Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2008
11/27/2008WO2008143309A1 Novel flame-retardant epoxy resin, epoxy resin composition essentially containing the epoxy resin, and cured product thereof
11/27/2008WO2008143085A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device obtained by using the same
11/27/2008WO2008143016A1 Epoxy resin composition for sealing, and electronic component device using the same
11/27/2008WO2008142960A1 Resin bleeding inhibitor and method of preventing resin bleeding
11/27/2008WO2008142931A1 Epoxy resin composition for optical semiconductor device encapsulation, cured body thereof, and optical semiconductor device using the epoxy resin composition
11/27/2008WO2008142892A1 Cooler for power module and power module
11/27/2008WO2008142887A1 Semiconductor module and inverter apparatus
11/27/2008WO2008142886A1 Semiconductor module and inverter apparatus
11/27/2008WO2008142885A1 Semiconductor module and inverter apparatus
11/27/2008WO2008142764A1 Stacked package and method of forming stacked package
11/27/2008WO2008142763A1 Stacked package and method of forming stacked package
11/27/2008WO2008142081A2 Component with mechanically loadable connection surfaces
11/27/2008WO2008141893A1 Multi-layer circuit substrate and method having improved transmission line integrity and increased routing density
11/27/2008WO2008141879A1 Cooling arrangement having a semiconductor component
11/27/2008WO2008141500A1 A circuit board for heat dispersion
11/27/2008WO2008102282A3 Semiconductor device with backside tamper protection
11/27/2008WO2007130644A3 Gimballed attachment for multiple heat exchangers
11/27/2008WO2007024483A8 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
11/27/2008US20080293245 Semiconductor device and manufacturing method thereof
11/27/2008US20080293239 Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment
11/27/2008US20080293232 Standoff Height Improvement for Bumping Technology Using Solder Resist
11/27/2008US20080293230 Method of manufacturing a semiconductor device
11/27/2008US20080293219 Semiconductor wafer, semiconductor chip and dicing method of a semiconductor wafer
11/27/2008US20080293201 Nonvolatile semiconductor memory and a fabrication method thereof
11/27/2008US20080293188 Reactive solder material
11/27/2008US20080293169 Lithography evaluating method, semiconductor device manufacturing method and program medium
11/27/2008US20080293168 Method and system of tape automated bonding
11/27/2008US20080290557 Mold with compensating base
11/27/2008US20080290530 Semiconductor device having photo aligning key and method for manufacturing the same
11/27/2008US20080290529 Semiconductor device and process for fabrication thereof
11/27/2008US20080290528 Semiconductor package substrate having electrical connecting pads
11/27/2008US20080290527 Methods for forming arrays of small, closely spaced features
11/27/2008US20080290526 Test patterns for detecting misalignment of through-wafer vias
11/27/2008US20080290525 Silicon-on-insulator structures for through via in silicon carriers
11/27/2008US20080290524 Through via in ultra high resistivity wafer and related methods
11/27/2008US20080290523 Semiconductor device including barrier metal and coating film and method for manufacturing same
11/27/2008US20080290522 Carbon containing silicon oxide film having high ashing tolerance and adhesion
11/27/2008US20080290521 Film-forming composition, insulating film with low dielectric constant, formation method thereof, and semiconductor device
11/27/2008US20080290520 Reliable metal bumps on top of I/O pads after removal of test probe marks
11/27/2008US20080290519 Dual liner capping layer interconnect structure
11/27/2008US20080290518 Dielectric interconnect structures and methods for forming the same
11/27/2008US20080290517 Semiconductor device
11/27/2008US20080290516 Semiconductor device with bonding pad support structure
11/27/2008US20080290515 Properties of metallic copper diffusion barriers through silicon surface treatments
11/27/2008US20080290514 Semiconductor device package and method of fabricating the same
11/27/2008US20080290513 Semiconductor package having molded balls and method of manufacturing the same
11/27/2008US20080290512 Semiconductor device and fabrication method thereof
11/27/2008US20080290511 Chip Assembly and Method of Manufacturing Thereof
11/27/2008US20080290510 Apparatus for crack prevention in integrated circuit packages
11/27/2008US20080290509 Chip Scale Package and Method of Assembling the Same
11/27/2008US20080290508 Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication
11/27/2008US20080290507 Chip embedded printed circuit board and fabricating method thereof
11/27/2008US20080290506 Semiconductor module and inverter device
11/27/2008US20080290505 Mold design and semiconductor package
11/27/2008US20080290504 Compliant thermal contactor
11/27/2008US20080290503 Compliant thermal contactor
11/27/2008US20080290502 Integrated circuit package with soldered lid for improved thermal performance
11/27/2008US20080290501 Semiconductor package
11/27/2008US20080290500 Semiconductor device
11/27/2008US20080290499 Semiconductor device
11/27/2008US20080290498 Semiconductor Device
11/27/2008US20080290497 Mounting Board, Mounted Body, and Electronic Equipment Using the Same
11/27/2008US20080290496 Wafer level system in package and fabrication method thereof
11/27/2008US20080290495 Low noise semiconductor device
11/27/2008US20080290494 Backside release and/or encapsulation of microelectromechanical structures and method of manufacturing same
11/27/2008US20080290493 Stacked chip semiconductor device
11/27/2008US20080290492 Semiconductor packages with enhanced joint reliability and methods of fabricating the same
11/27/2008US20080290491 Semiconductor package and stacked layer type semiconductor package
11/27/2008US20080290490 Semiconductor device and method for manufacturing the same
11/27/2008US20080290489 Package structure and electronic device using the same
11/27/2008US20080290488 semiconductor device and a method of manufacturing the same
11/27/2008US20080290487 Lead frame for semiconductor device
11/27/2008US20080290486 Leadframe package
11/27/2008US20080290485 Integrated circuit package system with relief
11/27/2008US20080290484 Leadframe Strip and Mold Apparatus for an Electronic Component and Method of Encapsulating an Electronic Component
11/27/2008US20080290483 Semiconductor device, leadframe and structure for mounting semiconductor device
11/27/2008US20080290482 Method of packaging integrated circuits
11/27/2008US20080290481 Semiconductor Device Package Leadframe
11/27/2008US20080290480 Microelectronic assembly and method for forming the same
11/27/2008US20080290479 Wafer level device package with sealing line having electroconductive pattern and method of packaging the same
11/27/2008US20080290478 Lead-frame array package structure and method
11/27/2008US20080290477 Semiconductor Device
11/27/2008US20080290476 Method for making semiconductor chips having coated portions
11/27/2008US20080290475 Semiconductor integrated circuit
11/27/2008US20080290474 Multi-Layer Circuit Substrate and Method Having Improved Transmission Line Integrity and Increased Routing Density
11/27/2008US20080290473 Method of manufacturing semiconductor device
11/27/2008US20080290472 Semiconductor interlayer-insulating film forming composition, preparation method thereof, film forming method, and semiconductor device
11/27/2008US20080290469 Edge Seal For a Semiconductor Device and Method Therefor
11/27/2008US20080290468 Structure of flexible electronics and optoelectronics
11/27/2008US20080290457 Bonding pad structure disposed in semiconductor device and related method
11/27/2008US20080290455 Semiconductor device and method of blowing fuse thereof
11/27/2008US20080290454 Semiconductor integrated circuit device and method for manufacturing the same
11/27/2008US20080290447 Semiconductor device and methods of manufacturing the same
11/27/2008US20080290446 Shallow trench isolation structures for semiconductor devices including wet etch barriers and methods of fabricating same
11/27/2008US20080290417 ELECTRONIC COMPONENT COMPRISING A TITANIUM CARBONITRIDE (TiCN) BARRIER LAYER AND PROCESS OF MAKING THE SAME
11/27/2008US20080290377 Thin film transistor array panel for a liquid crystal display
11/27/2008US20080290371 Semiconductor devices including implanted regions and protective layers
11/27/2008US20080290342 Methods and apparatus for a flexible circuit interposer
11/27/2008US20080290341 Stacked semiconductor device and method of testing the same
11/27/2008US20080290340 Method for fabricating a semiconductor device having embedded interconnect structures to improve die corner robustness
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