| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/29/2014 | US8791508 High density gallium nitride devices using island topology |
| 07/29/2014 | US8791496 Silicone resin composition, silicone resin sheet, method for producing silicone resin sheet, and optical semiconductor device |
| 07/29/2014 | US8791478 Organic light emitting display device |
| 07/29/2014 | US8791477 Light emitting device array |
| 07/29/2014 | US8791471 Multi-chip light emitting diode modules |
| 07/29/2014 | US8791465 Compound semiconductor device and manufacturing therefor |
| 07/29/2014 | US8791448 Semiconductor memory devices having strapping contacts |
| 07/29/2014 | US8791446 Semiconductor device |
| 07/29/2014 | US8791374 Snap-in electrical connector |
| 07/29/2014 | US8791370 Carrier tape for tab-package and manufacturing method thereof |
| 07/29/2014 | US8791018 Method of depositing copper using physical vapor deposition |
| 07/29/2014 | US8791016 Through silicon via wafer, contacts and design structures |
| 07/29/2014 | US8791005 Sidewalls of electroplated copper interconnects |
| 07/29/2014 | US8790963 LED array formed by interconnected and surrounded LED chips |
| 07/29/2014 | US8790742 Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections |
| 07/29/2014 | US8790541 Method for preparing fluorinated nanodiamond liquid dispersion |
| 07/29/2014 | US8790477 Manufacturing method for a vaccum heat insulator |
| 07/29/2014 | US8789578 Cooling structure for electric device |
| 07/28/2014 | DE202014103180U1 Passivkomponente Passive component |
| 07/24/2014 | WO2014113661A1 Spiral metal-on-metal (smom) capacitors, and related systems and methods |
| 07/24/2014 | WO2014113113A2 Integrated circuit chip temperature sensor |
| 07/24/2014 | WO2014112954A1 Substrate for semiconductor packaging and method of forming same |
| 07/24/2014 | WO2014112892A2 Chip package assembly and method to use the assembly |
| 07/24/2014 | WO2014112864A1 Method of fabricating a bond pad in a semiconductor device |
| 07/24/2014 | WO2014111216A1 Plated electrical contacts for solar modules |
| 07/24/2014 | US20140206817 Modifier for resin and resin composition using the same and formed article |
| 07/24/2014 | US20140206203 Methods of forming a poruous insulator, and related methods of forming semiconductor device structures |
| 07/24/2014 | US20140206185 Ball placement in a photo-patterned template for fine pitch interconnect |
| 07/24/2014 | US20140206173 Method for processing semiconductors using a combination of electron beam and optical lithography |
| 07/24/2014 | US20140206172 Alignment mark and method of manufacturing the same |
| 07/24/2014 | US20140206151 Method for Producing a Semiconductor Module Arrangement |
| 07/24/2014 | US20140206149 Preform including a groove extending to an edge of the preform |
| 07/24/2014 | US20140206147 Stacked microelectronic assembly with tsvs formed in stages and carrier above chip |
| 07/24/2014 | US20140206145 Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods |
| 07/24/2014 | US20140206144 Semiconductor device and manufacturing method thereof |
| 07/24/2014 | US20140206143 Chip stack with electrically insulating walls |
| 07/24/2014 | US20140206142 Flip-chip wafer level package and methods thereof |
| 07/24/2014 | US20140206141 Methods and arrangements relating to semiconductor packages including multi-memory dies |
| 07/24/2014 | US20140206140 Method of Forming Wafer-Level Molded Structure for Package Assembly |
| 07/24/2014 | US20140206122 Open Cavity Plastic Package |
| 07/24/2014 | US20140206105 Transformer signal coupling for flip-chip integration |
| 07/24/2014 | US20140205803 Method for forming identification marks on silicon carbide single crystal substrate, and silicon carbide single crystal substrate |
| 07/24/2014 | US20140204533 Heat sink for cooling of power semiconductor modules |
| 07/24/2014 | US20140203828 Layout structure of electronic element and testing method of the same thereof |
| 07/24/2014 | US20140203827 Integrated circuits and methods of forming the same with embedded interconnect connection to through-semiconductor via |
| 07/24/2014 | US20140203456 Pre-Applying Supporting Materials between Bonded Package Components |
| 07/24/2014 | US20140203455 Feature Patterning Methods and Structures Thereof |
| 07/24/2014 | US20140203454 Semiconductor device and semiconductor module |
| 07/24/2014 | US20140203453 Air-dielectric for subtractive etch line and via metallization |
| 07/24/2014 | US20140203452 Active chip on carrier or laminated chip having microelectronic element embedded therein |
| 07/24/2014 | US20140203451 Electronic device package and packaging substrate for the same |
| 07/24/2014 | US20140203450 Semiconductor package and method of fabricating the same |
| 07/24/2014 | US20140203449 Integrated circuits and methods of forming the same with metal layer connection to through-semiconductor via |
| 07/24/2014 | US20140203448 Random coded integrated circuit structures and methods of making random coded integrated circuit structures |
| 07/24/2014 | US20140203446 Through silicon via device having low stress, thin film gaps and methods for forming the same |
| 07/24/2014 | US20140203445 Mitigating pattern collapse |
| 07/24/2014 | US20140203444 Semiconductor device and power source device |
| 07/24/2014 | US20140203443 Semiconductor Device and Method of Providing Z-Interconnect Conductive Pillars with Inner Polymer Core |
| 07/24/2014 | US20140203441 Semiconductor device and method of manufacturing the same |
| 07/24/2014 | US20140203440 Microelectronic package and method of manufacture thereof |
| 07/24/2014 | US20140203439 Through Silicon Via Structure and Method |
| 07/24/2014 | US20140203438 Methods and Apparatus of Packaging of Semiconductor Devices |
| 07/24/2014 | US20140203437 Method Of Semiconductor Integrated Circuit Fabrication |
| 07/24/2014 | US20140203436 Selective local metal cap layer formation for improved electromigration behavior |
| 07/24/2014 | US20140203435 Selective local metal cap layer formation for improved electromigration behavior |
| 07/24/2014 | US20140203434 Semiconductor Integrated Circuit and Fabricating the Same |
| 07/24/2014 | US20140203433 In-situ thermoelectric cooling |
| 07/24/2014 | US20140203432 Method for Packaging Quad Flat Non-Leaded Package Body, and Package Body |
| 07/24/2014 | US20140203431 Semiconductor device |
| 07/24/2014 | US20140203430 Interconnection designs and materials having improved strength and fatigue life |
| 07/24/2014 | US20140203429 Fan-out package structure and methods for forming the same |
| 07/24/2014 | US20140203428 Chip stack with electrically insulating walls |
| 07/24/2014 | US20140203426 Semiconductor device including cooler |
| 07/24/2014 | US20140203425 Heat dissipating device |
| 07/24/2014 | US20140203424 Electronic device and manufacturing method thereof |
| 07/24/2014 | US20140203423 Semiconductor device and method for manufacturing same |
| 07/24/2014 | US20140203420 Method for producing semiconductor device, and semiconductor device produced using production method |
| 07/24/2014 | US20140203419 Half-Bridge Package with a Conductive Clip |
| 07/24/2014 | US20140203418 Lead frame and a method of manufacturing thereof |
| 07/24/2014 | US20140203417 Mitigation of far-end crosstalk induced by routing and out-of-plane interconnects |
| 07/24/2014 | US20140203416 Chip package and method for forming the same |
| 07/24/2014 | US20140203414 Method Of Modifying Surfaces |
| 07/24/2014 | US20140203412 Through silicon vias for semiconductor devices and manufacturing method thereof |
| 07/24/2014 | US20140203411 Production method of semiconductor device, semiconductor wafer, and semiconductor device |
| 07/24/2014 | US20140203410 Die edge sealing structures and related fabrication methods |
| 07/24/2014 | US20140203409 Integrated Circuit Structures, Semiconductor Structures, And Semiconductor Die |
| 07/24/2014 | US20140203396 Electrical Fuse Structure and Method of Formation |
| 07/24/2014 | US20140203394 Chip With Through Silicon Via Electrode And Method Of Forming The Same |
| 07/24/2014 | US20140203390 Solid-state imaging device and electronic apparatus |
| 07/24/2014 | US20140203336 ADHESION LAYER AND MULTIPHASE ULTRA-LOW k DIELECTRIC MATERIAL |
| 07/24/2014 | US20140203330 Semiconductor integrated circuit |
| 07/24/2014 | US20140203323 Primer composition and optical semiconductor apparatus using same |
| 07/24/2014 | US20140203294 Gallium Nitride Devices |
| 07/24/2014 | US20140203291 Semiconductor device and method for fabricating the same |
| 07/24/2014 | US20140203286 Electro-Optical Device and Electronic Device |
| 07/24/2014 | US20140203247 Thin layer deposition apparatus utilizing a mask unit in the manufacture of a display device |
| 07/24/2014 | US20140203065 Ultra fine pitch wedge for thicker wire |
| 07/24/2014 | US20140202736 Lead frame and a method of fabrication thereof |
| 07/24/2014 | DE202014000631U1 Befestigungsstruktur von Wärmerohr und Wärmeleitpad Mounting structure of heat pipe and thermal pad |
| 07/24/2014 | DE112011105827T5 Hintergrundbeleuchtungsmodul zur Verbesserung der Wärmeableitung einer LED-Lichtquelle und einer Anzeigevorrichtung Backlight module to improve the heat dissipation an LED light source and a display device |