Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2014
07/24/2014DE102014100743A1 Chipgehäuse und Verfahren zu seiner Herstellung Chip package and process for its preparation
07/24/2014DE102014100512A1 Chip-gehäuse mit anschlusspads mit unterschiedlichen formfaktoren Chip housing, with pads with different form factors
07/24/2014DE102014100509A1 Verfahren zur herstellung und testung eines chipgehäuses A process for the preparation and testing of a chip package
07/24/2014DE102014100397A1 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof
07/24/2014DE102013207507B3 Leistungsmodul, Stromrichter und Antriebsanordnung mit einem Leistungsmodul Power module, power converter and drive assembly with a power module
07/24/2014DE102013200990A1 Beleuchtungsanordnung mit optoelektronischem Bauelement Lighting arrangement with optoelectronic device
07/24/2014DE102013200652B4 Vorrichtung zum Schalten hoher Ströme Apparatus for switching high currents
07/24/2014DE102013114547A1 TO-Gehäuse sowie Verfahren zu dessen Herstellung TO package and process for its preparation
07/24/2014DE102013100388B4 Bauelement mit einer MEMS Komponente und Verfahren zur Herstellung Device having a MEMS component and methods for making
07/24/2014DE102010030760B4 Halbleiterbauelement mit Durchgangskontaktierungen mit einem Verspannungsrelaxationsmechanismus und Verfahren zur Herstellung eines solchen A semiconductor device with vias with a Verspannungsrelaxationsmechanismus and methods for producing such
07/23/2014EP2757593A1 Plated electrical contacts for solar modules
07/23/2014EP2757585A2 Silver bond wire for semiconductor devices
07/23/2014EP2757584A2 Integrated thin film evaporation thermal spreader and planar heat pipe heat sink
07/23/2014EP2757583A1 Chip on film, and method of manufacture thereof
07/23/2014EP2757582A1 Packaged electrical components
07/23/2014EP2756741A1 Circuitry arrangement for reducing a tendency towards oscillations
07/23/2014EP2756522A1 Low cte interposer
07/23/2014EP2755617A1 Biocompatible electrode component and method for fabrication thereof
07/23/2014CN203733810U 一种基于电容结构的hemt栅泄漏电流分离结构 Based hemt gate leakage current of the capacitor structure separated structure
07/23/2014CN203733808U 整流二极管器件 Rectifier diode device
07/23/2014CN203733807U 高可靠性表面贴装二极管 High Reliability Surface Mount Diode
07/23/2014CN203733806U 轴向型贴片二极管器件 Axial SMD diode device
07/23/2014CN203733805U 低功耗整流器件 Low-power rectifier
07/23/2014CN203733797U 阵列基板和显示装置 An array substrate and a display device
07/23/2014CN203733791U 半导体叠层封装结构 Semiconductor laminated packaging structure
07/23/2014CN203733790U 一种内部去耦的集成电路封装 An internal decoupling an integrated circuit package
07/23/2014CN203733789U 一种芯片保护结构 A chip protection structure
07/23/2014CN203733788U 一种芯片保护结构 A chip protection structure
07/23/2014CN203733787U 一种芯片互联结构 A chip interconnect structure
07/23/2014CN203733786U 半导体器件 Semiconductor devices
07/23/2014CN203733785U 一种具有改进型封装结构的半导体器件 A semiconductor device having an improved structure of a package
07/23/2014CN203733784U 半导体的引线框架 Semiconductor leadframe
07/23/2014CN203733783U 一种引线框架 A lead frame for
07/23/2014CN203733782U 一种to-220hf防水密封引线框架 One kind to-220hf waterproof seal leadframe
07/23/2014CN203733781U 一种to-220防水密封引线框架 One kind of water-tight seal to-220 of the lead frame
07/23/2014CN203733780U 多芯片堆叠倒正装无基岛复合式平脚金属框架结构 Multi-chip stacked inverted suits no base island composite flat foot metal frame structure
07/23/2014CN203733779U 半导体器件 Semiconductor devices
07/23/2014CN203733778U 一种嵌入式焊垫结构 Embedded pad structure
07/23/2014CN203733777U 微槽道相变换热装置 Micro-channel phase change heat transfer device
07/23/2014CN203733776U 全封闭相变式散热器及具有该散热器的led灯具 Closed phase transition radiator and the radiator has led lamps
07/23/2014CN203733775U 一种塑料密闭封装的开关电源模块 Switching power supply module in a plastic sealed package
07/23/2014CN203733774U 半导体叠层封装结构 Semiconductor laminated packaging structure
07/23/2014CN203733773U 一种可外置的防反二极管装置 Blocking diode is a device can be external
07/23/2014CN103946977A 功率转换装置 Power conversion means
07/23/2014CN103946976A 具有翻转式球接合表面的双层级引线框架及装置封装 Double-level and device package leadframe having flip-ball bonding surface
07/23/2014CN103946975A 用于含氮电介质层的低能蚀刻方法 Low energy method for etching a dielectric layer, a nitrogen-containing
07/23/2014CN103946972A 去除传导材料以在衬底中形成传导特征 Removing the conductive material to form a conductive substrate characterized in that
07/23/2014CN103946965A 封装上受控的管芯上焊料集成及其装配方法 Integration and controlled method for assembling the solder on the die to the package
07/23/2014CN103946962A 半导体装置及其制造方法、电子部件 Semiconductor device and manufacturing method of the electronic component
07/23/2014CN103946767A 诸如调制解调器等包括多个风冷处理器的电子装置 An electronic device such as a modem processor including a plurality of air-cooled
07/23/2014CN103946326A 固化性组合物、涂布用组合物、固化膜、激光加工方法及多层布线结构体的制造方法 Method for producing a curable composition, coating composition, a cured film, a laser processing method and a multilayer wiring structure
07/23/2014CN103946043A 电气设备的冷却装置 Cooling apparatus for electrical equipment
07/23/2014CN103944360A 使用磁耦合电流隔离引线框架通信的开关模式功率转换器 Galvanic isolation using magnetic coupling leadframe communication switch-mode power converter
07/23/2014CN103944356A 换流阀组件及使用该换流阀组件的阀塔 Converter valve assembly and use of the converter valve assembly valve tower
07/23/2014CN103944354A 整合功率模块封装结构 Integrated power module package structure
07/23/2014CN103943680A 半导体装置 Semiconductor device
07/23/2014CN103943679A 用于电流控制的半导体装置及其制造方法 Semiconductor device and manufacturing method for the current control
07/23/2014CN103943669A 一种反熔丝结构及其制备方法 An anti-fuse structure and preparation method
07/23/2014CN103943664A 影像显示系统 Image display system
07/23/2014CN103943634A 阵列基板、显示装置及其电容结构 An array substrate, a display device and capacitance structure
07/23/2014CN103943624A 存储元件、半导体器件和写入方法 Storage components, semiconductor devices and write methods
07/23/2014CN103943615A 一种dram双芯片堆叠封装结构和封装方法 One kind of two-chip stacked package structure dram and encapsulation method
07/23/2014CN103943612A 静电放电保护装置 Electrostatic discharge protection device
07/23/2014CN103943611A 一种阵列基板及面板 One kind of array substrate and panel
07/23/2014CN103943610A 一种电子元件封装结构及电子设备 An electronic component package and the electronic device
07/23/2014CN103943609A 栅边界氧化层完整性测试结构 Border gate oxide integrity test structure
07/23/2014CN103943608A 一种检测多晶硅残留的测试结构 A test structure polysilicon Residues
07/23/2014CN103943607A 划片槽条宽测试结构及方法 Scribe bar width test structures and methods
07/23/2014CN103943606A 一种半导体器件中缺陷的检测结构及检测方法 Detection structure and detection method of a semiconductor device of the defect
07/23/2014CN103943605A 基于超薄玻璃的封装结构及方法 Thin glass package structure and method based on
07/23/2014CN103943604A 复合铜线互连结构及形成方法 Composite copper interconnect structure and a method of forming
07/23/2014CN103943603A 金属互连线拼接版图结构 Metal interconnect structure mosaic map
07/23/2014CN103943602A 芯片叠层结构及其制造方法 Chip stack structure and manufacturing method
07/23/2014CN103943601A 一种具有铜-石墨烯复相的互连线及其制备方法 Graphene interconnects complex phase of its preparation - a copper has
07/23/2014CN103943600A 在芯片和基板之间的新型端接和连接 The new termination and connection between the chip and the substrate
07/23/2014CN103943599A 互连结构及其制造方法 Interconnection structure and its manufacturing method
07/23/2014CN103943598A 一种通用预封装基板结构、封装结构及封装方法 A universal pre-packaged substrate structure package structure and encapsulation method
07/23/2014CN103943597A 一种适用于高温电器设备的引线框架 One for high-temperature electrical equipment leadframe
07/23/2014CN103943596A 一种全包封形式的引线框架 A fully encapsulated in the form of a lead frame
07/23/2014CN103943595A 一种便于包封的引线框架 A lead frame for encapsulating facilitate
07/23/2014CN103943594A 一种适用于大功率电器的引线框架 One for high-power electrical leadframe
07/23/2014CN103943593A 一种双芯片引线框架 A dual chip lead frame
07/23/2014CN103943592A 一种带防震沟的引线框架 A lead frame with a vibration groove
07/23/2014CN103943591A 一种带锁料口的引线框架 A lead frame lockable spout
07/23/2014CN103943590A 一种薄的引线框架 A thin lead frame
07/23/2014CN103943589A 一种压有凸台的引线框架 A lead frame press boss
07/23/2014CN103943588A 一种用于超大功率电器的引线框架 An ultra high-power electrical lead frame for
07/23/2014CN103943587A 一种用于较大功率电器的引线框架 A high power electrical lead frame for
07/23/2014CN103943586A 一种引线框架 A lead frame for
07/23/2014CN103943585A 主板及其芯片封装模块和母板 Motherboard and chip package module and motherboard
07/23/2014CN103943584A 用于半导体装置的焊线 For wire bonding of the semiconductor device
07/23/2014CN103943583A 叠层芯片的晶圆级凸块圆片级封装架构 Stacked chip wafer level bump wafer-level package architecture
07/23/2014CN103943582A 具有不同形状因数的端子焊盘的芯片封装体 Terminal pads of the chip package having a different form factor
07/23/2014CN103943581A 功率器件封装结构及封装方法 Power device package structure and encapsulation method
07/23/2014CN103943580A 半导体器件 Semiconductor devices
07/23/2014CN103943579A 晶圆级铜柱微凸点结构及制作方法 Wafer-level Tongzhu microbumps point structure and production methods
07/23/2014CN103943578A 铜柱凸点结构及成型方法 Copper pillar bump structure and method of forming
07/23/2014CN103943577A 半导体封装件及其制法 The semiconductor package Jiqizhifa
07/23/2014CN103943576A 集成薄膜蒸发热分散器和平面热管散热器 Integrated thin-film evaporator heat dispersion and flat heat pipe radiator
07/23/2014CN103943575A 用于在暴露的导电表面上电泳沉积（epd）薄膜的方法及其电子部件 The method for film on the conductive surface of the exposed electrophoretic deposition (epd) and the electronic component
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