Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2008
12/03/2008CN101315168A Composition surface LED and surface LED module of conductive substrate
12/03/2008CN101315155A High power LED road lamp with heat pipe cooling mechanism
12/03/2008CN101314199A Solder paste composite and its application
12/03/2008CN100441077C Radiator
12/03/2008CN100441068C Latching micro magnetic relay packages and methods of packaging
12/03/2008CN100440714C Power inverter
12/03/2008CN100440510C Semiconductor integrated circuit
12/03/2008CN100440509C Circuit device and method for manufacturing same
12/03/2008CN100440507C Carrying structure for electron element
12/03/2008CN100440506C Circuit comprising a capacitor and at least one semiconductor component, and method for designing same
12/03/2008CN100440505C Depletion type terminal protection structure
12/03/2008CN100440504C Alternate bump metallurgy bars for power and ground routing
12/03/2008CN100440503C Multi-layered complementary wire structure and manufacturing method thereof
12/03/2008CN100440502C 半导体装置 Semiconductor device
12/03/2008CN100440501C Interconnection structure having wings
12/03/2008CN100440500C Printed wiring board, method for manufacturing same, lead frame package and optical module
12/03/2008CN100440499C Semiconductor device and its manufacturing method
12/03/2008CN100440498C Semiconductor device with sealed semiconductor chip
12/03/2008CN100440497C Semiconductor structure integrated under a pad
12/03/2008CN100440496C Fluxless flip chip inter connection
12/03/2008CN100440495C 半导体装置及其制造方法 Semiconductor device and manufacturing method
12/03/2008CN100440494C Semiconductor device and manufacturing method for the same
12/03/2008CN100440493C 半导体集成电路器件 The semiconductor integrated circuit device
12/03/2008CN100440492C Method and apparatus for chip cooling using a liquid metal thermal interface
12/03/2008CN100440491C An electronic assembly having a wetting layer on a thermally conductive heat spreader
12/03/2008CN100440490C Packaged electronic element and method of producing electronic element package
12/03/2008CN100440489C A porous silicon chip and its preparing method
12/03/2008CN100440488C Intermediate chip module,semiconductor element, circuit substrate and electronic equipment
12/03/2008CN100440472C Semiconductor device and method of making the same, circuit board, and electronic instrument
12/03/2008CN100440471C Method for manufacturing electronic device
12/03/2008CN100440467C Semiconductor chip and manufacturing method for the same, and semiconductor device
12/03/2008CN100440460C Semiconductor device and fabrication method thereof
12/03/2008CN100440458C Semiconductor device with multilayer interconnection structure
12/03/2008CN100439420C Siloxane-based resin containing germanium and an interlayer insulating film for a semiconductor device using the same
12/03/2008CN100439233C Method for selectively covering a micro machined surface
12/02/2008USRE40597 Evaluation TEG for semiconductor device and method of evaluation
12/02/2008US7460743 Diffusion and laser photoelectrically coupled integrated circuit signal line
12/02/2008US7460604 RF isolator for isolating voltage sensing and gate drivers
12/02/2008US7460373 Heat radiation device for memory module
12/02/2008US7460367 Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology
12/02/2008US7460003 Electronic fuse with conformal fuse element formed over a freestanding dielectric spacer
12/02/2008US7460001 Variable inductor for integrated circuit and printed circuit board
12/02/2008US7459934 Semiconductor integrated circuit
12/02/2008US7459838 Plasma display device, TCP applied thereto, and method of manufacturing the TCP
12/02/2008US7459798 Overlay mark
12/02/2008US7459797 Standoffs for centralizing internals in packaging process
12/02/2008US7459796 BGA-type multilayer circuit wiring board
12/02/2008US7459794 Substrate for device bonding, device bonded substrate, and method for producing same
12/02/2008US7459793 Methods for forming contact hole, for manufacturing circuit board and for manufacturing electro-optical device
12/02/2008US7459792 Via layout with via groups placed in interlocked arrangement
12/02/2008US7459791 Post passivation interconnection schemes on top of IC chip
12/02/2008US7459790 Post passivation interconnection schemes on top of the IC chips
12/02/2008US7459789 Bonding method of flexible film and display bonded thereby
12/02/2008US7459788 Ohmic electrode structure of nitride semiconductor device
12/02/2008US7459786 Semiconductor device
12/02/2008US7459785 Electrical interconnection structure formation
12/02/2008US7459784 High capacity thin module system
12/02/2008US7459782 Stiffener for flip chip BGA package
12/02/2008US7459781 Fan out type wafer level package structure and method of the same
12/02/2008US7459780 Fan-out wire structure
12/02/2008US7459779 Pad arrangement of driver IC chip for LCD and related circuit pattern structure of TAB package
12/02/2008US7459778 Chip on board leadframe for semiconductor components having area array
12/02/2008US7459777 Semiconductor package containing multi-layered semiconductor chips
12/02/2008US7459776 Stacked die assembly having semiconductor die projecting beyond support
12/02/2008US7459774 Stacked chip package using photosensitive polymer and manufacturing method thereof
12/02/2008US7459773 Stackable ball grid array
12/02/2008US7459771 Assembly structure for electronic power integrated circuit formed on a semiconductor die and corresponding manufacturing process
12/02/2008US7459770 Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure
12/02/2008US7459769 Magnetic shield member, magnetic shield structure, and magnetic memory device
12/02/2008US7459768 Semiconductor wafer and dicing method
12/02/2008US7459765 Semiconductor apparatus with decoupling capacitor
12/02/2008US7459761 High performance system-on-chip using post passivation process
12/02/2008US7459755 Dual-gate semiconductor devices with enhanced scalability
12/02/2008US7459754 Semiconductor device having ESD protection circuit with time delay
12/02/2008US7459731 Device containing isolation regions with threading dislocations
12/02/2008US7459642 RIM slot filler module and method of manufacturing the same
12/02/2008US7459637 Semiconductor device, manufacturing method thereof, circuit board, and electronic appliance
12/02/2008US7459393 Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts
12/02/2008US7459387 Semiconductor electronic device and method of manufacturing thereof
12/02/2008US7459385 Method of making a semiconductor chip assembly with a laterally aligned bumped terminal and filler
12/02/2008US7459381 Integrated circuits and interconnect structure for integrated circuits
12/02/2008US7459350 Method for fabricating a protection circuit located under fuse window
12/02/2008US7459347 Manufacturing method of a semiconductor device
12/02/2008US7459346 Intrinsic thermal enhancement for FBGA package
12/02/2008US7459343 Method of manufacturing semiconductor device and support structure for semiconductor substrate
12/02/2008US7459341 Method of manufacturing an electronic device
12/02/2008US7459319 Method and apparatus for characterizing features formed on a substrate
12/02/2008US7459318 Ferroelectric and high dielectric constant integrated circuit capacitors with three-dimensional orientation for high-density memories, and method of making the same
12/02/2008US7459112 Method of fabrication for a thermal spreader using thermal conduits
12/02/2008US7458416 Heat-exchanging device
12/02/2008US7458415 Cooling apparatus and electronic equipment
11/2008
11/27/2008WO2008144605A1 Array-molded package-on-package semiconductor device and method
11/27/2008WO2008144460A1 Multi layer low cost cavity substrate fabrication for pop packages
11/27/2008WO2008144459A1 Apparatus for connecting integrated circuit chip to power and ground circuits
11/27/2008WO2008144443A1 Laser processing of conductive links
11/27/2008WO2008144153A1 Integrated circuit packages, methods of forming integrated circuit packages, and methods of assembling integrated circuit packages
11/27/2008WO2008144007A1 Chip package with pin stabilization layer
11/27/2008WO2008143675A1 Packaged system of semiconductor chips having a semiconductor interposer
11/27/2008WO2008143359A1 Electronic circuit device
11/27/2008WO2008143313A1 Semiconductor device
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