Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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12/10/2008 | CN101320736A Organic light emitting display device and mother substrate thereof |
12/10/2008 | CN101320730A Semiconductor chip with built-in test circuit |
12/10/2008 | CN101320729A Semiconductor integrated circuit |
12/10/2008 | CN101320726A Semiconductor device and manufacturing method thereof |
12/10/2008 | CN101320725A Parametric testline with increased test pattern areas |
12/10/2008 | CN101320724A Multi-phase wiring structure and method |
12/10/2008 | CN101320723A 半导体装置 Semiconductor device |
12/10/2008 | CN101320722A 半导体装置 Semiconductor device |
12/10/2008 | CN101320721A 半导体装置 Semiconductor device |
12/10/2008 | CN101320720A 半导体装置 Semiconductor device |
12/10/2008 | CN101320719A Line carrier plate and preparation thereof |
12/10/2008 | CN101320718A Memory devices including separating insulating structures on wires and methods of forming |
12/10/2008 | CN101320717A Thermoelectricity separated light emitting diode seat body and its cooling unit structure |
12/10/2008 | CN101320716A Semiconductor device and method for manufacturing same |
12/10/2008 | CN101320715A Semiconductor device |
12/10/2008 | CN101320702A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
12/10/2008 | CN101320699A LED packaging method and packaged LED |
12/10/2008 | CN101320696A Stack type packaging structure and its manufacturing method |
12/10/2008 | CN101319775A High thermal conductivity flexible sealant of power type LED lamp |
12/10/2008 | CN101319774A Passive radiator and heat radiating device of road lamp |
12/10/2008 | CN101319773A Luminous module |
12/10/2008 | CN101319772A Bidirectional cooling LED apparatus |
12/10/2008 | CN101319771A LED illuminating apparatus |
12/10/2008 | CN101319090A Aryl(thio)ether aryl polysiloxane composition and methods for making and using same |
12/10/2008 | CN100442573C Hygroscopic molding |
12/10/2008 | CN100442541C Diode suitable for technology of automatic aligning to metallic silicide |
12/10/2008 | CN100442516C Semiconductor integrated circuit device and electronic card using it |
12/10/2008 | CN100442514C Semiconductor integrated circuit device and electronic card using it |
12/10/2008 | CN100442513C Semiconductor integrated circuit device and electronic card using it |
12/10/2008 | CN100442512C Electrostatic discharge device |
12/10/2008 | CN100442510C Static discharging protection circuit for collimation shifter considering power starting sequence |
12/10/2008 | CN100442504C Multi-chip module semiconductor devices |
12/10/2008 | CN100442503C Semiconductor integrated circuit device |
12/10/2008 | CN100442502C Semiconductor, electronic device and their producing method and electronic instrument |
12/10/2008 | CN100442501C Embedded capacitors for assembly |
12/10/2008 | CN100442500C Fin-type antifuse |
12/10/2008 | CN100442499C Semiconductor device |
12/10/2008 | CN100442498C Deep via seed repair using electroless plating chemistry |
12/10/2008 | CN100442497C Semiconductor device having layered chips |
12/10/2008 | CN100442496C Reinforced type thin film crystal-coated packaging structure |
12/10/2008 | CN100442495C Flexible substrate for packaging |
12/10/2008 | CN100442494C Electrode, electronic component and substrate |
12/10/2008 | CN100442493C Contact unit for high power semiconductor module an round disk |
12/10/2008 | CN100442492C Contour structures to highlight inspection regions |
12/10/2008 | CN100442491C 电子回路装置 Electronic circuit device |
12/10/2008 | CN100442490C Bipolar and CMOS integration with reduced contact height |
12/10/2008 | CN100442489C Semiconductor device and mfg. method thereof |
12/10/2008 | CN100442488C Using external radiators with electroosmotic pumps for cooling integrated circuits |
12/10/2008 | CN100442487C Jet generating device and electronic apparatus |
12/10/2008 | CN100442486C Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same |
12/10/2008 | CN100442485C IC packaging structure |
12/10/2008 | CN100442484C Method and apparatus for forming a flip chip semiconductor package and method for producing a substrate for the flip chip semiconductor package |
12/10/2008 | CN100442483C Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment |
12/10/2008 | CN100442482C Inverted J-lead package for power devices |
12/10/2008 | CN100442481C Semiconductor device and its mfg. method |
12/10/2008 | CN100442480C Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer |
12/10/2008 | CN100442479C Method for repairing thin-film transistor array substrate and thin film removing method |
12/10/2008 | CN100442471C Semiconductor device and method for fabricating the same |
12/10/2008 | CN100442465C Producing process for chip packaging body without kernel dielectric layer |
12/10/2008 | CN100442404C Electronic component and manufacturing method of electronic component |
12/10/2008 | CN100442312C Contact chip card, its production method and use thereof |
12/10/2008 | CN100442200C Vibrating device for jet flow generating including a voice coil motor |
12/10/2008 | CN100442199C System for efficiently cooling a processor |
12/10/2008 | CN100442071C Method and arrangement for protecting a chip and checking its authenticity |
12/10/2008 | CN100441633C Epoxy resin composition for sealing and packing optical semiconductor element and optical semiconductor element using the said composition |
12/10/2008 | CN100441619C Resin composition for sealing and semiconductor device sealed with resin |
12/09/2008 | US7464352 Methods for designing, evaluating and manufacturing semiconductor devices |
12/09/2008 | US7463659 Can-type optical transmitting module utilizing a laser diode with impedance matching resistors |
12/09/2008 | US7463492 Array capacitors with voids to enable a full-grid socket |
12/09/2008 | US7463491 Wiring board and a semiconductor device using the same |
12/09/2008 | US7463484 Heatsink apparatus |
12/09/2008 | US7463199 Integrated circuit package including miniature antenna |
12/09/2008 | US7463154 Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith |
12/09/2008 | US7463074 Integrated circuit and method for generating a ready signal |
12/09/2008 | US7462942 Die pillar structures and a method of their formation |
12/09/2008 | US7462941 Power grid layout techniques on integrated circuits |
12/09/2008 | US7462940 Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same |
12/09/2008 | US7462939 Interposer for compliant interfacial coupling |
12/09/2008 | US7462938 Post passivation interconnection schemes on top of IC chip |
12/09/2008 | US7462937 Semiconductor device |
12/09/2008 | US7462936 Formation of circuitry with modification of feature height |
12/09/2008 | US7462935 Structure and method for forming a capacitively coupled chip-to-chip signaling interface |
12/09/2008 | US7462934 Integrated heat sink |
12/09/2008 | US7462933 Ball grid array package enhanced with a thermal and electrical connector |
12/09/2008 | US7462932 Manufacture of mountable capped chips |
12/09/2008 | US7462931 Indented structure for encapsulated devices and method of manufacture |
12/09/2008 | US7462930 Stack chip and stack chip package having the same |
12/09/2008 | US7462929 Semiconductor device and an image sensing device |
12/09/2008 | US7462928 Semiconductor apparatus |
12/09/2008 | US7462927 Pattern film forming method and pattern film forming apparatus |
12/09/2008 | US7462926 Copper or copper alloy substrate covered with a tin layer which is covered by a nickel layer; intermetallic layer between substrate and nickel formed by interaction between the tin layer and the layer of nickel; reduced amount of nickel required |
12/09/2008 | US7462925 Method and apparatus for stacking electrical components using via to provide interconnection |
12/09/2008 | US7462924 Electrical connector with elongated ground contacts |
12/09/2008 | US7462922 Semiconductor device provided with temperature detection function |
12/09/2008 | US7462921 Integrated circuit device, method of manufacturing the same and method of forming vanadium oxide film |
12/09/2008 | US7462905 Nonvolatile semiconductor memory device, semiconductor device and method of manufacturing nonvolatile semiconductor memory device |
12/09/2008 | US7462900 Phase changeable memory devices including nitrogen and/or silicon |
12/09/2008 | US7462888 Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device |
12/09/2008 | US7462886 Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device |
12/09/2008 | US7462885 ESD structure for high voltage ESD protection |