Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2008
11/26/2008CN101312167A Semiconductor device
11/26/2008CN101312166A Power semiconductor module
11/26/2008CN101312165A Alxgayin1-x-yn substrate and cleaning method for the same, and ain substrate and cleaning method for the same
11/26/2008CN101312164A Alxgayin1-x-yn substrate and cleaning method for the same, and ain substrate and cleaning method for the same
11/26/2008CN101312163A Semiconductor device including barrier metal and coating film and method for manufacturing same
11/26/2008CN101312162A Method for manufacturing semiconductor device
11/26/2008CN101312161A Electronic structure and manufacturing method
11/26/2008CN101312160A Semiconductor memory device and its manufacture method
11/26/2008CN101312157A Method for producing protective structure
11/26/2008CN101312154A Semiconductor device with metal interconnection, its manufacture method and semiconductor cluster device
11/26/2008CN101312153A Fuse-wires structure and forming method thereof
11/26/2008CN101312133A Luminous diode encapsulation method with high efficiency light emitting effect and its packaging structure
11/26/2008CN101312132A Multi- chip semiconductor device possessing leads and its manufacture method
11/26/2008CN100438737C Board-level EMI shield with enhanced thermal dissipation
11/26/2008CN100438736C Electronic device with radiating opening
11/26/2008CN100438723C Manufacture of PCB with resistors embedded
11/26/2008CN100438720C Integrated electronic module structure for vehicles
11/26/2008CN100438719C Hybrid integrated circuit device and method of manufacturing the same
11/26/2008CN100438238C Semiconductor laser equipment
11/26/2008CN100438079C Capacitor structure and multi-layer capacitor structure
11/26/2008CN100438075C Thin film transistor array panel
11/26/2008CN100438054C Photodiode array, method for manufacturing same, and radiation detector
11/26/2008CN100438053C Photodiode array, method for manufacturing same, and radiation detector
11/26/2008CN100438048C Electrode structure in flat panel display, and fabricating method
11/26/2008CN100438042C Semiconductor device and method of manufacturing the same
11/26/2008CN100438039C NAND-type flash memory devices and fabrication methods thereof
11/26/2008CN100438033C Semiconductor chip and packaging and electronic installation comprising same
11/26/2008CN100438031C Method of manufacture of silicon on insulator device with improved heat removal
11/26/2008CN100438030C Circuitry component
11/26/2008CN100438029C Circuitry component
11/26/2008CN100438027C Optical interconnecting integrated circuit, method for producing optical interconnecting integrated circuit, photoelectrical apparatus and electronic instrument
11/26/2008CN100438025C Stacked chip semiconductor device and method for manufacturing the same
11/26/2008CN100438024C 半导体封装及层叠型半导体封装 The semiconductor package and the laminated semiconductor package
11/26/2008CN100438022C Semiconductor device and its making method, circuit substrate and electronic machine
11/26/2008CN100438020C Fuse of semiconductor element
11/26/2008CN100438019C Vertical electrostatic discharging protection component structure
11/26/2008CN100438018C Static discharge protective circuit and method for double carrier complementary metal oxide semiconductor
11/26/2008CN100438017C Static protection circuit
11/26/2008CN100438016C Ground arch for wirebond ball grid arrays
11/26/2008CN100438015C Semiconductor wafer with id mark, equipment for and method of manufacturing semiconductor device from them
11/26/2008CN100438014C Integrated circuit and method of manufacturing same
11/26/2008CN100438013C Semiconductor device
11/26/2008CN100438012C Self-passivating Cu laster fuse
11/26/2008CN100438011C Semiconductor device, magnetic sensor, and magnetic sensor unit
11/26/2008CN100438010C Wire frame strip and method for encapsulating semiconductor with wire frame strip
11/26/2008CN100438009C Mounting arrangement for semiconductor parts and method for manufacturing mounting substrate
11/26/2008CN100438008C High-frequency IC circuit packing structure and its production
11/26/2008CN100438007C Interconnecting substrate and semiconductor device
11/26/2008CN100438006C Flip-chip semiconductor device with improved power pad arrangement
11/26/2008CN100438005C Semiconductor device
11/26/2008CN100438004C Semiconductor device and manufacturing method of the same
11/26/2008CN100438003C 半导体器件 Semiconductor devices
11/26/2008CN100438002C Wire-layingout plate and its making method, semiconductor device and its making method
11/26/2008CN100438001C Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip typ
11/26/2008CN100438000C Liquid cooling radiation module
11/26/2008CN100437999C Power-electronic-cooling device
11/26/2008CN100437998C Jet generating device and electronic apparatus
11/26/2008CN100437997C Cooling device and electronic device
11/26/2008CN100437996C Electric range
11/26/2008CN100437995C Semiconductor device and process for manufacturing the same
11/26/2008CN100437994C Electronic encapsulation component
11/26/2008CN100437993C Electronic encapsulation part
11/26/2008CN100437992C Semiconductor light-source
11/26/2008CN100437991C Radiating apparatus and preparation method thereof
11/26/2008CN100437990C Strain silicon wafer with a crystal orientation (100) in flip chip bga package
11/26/2008CN100437989C Wafer packaging for asymmetric casting mold
11/26/2008CN100437988C Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus
11/26/2008CN100437987C Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor package
11/26/2008CN100437986C 复合电子部件 Composite electronic component
11/26/2008CN100437973C Contact window forming method and semiconductor element
11/26/2008CN100437972C Stress free etch processing in combination with a dynamic liquid meniscus
11/26/2008CN100437961C Semiconductor element mounting method and mounting substrate
11/26/2008CN100437959C Component mounting method and component-mounted body
11/26/2008CN100437958C Chip capsulation structure, and fabricating method
11/26/2008CN100437956C Method for manufacturing semiconductor device
11/26/2008CN100437954C Method of manufacturing a semiconductor device
11/26/2008CN100437952C Methods for forming co-planar wafer-scale chip packages
11/26/2008CN100437951C Semiconductor device production method and semiconductor device
11/26/2008CN100437939C Method for forming a gate electrode having a metal
11/26/2008CN100437917C Transparent conductive film and method forming thereof, electrooptic device and electronic apparatus
11/26/2008CN100437915C Metal conducting wire and producing method thereof
11/26/2008CN100437901C Particle sticking prevention apparatus and plasma processing apparatus
11/26/2008CN100437418C Providing in package power supplies for integrated circuits
11/26/2008CN100437312C Liquid crystal display device
11/26/2008CN100437234C Drive chip and display device with the same
11/26/2008CN100437227C Display panel, joint sleeve arrangement and its making process, and joint sleeve array arrangement
11/26/2008CN100436833C Centrifugel fan unit with vortex chamber and electronic device provided with same
11/25/2008US7457491 System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
11/25/2008US7457334 Semiconductor laser diode package
11/25/2008US7457226 Heat source having thermoelectric element, optical pickup assembly employing the same, and method of reducing temperature therein
11/25/2008US7457116 Method and system to cool memory
11/25/2008US7457087 Electrostatic discharge protective circuit and semiconductor integrated circuit using the same
11/25/2008US7456966 Alignment mark system and method to improve wafer alignment search range
11/25/2008US7456901 Image sensor module and camera module package including the same
11/25/2008US7456751 Electronic apparatus and method of cooling the electronic apparatus
11/25/2008US7456723 Inductors having input/output paths on opposing sides
11/25/2008US7456701 Flexible substrate and electronic equipment
11/25/2008US7456659 Semiconductor integrated circuit
11/25/2008US7456636 Test structures and method of defect detection using voltage contrast inspection
11/25/2008US7456531 Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded
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