Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2008
11/27/2008US20080289868 Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof
11/27/2008US20080289867 Multi-strand substrate for ball-grid array assemblies and method
11/27/2008US20080289767 Plasma processing apparatus
11/27/2008DE202008012291U1 Kühlkörper Heat Sink
11/27/2008DE112007000381T5 Quasi-radiale Wärmesenke mit rechteckigem Formfaktor und einheitlicher Rippenlänge Quasi-radial heat sink with a rectangular form factor and uniform rib length
11/27/2008DE112004000661B4 Integrierte Schaltung mit einem magnetisch ummantelten Leiter An integrated circuit comprising a magnetically coated conductor
11/27/2008DE10303969B4 Leuchtdiodenanordnung mit einem Leuchtdiodenträger und einer Mehrzahl von Leuchtdioden Light emitting diode device having a light emitting diode support and a plurality of light emitting diodes
11/27/2008DE10238581B4 Halbleiterbauelement Semiconductor device
11/27/2008DE102008022825A1 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation
11/27/2008DE102008020774A1 Montageplatte für Halbleiterchips mit mehreren Anschlüssen Mounting plate for the semiconductor chip with multiple ports
11/27/2008DE102008019407A1 Leistungshalbleitermodul The power semiconductor module
11/27/2008DE102008012584A1 Elektronische Vorrichtung mit einem geformten Harzgehäuse, und Formungswerkzeug und Verfahren zur Herstellung desselben The same electronic device with a molded resin housing, and forming tool and method for producing
11/27/2008DE102007060031A1 Halbleitervorrichtung Semiconductor device
11/27/2008DE102007024675A1 Heat pipe for cooling of electronic components, for e.g. personal computers, has phase changing refrigerant and throttle point is provided between evaporator and condenser area of refrigerant
11/27/2008DE102007024355A1 Verfahren zum Herstellen einer Schutzstruktur A method for producing a protective structure
11/27/2008DE102007023590A1 Bauelement mit mechanisch belastbarer Anschlussfläche Component with mechanically resilient pad
11/27/2008DE102006002904B4 Bauelementanordnung und Verfahren zur Ermittlung der Temperatur in einem Halbleiterbauelement Component assembly and method for determining the temperature in a semiconductor device
11/27/2008DE102006002448B4 Kühlkörper-Struktur Heatsink structure
11/26/2008EP1995779A2 Power semiconductor module
11/26/2008EP1995777A1 Transistor package with wafer level dielectric isolation
11/26/2008EP1995776A1 Semiconductor package mounting apparatus
11/26/2008EP1995775A2 Semiconductor device with stress reducing element
11/26/2008EP1995774A2 Semiconductor device
11/26/2008EP1995773A2 Semiconductor device with stress relaxation members
11/26/2008EP1995772A1 Semiconductor device
11/26/2008EP1995281A1 Oxide particle-containing polysiloxane composition and method for producing same
11/26/2008EP1994814A1 Shielding apparatus and manufacturing method thereof
11/26/2008EP1994813A2 Led with integral thermal via
11/26/2008EP1994551A2 Methods of making qfn package with power and ground rings
11/26/2008EP1584101A4 Semiconductor package having non-ceramic based window frame
11/26/2008EP1547133A4 Mim capacitor structures and fabrication methods in dual-damascene structures
11/26/2008EP1518270B1 Method for producing a packaging for semiconductor components
11/26/2008EP1222725B8 Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning
11/26/2008CN201156860Y Water cooling head construction for heat radiating
11/26/2008CN201156859Y Radiating fins
11/26/2008CN201156858Y Electronic element device having air duct
11/26/2008CN201156857Y Radiating fin structure
11/26/2008CN201156856Y Enclosed cabinet
11/26/2008CN201156547Y LED element
11/26/2008CN201156544Y Overvoltage protection circuit of field effect tube and electrical equipment having the circuit
11/26/2008CN201156542Y Encapsulation construction of LED
11/26/2008CN201156541Y Novel lead wire of electrode of semiconductor diode
11/26/2008CN201156540Y Welding construction for transistor
11/26/2008CN201156539Y Radiator for DC power transmission thyristor converter valve component
11/26/2008CN201156538Y CPU heat radiator
11/26/2008CN201156537Y CPU heat radiator
11/26/2008CN201156536Y CPU heat radiator
11/26/2008CN201156535Y CPU heat radiator
11/26/2008CN201156534Y Flat shape electronic chip radiator
11/26/2008CN201155736Y LED lamp internal vane aluminum pipe fan airflow heat radiating device
11/26/2008CN201155735Y High power light-emitting diode adopting porous metal material as heat radiating device
11/26/2008CN201155734Y Direct radiation LED lamp wick
11/26/2008CN201155732Y LED lamp water storehouse regulation excess radiation device
11/26/2008CN201155721Y LED bracket
11/26/2008CN201155717Y Modularized lighting lamp assembly structure
11/26/2008CN201155716Y Luminous diode illuminator
11/26/2008CN101313403A Reticle alignment technique
11/26/2008CN101313402A Double-faced electrode package, and its manufacturing method
11/26/2008CN101313092A Interconnects and heat dissipators based on nanostructures
11/26/2008CN101313029A Sealing epoxy resin forming material and electronic component device
11/26/2008CN101313006A Liquid resin composition for electronic parts and electronic parts device
11/26/2008CN101312829A Composite sheet and use thereof
11/26/2008CN101312640A Heat radiating device
11/26/2008CN101312639A Electronic device and control method of thermoelectric element
11/26/2008CN101312637A Water-cooling heat radiating system
11/26/2008CN101312636A Heat radiation module assembled to substrate plate by magnetic force
11/26/2008CN101312635A Air-guiding cover having hot pipe and heat radiating fins, electronic apparatus provided with the air-guiding cover
11/26/2008CN101312634A Heat radiating device
11/26/2008CN101312633A Heat radiating device
11/26/2008CN101312632A Heat radiating device
11/26/2008CN101312630A Wind guiding construction of heat radiator
11/26/2008CN101312629A Apparatus for simultaneously cooling multiple electronic components with uneven surface
11/26/2008CN101312628A Heat radiator having bent spring plate
11/26/2008CN101312615A Printed circuit board and manufacturing method thereof
11/26/2008CN101312227A Oil and metal combination natural heat dissipation method and apparatus for LED
11/26/2008CN101312226A Luminous diode base structure possessing horizontal heat diffusion member
11/26/2008CN101312203A Image sensor chip scale package having inter-adhesion with gap and method of the same
11/26/2008CN101312201A CMOS image sensor and method for forming same
11/26/2008CN101312200A Image sensing devices and methods for fabricating the same
11/26/2008CN101312199A Multiple port register file cell and manufacturing method thereof
11/26/2008CN101312198A Semiconductor device
11/26/2008CN101312196A Semiconductor device and its manufacture method
11/26/2008CN101312192A Semiconductor device
11/26/2008CN101312185A Light emitting device and method for manufacturing the same
11/26/2008CN101312183A Semiconductor device
11/26/2008CN101312182A Image sensory element packaging structure image-forming module group applying same
11/26/2008CN101312181A Semiconductor chip, integrated circuit structure and semi-conductor wafer
11/26/2008CN101312180A Superposed marker and method for forming same as well as uses
11/26/2008CN101312179A Semiconductor device
11/26/2008CN101312178A Conductive structure, non-volatile memory device containing same and its manufacture method
11/26/2008CN101312177A Lead frame for semiconductor device
11/26/2008CN101312176A Semiconductor device, leadframe and structure for mounting semiconductor device
11/26/2008CN101312175A Semiconductor memory device, memory support and memory module
11/26/2008CN101312174A Line component
11/26/2008CN101312173A Semiconductor chip package substrate and its solder mat structure
11/26/2008CN101312172A Semiconductor package with reinforced joint reliability and its manufacture method
11/26/2008CN101312171A Wafer structure possessing finger-like projection connected with multi-window
11/26/2008CN101312170A Line component
11/26/2008CN101312169A Semiconductor module, method of manufacturing semiconductor module, and mobile device
11/26/2008CN101312168A 半导体器件 Semiconductor devices
1 ... 847 848 849 850 851 852 853 854 855 856 857 858 859 860 861 862 863 864 865 866 867 ... 2262