| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/16/2008 | US7466026 Passivation layer assembly on a substrate and display substrate having the same |
| 12/16/2008 | US7466025 Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide |
| 12/16/2008 | US7466024 Multi-chip semiconductor device package |
| 12/16/2008 | US7466023 Semiconductor light emitting device and plant cultivating system |
| 12/16/2008 | US7466022 Wafer-level seal for non-silicon-based devices |
| 12/16/2008 | US7466021 Memory packages having stair step interconnection layers |
| 12/16/2008 | US7466020 Power module |
| 12/16/2008 | US7466019 Rectangular semi-conducting support for microelectronics and method for making same |
| 12/16/2008 | US7466018 MEMS device wafer-level package |
| 12/16/2008 | US7466017 Laser apparatus and method for assembling the same |
| 12/16/2008 | US7466016 Bent lead transistor |
| 12/16/2008 | US7466015 Supporting frame for surface-mount diode package |
| 12/16/2008 | US7466014 Flip chip mounted semiconductor device package having a dimpled leadframe |
| 12/16/2008 | US7466013 Semiconductor die structure featuring a triple pad organization |
| 12/16/2008 | US7466012 Power semiconductor package |
| 12/16/2008 | US7466009 Method for reducing dislocation threading using a suppression implant |
| 12/16/2008 | US7466007 Post passivation interconnection schemes on top of IC chip |
| 12/16/2008 | US7466006 Structure and method for RESURF diodes with a current diverter |
| 12/16/2008 | US7466000 Semiconductor device having multiple substrates |
| 12/16/2008 | US7465995 Resistor structure for ESD protection circuits |
| 12/16/2008 | US7465994 Layout structure for ESD protection circuits |
| 12/16/2008 | US7465993 Semiconductor chips having improved electrostatic discharge protection circuit arrangement |
| 12/16/2008 | US7465990 Semiconductor device having super junction structure |
| 12/16/2008 | US7465977 Method for producing a packaged integrated circuit |
| 12/16/2008 | US7465975 Top layers of metal for high performance IC's |
| 12/16/2008 | US7465974 Integrated circuit device and method for forming the same |
| 12/16/2008 | US7465678 Deformable organic devices |
| 12/16/2008 | US7465664 Method for fabricating semiconductor device to lower source/drain sheet resistance |
| 12/16/2008 | US7465660 Graded/stepped silicide process to improve MOS transistor |
| 12/16/2008 | US7465658 Oxygen bridge structures and methods to form oxygen bridge structures |
| 12/16/2008 | US7465653 Reliable metal bumps on top of I/O pads after removal of test probe marks |
| 12/16/2008 | US7465651 Integrated circuit packages with reduced stress on die and associated methods |
| 12/16/2008 | US7465647 Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device |
| 12/16/2008 | US7465617 Method of fabricating a semiconductor device having a silicon oxide layer, a method of fabricating a semiconductor device having dual spacers, a method of forming a silicon oxide layer on a substrate, and a method of forming dual spacers on a conductive material layer |
| 12/16/2008 | US7465608 Three-dimensional multichip module |
| 12/16/2008 | US7465600 Package for a micro-electro mechanical device |
| 12/16/2008 | US7465488 Bow control in an electronic package |
| 12/16/2008 | US7464854 Method and apparatus for forming a low profile wire loop |
| 12/16/2008 | US7464747 Cooling device for heat-generating elements |
| 12/16/2008 | US7464603 Sensor component with a cavity housing and a sensor chip and method for producing the same |
| 12/11/2008 | WO2008151301A1 A contact pad and method of forming a contact pad for an integrated circuit |
| 12/11/2008 | WO2008150898A2 Electronic assemblies without solder and methods for their manufacture |
| 12/11/2008 | WO2008150775A2 Heat spreader compositions and materials, integrated circuitry, methods of production and uses thereof |
| 12/11/2008 | WO2008150596A2 Notebook computer with hybrid diamond heat spreader |
| 12/11/2008 | WO2008150564A1 Method of packaging a microchip |
| 12/11/2008 | WO2008149818A1 Laminated heat dissipating base body, and heat dissipating unit and electronic device using the laminated heat dissipating base body |
| 12/11/2008 | WO2008149751A1 Process for producing semiconductor device, semiconductor production apparatus, and recording medium |
| 12/11/2008 | WO2008149584A1 Electronic part apparatus and process for manufacturing the same |
| 12/11/2008 | WO2008148741A1 Subassembly with glued power component |
| 12/11/2008 | WO2008121479A3 Method and structure for making a top-side contact to a substrate |
| 12/11/2008 | WO2008114465A8 Method of forming solder bumps and solder bump-forming assembly |
| 12/11/2008 | WO2008110533A3 Electric component |
| 12/11/2008 | WO2008073738A3 Stress-improved flip-chip semiconductor device having half-etched leadframe |
| 12/11/2008 | WO2008060447B1 Microcircuit package having ductile layer |
| 12/11/2008 | US20080305628 Semiconductor device with connecting via and dummy via and method of manufacturing the same |
| 12/11/2008 | US20080305587 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 12/11/2008 | US20080305585 Method for Direct Heat Sink Attachment |
| 12/11/2008 | US20080304790 Optical device and method for fabricating the same |
| 12/11/2008 | US20080304054 Method for Analyzing an Integrated Circuit, Apparatus and Integrated Circuit |
| 12/11/2008 | US20080303436 Method for pattern metalization of substrates |
| 12/11/2008 | US20080303177 Bonding pad structure |
| 12/11/2008 | US20080303176 Patterned Die Attach and Packaging Method Using the Same |
| 12/11/2008 | US20080303175 Electronic circuit package |
| 12/11/2008 | US20080303174 Chip package without core and stacked chip package structure |
| 12/11/2008 | US20080303173 Semiconductor device, a method of manufacturing a semiconductor device and a testing method of the same |
| 12/11/2008 | US20080303172 Method for stacking semiconductor chips and semiconductor chip stack produced by the method |
| 12/11/2008 | US20080303171 Semiconductor device and a fabrication process thereof |
| 12/11/2008 | US20080303170 Semiconductor device and method of manufacturing semiconductor device |
| 12/11/2008 | US20080303169 Integrated Circuit Arrangment Including Vias Having Two Sections, and Method For Producing the Same |
| 12/11/2008 | US20080303168 Structure for preventing pad peeling |
| 12/11/2008 | US20080303167 Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same |
| 12/11/2008 | US20080303166 Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel |
| 12/11/2008 | US20080303165 Circuit arrangement and integrated circuit |
| 12/11/2008 | US20080303164 Structure and method of reducing electromigration cracking and extrusion effects in semiconductor devices |
| 12/11/2008 | US20080303163 Through silicon via dies and packages |
| 12/11/2008 | US20080303162 Semiconductor device |
| 12/11/2008 | US20080303161 Semiconductor device and manufacturing method thereof |
| 12/11/2008 | US20080303160 Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning |
| 12/11/2008 | US20080303159 Thin Silicon based substrate |
| 12/11/2008 | US20080303158 Semiconductor integrated circuit device |
| 12/11/2008 | US20080303157 High thermal conductivity substrate for a semiconductor device |
| 12/11/2008 | US20080303156 Semiconductor Devices and Methods of Forming Interconnection Lines Therein |
| 12/11/2008 | US20080303155 Dielectric barrier films for use as copper barrier layers in semiconductor trench and via structures |
| 12/11/2008 | US20080303154 Through-silicon via interconnection formed with a cap layer |
| 12/11/2008 | US20080303153 Semiconductor device, manufacturing method thereof, and semiconductor device product |
| 12/11/2008 | US20080303152 Contact pad and method of forming a contact pad for an integrated circuit |
| 12/11/2008 | US20080303151 Method of Packaging a Microchip |
| 12/11/2008 | US20080303150 High-Density Fine Line Structure And Method Of Manufacturing The Same |
| 12/11/2008 | US20080303149 Electronic Component |
| 12/11/2008 | US20080303148 Pad arrangement of driver ic chip for lcd and related circuit pattern structure of tab package |
| 12/11/2008 | US20080303147 High-frequency circuit device and radar |
| 12/11/2008 | US20080303146 Process for manufacturing substrate with bumps and substrate structure |
| 12/11/2008 | US20080303145 Printed Circuit Board, Printed Circuit Board Manufacturing Method and Electronic Device |
| 12/11/2008 | US20080303144 Structure, method and system for assessing bonding of electrodes in fcb packaging |
| 12/11/2008 | US20080303143 Microelectronic Die Including Locking Bump and Method of Making Same |
| 12/11/2008 | US20080303142 Electronic system with vertical intermetallic compound |
| 12/11/2008 | US20080303141 Method for etching a substrate and a device formed using the method |
| 12/11/2008 | US20080303140 Semiconductor device |
| 12/11/2008 | US20080303139 Chip-in-slot interconnect for 3d chip stacks |
| 12/11/2008 | US20080303138 Insulated gate bipolar transistor |