Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2008
12/04/2008US20080296688 Esd protection structure for i/o pad subject to both positive and negative voltages
12/04/2008US20080296686 Circuit board and display apparatus
12/04/2008US20080296685 Analog switch
12/04/2008US20080296684 Semiconductor apparatus
12/04/2008US20080296582 Tft-lcd array substrate
12/04/2008US20080296571 Multi-project wafer and method of making same
12/04/2008US20080296570 Semiconductor device
12/04/2008US20080296254 Multilayer wiring board for an electronic device
12/04/2008US20080296054 High performance chip carrier substrate
12/04/2008US20080296052 Multilayer printed wiring board
12/04/2008US20080295326 Manufacture of a Layer Including a Component
12/04/2008DE202008012315U1 Kühlkörper Heat Sink
12/04/2008DE10353139B4 Stapelbares modulares Gehäusesystem und ein Verfahren zu dessen Herstellung A stackable modular housing system and a method for its preparation
12/04/2008DE10330490B4 Integrierte MIM-Kondensatorstruktur Integrated MIM capacitor structure
12/04/2008DE10209069B4 Spannungsbegrenzungselement für hochintegrierte Schaltungen Voltage limiting element for highly integrated circuits
12/04/2008DE102008026162A1 Seiten-emittierende LED-Baugruppe mit verbesserter Wärmedissipation Side emitting LED assembly with improved heat dissipation
12/04/2008DE102007032269A1 Verbindungsstruktur und integrierte Schaltung Connection structure and integrated circuit
12/04/2008DE102007028240B3 Production of a ceramic multiple layered body used in the production of e.g. strip conductors comprises preparing a first ceramic green foil having openings and further ceramic green foils, bringing the green foils together and laminating
12/04/2008DE102007024160A1 Power semiconductor module has substrate and housing, where substrate has metal structure for formation of conductive strips that contact power semiconductor chips by bond joint elements
12/04/2008DE102004056879B4 Verfahren zum Herstellen eines Metall-Keramik-Substrates A method for producing a metal-ceramic substrate
12/04/2008CA2688334A1 Interference shielded electronics module and method for providing the same
12/03/2008EP1998457A1 Transmitter/receiver
12/03/2008EP1998371A1 Method of manufacturing electrical conductors for a semiconductor device
12/03/2008EP1998370A2 Electronic assembly comprising solderable thermal interface and methods of manufacture
12/03/2008EP1997777A1 Silica powder and use thereof
12/03/2008EP1997141A2 Method for manufacturing a microelectronic package
12/03/2008EP1997140A1 Device for cooling, in particular, electronic components
12/03/2008EP1997139A2 Device for cooling, in particular, electronic components, gas cooler and evaporator
12/03/2008EP1996893A1 Heat exchanger and method for manufacturing it
12/03/2008EP1738384B1 Integrated circuit with analog connection matrix
12/03/2008EP1018764B1 Lead member
12/03/2008CN201160359Y Straight-fin heat expansion reinforced structure minuteness scale composite phase-change heat fetching apparatus
12/03/2008CN201160357Y Circuit board with heat sinking function
12/03/2008CN201160077Y Optoelectronic component
12/03/2008CN201160072Y Photoelectric or pressure integrated circuit package member
12/03/2008CN201160071Y Glue dropping product and glue dropping apparatus
12/03/2008CN201159876Y Double-loop miniaturization ice water refrigeration and circulation system
12/03/2008CN201159445Y High power LED heat radiating device
12/03/2008CN201159444Y Radiation fin for multi-layer LED lamp
12/03/2008CN201159402Y LED lamp
12/03/2008CN201157813Y Glue spreading apparatus
12/03/2008CN101317335A Transmitter/receiver
12/03/2008CN101317270A High density, high Q capacitor on top of protective layer
12/03/2008CN101317269A Monolithically integrable circuit arrangement
12/03/2008CN101317268A Stacked multi-chip package with EMI shielding
12/03/2008CN101317267A Fine-pitch routing in a lead frame based system-in-package (SIP) device
12/03/2008CN101317266A Bumpless flip-chip assembly with a compliant interposer contractor
12/03/2008CN101317265A IC coolant microchannel assembly with integrated attachment hardware
12/03/2008CN101317264A Improved heat sink assembly
12/03/2008CN101317263A Sensor device and method for manufacturing same
12/03/2008CN101317262A Sensor device and method for manufacturing same
12/03/2008CN101317261A Method of forming a self aligned copper capping layer
12/03/2008CN101317255A Nanostructure-based package interconnect
12/03/2008CN101317251A Method for forming cu film
12/03/2008CN101316499A Cooling substrates and cooling material
12/03/2008CN101316498A Heat sink assembly and electronic device using the same
12/03/2008CN101316496A Radiator fan
12/03/2008CN101316495A Heat sink assembly
12/03/2008CN101316494A Heat radiating device and fastener thereof
12/03/2008CN101316492A Fastener for heat sink and combination of cooling device
12/03/2008CN101316485A Electronic component module and method of manufacturing the same
12/03/2008CN101316481A Electronic assembly body and production method thereof
12/03/2008CN101315998A Shaped integrated passive devices
12/03/2008CN101315965A Light-emitting device
12/03/2008CN101315963A 半导体发光装置 The semiconductor light emitting device
12/03/2008CN101315961A LED conducting wire frame and method for producing the same
12/03/2008CN101315949A Power type segregator metal oxide semiconductor fieldistor
12/03/2008CN101315944A Organic electroluminescent device
12/03/2008CN101315939A CMOS image sensor chip scale package with die receiving opening and method of the same
12/03/2008CN101315936A NAND gate type flash memory body cell array and manufacturing method thereof
12/03/2008CN101315935A Non-volatile memory device and design method thereof
12/03/2008CN101315934A Embedded optical erasing memory capable of improving illumination efficiency and manufacturing method thereof
12/03/2008CN101315932A Semiconductor device and method of manufacturing the same
12/03/2008CN101315931A Semiconductor device in peripheral circuit region using a dummy gate
12/03/2008CN101315930A Semiconductor device
12/03/2008CN101315928A Layout methods of integrated circuits having unit mos devices
12/03/2008CN101315927A High power LED phase transition heat sink structure
12/03/2008CN101315926A Semiconductor device and method of manufacturing the same
12/03/2008CN101315925A Electronic component-containing module and manufacturing method thereof
12/03/2008CN101315924A Semiconductor package body
12/03/2008CN101315923A Chip stack package structure
12/03/2008CN101315922A Semiconductor packaging stack device for preventing semiconductor stack from micro-contact soldering point rupture
12/03/2008CN101315921A Chip stack packaging structure and method of producing the same
12/03/2008CN101315920A Chip stack packaging structure and method of producing the same
12/03/2008CN101315919A Chip packaging structure and technique
12/03/2008CN101315918A Semiconductor device and method of manufacturing the same
12/03/2008CN101315917A Wiring board and its fabricating method
12/03/2008CN101315916A Mobile phone drive chip interconnection module group and method for producing the same
12/03/2008CN101315915A 半导体装置 Semiconductor device
12/03/2008CN101315914A Semiconductor interposer and its application in electronic package
12/03/2008CN101315913A Light packaging member of power machine with high heat transfer efficiency
12/03/2008CN101315912A Composite refrigeration method and device for high-power electric semiconductor device
12/03/2008CN101315911A 半导体装置 Semiconductor device
12/03/2008CN101315910A GaAs semiconductor substrate and fabrication method thereof
12/03/2008CN101315899A Production method of label type integration circuit soft plate and structure thereof
12/03/2008CN101315897A Printed circuit board manufacturing method and printed circuit board with embedding box dam obtained by using the method
12/03/2008CN101315888A Low resistivity conductive structures, devices and systems including same, and methods forming same
12/03/2008CN101315178A Cooling apparatus
12/03/2008CN101315176A Light source module group with better cooling efficiency
12/03/2008CN101315175A High power semiconductor lighting lamp
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