Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2008
12/09/2008US7462870 Molded package and semiconductor device using molded package
12/09/2008US7462565 Method of manufacturing semiconductor device
12/09/2008US7462558 Method for fabricating a circuit component
12/09/2008US7462557 Semiconductor component and method for contracting said semiconductor component
12/09/2008US7462532 Method of fabricating high voltage metal oxide semiconductor device
12/09/2008US7462523 Semiconductor memory device and method for manufacturing the same
12/09/2008US7462518 Silicone metalization
12/09/2008US7462511 Semiconductor device and the method of producing the same
12/09/2008US7462510 Standoffs for centralizing internals in packaging process
12/09/2008US7462507 Structure of a CMOS image sensor and method for fabricating the same
12/09/2008US7461690 Optimally shaped spreader plate for electronics cooling assembly
12/09/2008CA2578837C High speed otp sensing scheme
12/04/2008WO2008147857A1 Semiconductor device package leadframe
12/04/2008WO2008147825A2 Thermal interconnect and interface materials, methods of production and uses thereof
12/04/2008WO2008147394A1 Three dimensional nanoscale circuit interconnect and method of assembly by dielectrophoresis
12/04/2008WO2008147387A1 Integrated circuit package with soldered lid for improved thermal performance
12/04/2008WO2008146933A1 Exposure method and electronic device manufacturing method
12/04/2008WO2008146879A1 Semiconductor device manufacturing method, semiconductor manufacturing apparatus and storage medium
12/04/2008WO2008146763A1 Cooling device
12/04/2008WO2008146723A1 Resin composition, resin spacer film, and semiconductor device
12/04/2008WO2008146646A1 Heat spreader for semiconductor device and method for manufacturing the heat spreader
12/04/2008WO2008146638A1 Thin film and method for manufacturing semiconductor device using the thin film
12/04/2008WO2008146603A1 Semiconductor device and its manufacturing method, and display and its manufacturing method
12/04/2008WO2008146531A1 Electronic component storing package and electronic device
12/04/2008WO2008146505A1 Semiconductor device
12/04/2008WO2008146211A1 A tillable sensor device
12/04/2008WO2008145911A2 Method for preparing an aqueous suspension of carbon nanotubes and suspension thus obtained
12/04/2008WO2008145804A2 Interference shielded electronics module and method for providing the same
12/04/2008WO2008145526A1 Benzoxazine-formulations with reduced outgassing behaviour
12/04/2008WO2008144922A1 Ultraviolet radiation light emitting diode device
12/04/2008WO2008144856A2 Constructive disposition in housing for the heat dissipation system and component installation in electric-electronic appliances
12/04/2008WO2008103714A3 Transfer mask in micro-ball mounter
12/04/2008WO2008097574A3 Method for designing a leadless chip carrier
12/04/2008WO2008045779A3 Gold die bond sheet preform
12/04/2008WO2008042932A3 Interdigitated leadfingers
12/04/2008WO2008036722A3 Locking feature and method for manufacturing transfer molded ic packages
12/04/2008WO2007100929A3 Method and apparatus for indicating directionality in integrated circuit manufacturing
12/04/2008US20080301610 Semiconductor integrated circuit having reduced cross-talk noise
12/04/2008US20080299802 BGA socket having extensible solder ball so as to compensate warpage connector housing
12/04/2008US20080299772 Methods of fabricating electronic devices using direct copper plating
12/04/2008US20080299288 Durable, heat-resistant multi-layer coatings and coated articles
12/04/2008US20080297879 Electrochromic rearview mirror assembly incorporating a display/signal light
12/04/2008US20080296785 Method of forming catalyst nanoparticles for nanowire growth and other applications
12/04/2008US20080296784 Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
12/04/2008US20080296783 Resin molded semiconductor device
12/04/2008US20080296782 Semiconductor device
12/04/2008US20080296781 Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same
12/04/2008US20080296780 Memory devices including separating insulating structures on wires and methods of forming
12/04/2008US20080296779 Semiconductor device and method of manufacturing the same
12/04/2008US20080296778 Interconnection Structure and Integrated Circuit
12/04/2008US20080296777 Semiconductor device
12/04/2008US20080296776 Method of Manufacturing Electrical Conductors for a Semiconductor Device
12/04/2008US20080296775 Semiconductor device and method for manufacturing semiconductor device
12/04/2008US20080296774 Arrangement including a semiconductor device and a connecting element
12/04/2008US20080296773 Power semiconductor device with improved heat dissipation
12/04/2008US20080296772 Semicondutor device
12/04/2008US20080296771 Methods of fabricating silicon carbide power devices by at least partially removing an n-type silicon carbide substrate, and silicon carbide power devices so fabricated
12/04/2008US20080296770 Semiconductor device
12/04/2008US20080296769 Semiconductor device and method of manufacturing the same
12/04/2008US20080296767 Composition for cleaning semiconductor device
12/04/2008US20080296766 Reduced inductance in ball grid array packages
12/04/2008US20080296765 Semiconductor element and method of manufacturing the same
12/04/2008US20080296764 Enhanced copper posts for wafer level chip scale packaging
12/04/2008US20080296763 Multi-Die Wafer Level Packaging
12/04/2008US20080296762 Semiconductor device
12/04/2008US20080296761 Cylindrical Bonding Structure and method of manufacture
12/04/2008US20080296760 Semiconductor apparatus and method for manufacturing same
12/04/2008US20080296759 Semiconductor packages
12/04/2008US20080296758 Protection and Connection of Devices Underneath Bondpads
12/04/2008US20080296757 Fluid spreader
12/04/2008US20080296756 Heat spreader compositions and materials, integrated circuitry, methods of production and uses thereof
12/04/2008US20080296755 Semiconductor device
12/04/2008US20080296754 Apparatus to minimize thermal impedance using copper on die backside
12/04/2008US20080296753 Molded ceramic surface mount package
12/04/2008US20080296752 Substrate with pin, manufacturing method thereof, and semiconductor product
12/04/2008US20080296751 Semiconductor package
12/04/2008US20080296750 Semiconductor device
12/04/2008US20080296749 Package stacking through rotation
12/04/2008US20080296748 Transmission line stacking
12/04/2008US20080296747 Micromechanical component having thin-layer encapsulation and production method
12/04/2008US20080296746 Lead frame and manufacturing method thereof, and semiconductor apparatus and manufacturing method thereof
12/04/2008US20080296745 Semiconductor device having semiconductor chip and antenna
12/04/2008US20080296744 Integrated Circuit
12/04/2008US20080296743 Semiconductor device and method for fabricating the same
12/04/2008US20080296741 Semiconductor device
12/04/2008US20080296740 Method of manufacturing semiconductor device, and semiconductor device
12/04/2008US20080296739 Method of forming a thin film structure and stack structure comprising the thin film
12/04/2008US20080296735 Semiconductor device and method of manufacturing the same
12/04/2008US20080296730 Semiconductor device
12/04/2008US20080296728 Semiconductor structure for fuse and anti-fuse applications
12/04/2008US20080296727 Programmable poly fuse
12/04/2008US20080296726 Fuse Structure for Maintaining Passivation Integrity
12/04/2008US20080296725 Semiconductor component and method for fabricating the same
12/04/2008US20080296724 Semiconductor substrate and manufacturing method of semiconductor device
12/04/2008US20080296718 Semiconductor device and optical device module having the same
12/04/2008US20080296717 Packages and assemblies including lidded chips
12/04/2008US20080296716 Sensor semiconductor device and manufacturing method thereof
12/04/2008US20080296708 Integrated sensor arrays and method for making and using such arrays
12/04/2008US20080296697 Programmable semiconductor interposer for electronic package and method of forming
12/04/2008US20080296690 Metal interconnect System and Method for Direct Die Attachment
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