Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2008
12/11/2008US20080303137 Semiconductor devices with layers having extended perimeters for improved cooling and methods for cooling semiconductor devices
12/11/2008US20080303136 Semiconductor device and method for manufacturing same
12/11/2008US20080303135 An electrically conductive pin comprising a pin stern and a pin head attached to the pin stem; pin head has an underside surface defining a continuous curve configured to allow gases to escape from a pin-attach solder region adjacent the underside surface
12/11/2008US20080303134 Semiconductor package and method for fabricating the same
12/11/2008US20080303133 Integrated circuit package system with contoured die
12/11/2008US20080303132 Semiconductor chip packages having cavities
12/11/2008US20080303131 Electrically interconnected stacked die assemblies
12/11/2008US20080303130 Package on package structure
12/11/2008US20080303129 Patterned contact sheet to protect critical surfaces in manufacturing processes
12/11/2008US20080303128 Leadframe with die pad and leads corresponding thereto
12/11/2008US20080303127 Cap-less package and manufacturing method thereof
12/11/2008US20080303126 Microelectromechanical system package and the method for manufacturing the same
12/11/2008US20080303125 Three-dimensional package structure
12/11/2008US20080303124 Lead frame-BGA package with enhanced thermal performance and I/O counts
12/11/2008US20080303123 Integrated circuit package system with leadfinger
12/11/2008US20080303122 Integrated circuit package system with leaded package
12/11/2008US20080303121 Integrated Electronic Circuitry and Heat Sink
12/11/2008US20080303120 Semiconductor chip package
12/11/2008US20080303097 Power FET With Low On-Resistance Using Merged Metal Layers
12/11/2008US20080303093 Semiconductor apparatus
12/11/2008US20080303075 Method for forming element isolation structure of semiconductor device, element isolation structure of semiconductor device, and semiconductor memory device
12/11/2008US20080303066 Semiconductor device
12/11/2008US20080302559 Flexible and elastic dielectric integrated circuit
12/11/2008US20080302515 Fan
12/11/2008DE202008010277U1 Rohchip-Verpackungsstruktur Die-package structure
12/11/2008DE19934031B4 Ohmscher Kontakt zu Halbleitervorrichtungen und ein Verfahren zur Herstellung desselben Ohmic contact to the semiconductor devices and a method of manufacturing the same
12/11/2008DE112007000316T5 Elektronische Baugruppe mit ablösbaren Bauelementen Electronic assembly with removable devices
12/11/2008DE10337569B4 Integrierte Anschlussanordnung und Herstellungsverfahren Integrated terminal assembly and manufacturing processes
12/11/2008DE10229463B4 Halbleiteranordnung und Verfahren zu ihrer Herstellung A semiconductor device and process for their preparation
12/11/2008DE102007038396B3 Micromechanical device has micromechanical construction unit, which has substrate and cap, and cap has outside edge that has multiple staged range chamfer or curvature in area
12/11/2008DE102007035684A1 LED-Gehäuse LED housing
12/11/2008DE102007026768A1 Druckkontaktiertes dreiphasiges Stromrichtermodul Pressure-contacted three-phase power converter module
12/11/2008DE102007025958A1 Baugruppe mit geklebtem Leistungsbaustein Assembly with glued power module
12/11/2008DE102006022254B4 Halbleiterbauteil mit in Kunststoffgehäusemasse eingebetteten Halbleiterbauteilkomponenten, Anordnung für eine Mehrzahl von Halbleiterbauteilen und Verfahren zur Herstellung von Halbleiterbauteilen Semiconductor device having embedded in plastic housing compound semiconductor device components, arrangement for a plurality of semiconductor devices and methods for fabricating semiconductor components
12/11/2008DE10039649B4 Verfahren zur Herstellung eines keramischen Vielschichtbauelements und entsprechendes Vielschichtbauelement A process for producing a ceramic multilayer component and corresponding multilayer component
12/11/2008CA2687424A1 A contact pad and method of forming a contact pad for an integrated circuit
12/10/2008EP2001049A1 Power fet with low on-resistance using merged metal layers
12/10/2008EP2001048A1 Liquid Cooled Power Electronic Circuit Comprising Stacked Direct Die Cooled Packages
12/10/2008EP2001047A1 Semiconductor device
12/10/2008EP2000945A1 Tamper proof card reader
12/10/2008EP1999787A1 Clamping device for a cooling body arrangement
12/10/2008EP1999177A1 Radiation-or thermally-curable barrier sealants
12/10/2008EP1885907A4 Systems and methods for thermal management of electronic components
12/10/2008EP1812893A4 Semiconductor device and driving method of the same
12/10/2008EP1588407B1 Area array package with non-electrically connected solder balls
12/10/2008EP1579495A4 Method for fabrication of semiconductor device
12/10/2008EP1368834B1 Circuit for focused ion beam sensor
12/10/2008EP1356521B1 Power transistor with internally combined low-pass and band-pass matching stages
12/10/2008EP1234331B1 Planar hybrid diode rectifier bridge
12/10/2008CN201163859Y Stack radiator and its radiation fin
12/10/2008CN201163858Y Cooling structure
12/10/2008CN201163857Y Heat radiator
12/10/2008CN201163856Y Radiating air duct structure of electronic device
12/10/2008CN201163855Y Radiating assembly and radiator with the same
12/10/2008CN201163854Y Electronic device with cooling structure
12/10/2008CN201163755Y High power MOSFET driving module
12/10/2008CN201163632Y High power LED device
12/10/2008CN201163631Y Image sensing component and its cover
12/10/2008CN201163630Y 光感测模块封装结构 Optical sensing module package structure
12/10/2008CN201163627Y Forced heat radiating device for semiconductor lighting device
12/10/2008CN201163626Y Chip fast-cooling device
12/10/2008CN201163625Y Pure water radiator of high power thyristor
12/10/2008CN201163624Y Labeling type insulation packaging structure
12/10/2008CN201163623Y Support of light-emitting diode
12/10/2008CN201163622Y Embedded type diode
12/10/2008CN201163127Y Temperature-controllable constant temperature flat plate apparatus
12/10/2008CN201163011Y Direct cooling type LED road lamp
12/10/2008CN201163010Y LED lamp apparatus
12/10/2008CN201163008Y LED lamp with double-layer circuit board
12/10/2008CN201163000Y Four-side back light module unit
12/10/2008CN201162999Y Three-surface back light module unit
12/10/2008CN201162998Y Unicolor back light module unit
12/10/2008CN201162997Y Full-color back light module unit
12/10/2008CN201162983Y High-efficiency cooling type automobile front shining lamp
12/10/2008CN201162972Y LED road lamp light source module group
12/10/2008CN201162957Y Hand-held explosion-proof searchlight
12/10/2008CN101322450A IC packages with internal heat dissipation structures
12/10/2008CN101322245A Electronic component package with EMI shielding
12/10/2008CN101322244A Laser fuse structures for high power applications
12/10/2008CN101322243A Magnetic self-assembly for integrated circuit packages
12/10/2008CN101322242A Cap for airtight sealing, package for housing electronic part, and process for producing airtightly sealing cap
12/10/2008CN101322232A Solder deposition and thermal processing of thin-die thermal interface material
12/10/2008CN101322231A High density three dimensional semiconductor die package
12/10/2008CN101322020A Wireless pressure sensor and method of forming same
12/10/2008CN101321813A Prepreg, process for producing prepreg, substrate, and semiconductor device
12/10/2008CN101321799A Liquid resin composition for electronic element and electronic element device
12/10/2008CN101321451A Radiator and modularized radiator
12/10/2008CN101321450A Method for accelerated cooling of thin type electronic device by air suction mode
12/10/2008CN101320938A Multi-use power module
12/10/2008CN101320886A Cap-less package and manufacturing method thereof
12/10/2008CN101320779A Light-emitting diode
12/10/2008CN101320769A Seat body structure of light emitting diode
12/10/2008CN101320768A Packaging method for LED
12/10/2008CN101320767A Radiating module of light emitting diode
12/10/2008CN101320748A Organic light emitting display device and method of manufacturing the same
12/10/2008CN101320747A Charge transmission device of solid pick-up element, solid pick-up device and electronic information equipment
12/10/2008CN101320742A Semiconductor device and optical device module having the same
12/10/2008CN101320740A Display substrate, a method of manufacturing the display substrate and a display apparatus having the display substrate
12/10/2008CN101320739A Thin film transistor array panel
12/10/2008CN101320738A Pixel structure
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