Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2008
11/25/2008US7456507 Die seal structure for reducing stress induced during die saw process
11/25/2008US7456506 Radio frequency identification (RFID) tag lamination process using liner
11/25/2008US7456505 Integrated circuit chip and integrated device
11/25/2008US7456504 Electronic component assemblies with electrically conductive bonds
11/25/2008US7456503 Integrated circuit package
11/25/2008US7456502 Wiring board with connection electrode formed in opening and semiconductor device using the same
11/25/2008US7456501 Semiconductor structure having recess with conductive metal
11/25/2008US7456500 Light source module and method for production thereof
11/25/2008US7456499 Power light emitting die package with reflecting lens and the method of making the same
11/25/2008US7456498 Integrated circuit package and system interface
11/25/2008US7456497 Electronic devices and its production methods
11/25/2008US7456496 Package design and method of manufacture for chip grid array
11/25/2008US7456495 Semiconductor module with a semiconductor stack, and methods for its production
11/25/2008US7456494 Surface mount electronic component and process for manufacturing same
11/25/2008US7456493 Structure for mounting semiconductor part in which bump and land portion are hardly detached from each other and method of manufacturing mounting substrate used therein
11/25/2008US7456492 Semiconductor device having semiconductor element, insulation substrate and metal electrode
11/25/2008US7456490 sealing porous dielectrics using silane coupling reagents is herein described. A sealant chain (silane coupling reagent) is formed from at least silicon, carbon, oxygen, and hydrogen and exposed to a porous dielectric material, wherein the sealant chain reacts with a second chain, that has at least O2
11/25/2008US7456489 Wafer with optical control modules in IC fields
11/25/2008US7456483 Semiconductor device, manufacturing method of semiconductor device and module for optical device
11/25/2008US7456479 Method for fabricating a probing pad of an integrated circuit chip
11/25/2008US7456478 MOS transistor circuit
11/25/2008US7456477 Electrostatic discharge device and method
11/25/2008US7456100 Top layers of metal for high performance IC's
11/25/2008US7456098 Building metal pillars in a chip for structure support
11/25/2008US7456094 LDMOS transistor
11/25/2008US7456089 Semiconductor device and method of manufacturing the semiconductor device
11/25/2008US7456083 Semiconductor device and manufacturing method of the same
11/25/2008US7456078 Thin-film capacitor and method for fabricating the same, electronic device and circuit board
11/25/2008US7456052 Thermal intermediate apparatus, systems, and methods
11/25/2008US7456049 Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same
11/25/2008US7456048 Semiconducting device with folded interposer
11/25/2008US7456047 Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
11/25/2008US7455103 Electronic equipment provided with cooling system
11/25/2008US7454834 Method of fabricating semiconductor chip assemblies
11/25/2008US7454833 High performance chip carrier substrate
11/20/2008WO2008140934A1 Inhibiting ic device damage from dicing and beol processing
11/20/2008WO2008140861A1 Rf - coupled digital isolator
11/20/2008WO2008140661A1 Flash memory cell with a gate having a flaring shape and manufacturing method thereof
11/20/2008WO2008140033A1 Lid or case for sealing package and method for manufacturing the lid or the case
11/20/2008WO2008139815A1 Semiconductor device, and its manufacturing method
11/20/2008WO2008139605A1 Stacked package and method of forming stacked package
11/20/2008WO2008139563A1 Electronic device and its manufacturing method, and electronic equipment equipped with the electronic device
11/20/2008WO2008139393A1 Integration substrate with a ultra-high-density capacitor and a through-substrate via
11/20/2008WO2008139273A1 Power lead-on-chip ball grid array package
11/20/2008WO2008138777A1 Heat exchanger for cooling an electronic assembly
11/20/2008WO2008138231A1 Led lamp of highly efficient heat dissipation
11/20/2008WO2008118194A3 Partial solder mask defined pad design
11/20/2008WO2008097724A3 Passivation layer for a circuit device and method of manufacture
11/20/2008WO2008091742A3 Pre-molded clip structure
11/20/2008WO2008091360A3 Electro-chemical processor
11/20/2008WO2008021219A3 Semiconductor device having improved heat dissipation capabilities
11/20/2008WO2007075648A3 Component stacking for integrated circuit electronic package
11/20/2008WO2007048090A3 Semiconductor assembly for improved device warpage and solder ball coplanarity
11/20/2008US20080287573 Ultra-Low Dielectrics Film for Copper Interconnect
11/20/2008US20080286933 Integrated circuit inductor with integrated vias
11/20/2008US20080286902 Method of manufacturing a semiconductor device
11/20/2008US20080286901 Method of Making Integrated Circuit Package with Transparent Encapsulant
11/20/2008US20080286891 Wiring and manufacturing method thereof, semiconductor device comprising said wiring, and dry etching method
11/20/2008US20080286888 Test structures and methodology for detecting hot defects
11/20/2008US20080286886 Monitoring Cool-Down Stress in a Flip Chip Process Using Monitor Solder Bump Structures
11/20/2008US20080285187 Cdm esd protection for integrated circuits
11/20/2008US20080285185 Semiconductor integrated circuit
11/20/2008US20080284919 Fully integrated tuner architecture
11/20/2008US20080284837 Methods and systems for therma-based laser processing a multi-material device
11/20/2008US20080284611 Vertical system integration
11/20/2008US20080284610 Tamper Respondent Enclosure
11/20/2008US20080284463 programmable circuit having a carbon nanotube
11/20/2008US20080284459 Testing Using Independently Controllable Voltage Islands
11/20/2008US20080284452 Semiconductor device and method of measuring sheet resisitance of lower layer conductive pattern thereof
11/20/2008US20080284048 Alignment mark, semiconductor chip including the same, semiconductor package including the chip and methods of fabricating the same
11/20/2008US20080284047 Chip Package with Stiffener Ring
11/20/2008US20080284046 Flip chip mounting method and bump forming method
11/20/2008US20080284045 Method for Fabricating Array-Molded Package-On-Package
11/20/2008US20080284044 Capillary underfill of stacked wafers
11/20/2008US20080284043 Base Semiconductor Component For a Semiconductor Component Stack and Method For the Production Thereof
11/20/2008US20080284042 Anisotropically conductive member and method of manufacture
11/20/2008US20080284041 Semiconductor package with through silicon via and related method of fabrication
11/20/2008US20080284040 Semiconductor device and method of manufacturing same
11/20/2008US20080284039 Interconnect structures with ternary patterned features generated from two lithographic processes
11/20/2008US20080284038 Integrated circuit package system with perimeter paddle
11/20/2008US20080284037 Apparatus and Methods for Constructing Semiconductor Chip Packages with Silicon Space Transformer Carriers
11/20/2008US20080284036 Structure for optimizing fill in semiconductor features deposited by electroplating
11/20/2008US20080284035 Semiconductor device
11/20/2008US20080284034 Method of reducing the surface roughness of spin coated polymer films
11/20/2008US20080284033 Semiconductor device and method for manufacturing semiconductor device
11/20/2008US20080284032 High performance system-on-chip using post passivation process
11/20/2008US20080284031 Method for improved process latitude by elongated via integration
11/20/2008US20080284030 Enhanced mechanical strength via contacts
11/20/2008US20080284029 Contact structures and semiconductor devices including the same and methods of forming the same
11/20/2008US20080284028 Integrated device fabricated using one or more embedded masks
11/20/2008US20080284027 Method of manufacturing a semiconductor device and semiconductor device
11/20/2008US20080284026 Semiconductor device and method for fabricating the same
11/20/2008US20080284025 Electrically Conductive Line
11/20/2008US20080284024 Semiconductor Device and Method of Manufacturing the Same
11/20/2008US20080284023 Semiconductor device and method for manufacturing boac/coa
11/20/2008US20080284022 Semiconductor device and method for manufacturing the same
11/20/2008US20080284021 Method for FEOL and BEOL Wiring
11/20/2008US20080284020 Semiconductor contact structure containing an oxidation-resistant diffusion barrier and method of forming
11/20/2008US20080284019 Conductor-dielectric structure and method for fabricating
11/20/2008US20080284017 Methods of fabricating circuit board and semiconductor package, and circuit board and semiconductor package fabricated using the methods
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