/20/2008US20080283987 Semiconductor device and method for manufacturing the same
11/20/2008US20080283986 System-in-package type semiconductor device
11/20/2008US20080283985 Circuit substrate, molding semiconductor device, tray and inspection socket
11/20/2008US20080283984 Package structure and manufacturing method thereof
11/20/2008US20080283983 Semiconductor device and manufacturing method thereof
11/20/2008US20080283982 Multi-chip semiconductor device having leads and method for fabricating the same
11/20/2008US20080283981 Chip-On-Lead and Lead-On-Chip Stacked Structure
11/20/2008US20080283980 Lead frame for semiconductor package
11/20/2008US20080283979 Semiconductor Package Having Reduced Thickness
11/20/2008US20080283978 Leadframe For a Semiconductor Device
11/20/2008US20080283977 Stacked packaged integrated circuit devices, and methods of making same
11/20/2008US20080283976 Electromagnetic Shielding Device for an Infrared Receiver
11/20/2008US20080283975 Formation of a silicon oxide interface layer during silicon carbide etch stop deposition to promote better dielectric stack adhesion
11/20/2008US20080283973 Integrated circuit including a dielectric layer and method
11/20/2008US20080283972 Silicon Compounds for Producing Sio2-Containing Insulating Layers on Chips
11/20/2008US20080283971 Semiconductor Device and Its Fabrication Method
11/20/2008US20080283970 Semiconductor integrated circuit device and process for manufacturing the same
11/20/2008US20080283969 Seal Ring Structure with Improved Cracking Protection
11/20/2008US20080283964 Adopting feature of buried electrically conductive layer in dielectrics for electrical anti-fuse application
11/20/2008US20080283963 Electrical Fuse Circuit for Security Applications
11/20/2008US20080283959 Tapered through-silicon via structure
11/20/2008US20080283958 Semiconductor device and method for manufacturing the same
11/20/2008US20080283952 Semiconductor Package, Method of Fabricating the Same and Semiconductor Package Module For Image Sensor
11/20/2008US20080283933 Oxygen-rich layers underlying BPSG
11/20/2008US20080283924 Semiconductor device and method for fabricating the same
11/20/2008US20080283919 Single and double-gate pseudo-fet devices for semiconductor materials evaluation
11/20/2008US20080283916 Semiconductor substrate, semiconductor device and manufacturing method thereof
11/20/2008US20080283878 Method and Apparatus for Monitoring Endcap Pullback
11/20/2008US20080283872 Variable path wiring cell, semiconductor integrated circuit designing method thereof, and forming method of variable path wiring cell
11/20/2008US20080283847 Integrated circuit package provided with cooperatively arranged illumination and sensing capabilities
11/20/2008US20080283578 Methods and Apparatus for Wire Bonding with Wire Length Adjustment in an Integrated Circuit
11/20/2008US20080283488 Method For Producing a Ceramic Printed-Circuit Board
11/20/2008US20080283282 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
11/20/2008US20080282542 Flexible heat sink
11/20/2008DE202008010976U1 Kühlrippe und Kühlmodul aus diesen Kühlrippen Fin and cooling module from these fins
11/20/2008DE19905220B4 Multichipanordnung Multichip assembly
11/20/2008DE19625661B4 Integrierte Halbleiterschaltung zum Einstellen eines Schaltungselementwerts A semiconductor integrated circuit for adjusting a circuit element value
11/20/2008DE10345238B4 Justiermarke zur Ausrichtung eines Halbleiterwafers in einem Belichtungsgerät und deren Verwendung Alignment mark for aligning a semiconductor wafer in an exposure apparatus and their use
11/20/2008DE102008023711A1 Halbleitermodul und Verfahren zur Herstellung eines Halbleitermoduls Semiconductor module and method for manufacturing a semiconductor module
11/20/2008DE102008022539A1 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation
11/20/2008DE102008019382A1 Chip-interne Transformator-Anordnung On-chip transformer arrangement
11/20/2008DE102008018930A1 Electronic component for use in imaging system i.e. camera system, for surgical instrument, has integrated circuit fastened to front side of substrate and electrically connected with continuous lines at front side
11/20/2008DE102008018221A1 Schutz für Schaltungsplatinen Protection for circuit boards
11/20/2008DE102007022959A1 Semiconductor device manufacturing method, involves coating semiconductor chip with casting compound e.g. thermoplastic material, forming through hole in casting compound, and depositing electric conductive materials in through hole
11/20/2008DE102007022852A1 Differenzdruck-Sensoranordnung und entsprechendes Herstellungsverfahren Differential pressure sensor arrangement and method of manufacture
11/20/2008DE102007022517A1 Wärmetauscher zur Kühlung einer elektronischen Baugruppe Heat exchanger for cooling of an electronic assembly
11/20/2008DE102007022337A1 Gesintertes Leistungshalbleitersubstrat sowie Herstellungsverfahren hierzu Sintered power semiconductor substrate and manufacturing method therefor
11/20/2008DE102007022336A1 Leistungshalbleitersubstrat mit Metallkontaktschicht sowie Herstellungsverfahren hierzu Power semiconductor substrate with metal contact layer and manufacturing method therefor
11/20/2008DE102007007223B4 Modular aufgebautes Leistungshalbleitermodul Modular power semiconductor module
11/20/2008DE102005062532B4 Halbleiterbauelement und Kontaktstellenherstellungsverfahren A semiconductor device manufacturing method and contact points
11/20/2008DE102004014752B4 Halbleiterbauelement mit kernlosem Wandler und Halbbrücke Semiconductor component with coreless transformer and half-bridge
11/20/2008DE10085212B4 Dielektrische Schicht, integrierte Schaltung und Verfahren zu deren Herstellung Dielectric layer, integrated circuit and methods for their preparation
11/20/2008CA2704309A1 Electroactive biopolymer optical and electro-optical devices and method of manufacturing the same
11/19/2008EP1993135A2 Heat conducter
11/19/2008EP1993134A2 Compliant and crosslinkable thermal interface materials
11/19/2008EP1993133A2 Sintered high performance semiconductor substrate and corresponding production method
11/19/2008EP1993132A2 High performance semiconductor substrate with metal contact layer and corresponding production method
11/19/2008EP1993131A2 Method and apparatus for thermal protection in an integrated circuit
11/19/2008EP1992209A2 Low-profile board level emi shielding and thermal management apparatus and spring clips for use therewith
11/19/2008EP1992015A2 Composite material and method for production thereof
11/19/2008EP1992012A1 Novel structure and method for metal integration
11/19/2008EP1992011A2 Aluminum leadframes for semiconductor qfn/son devices
11/19/2008EP1992000A1 Device for short-circuiting power semiconductor modules
11/19/2008EP1573807B1 Electro-osmotic pumps and micro-channels
11/19/2008EP1559801B1 Metallic material for electronic part, electronic part, electronic equipment, method of working metallic material, process for producing electronic part and electronic optical part
11/19/2008EP1532682B1 Semiconductor wafer having electrically connected contact and testing surfaces
11/19/2008EP1158579B1 Wire bonding capillary for forming bump electrodes
11/19/2008EP1126752B1 Chip scale packaging on CTE matched printed wiring boards
11/19/2008EP1110242B1 Thermal capacity for electronic component operating in long pulses
11/19/2008CN201153361Y Heat radiator
11/19/2008CN201153360Y Heat radiating device of communication system
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