Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2014
07/30/2014CN203746825U 芯片封装结构 Chip package structure
07/30/2014CN203746824U 无引脚的表面贴装组件封装体以及电子设备 Leadless surface mount package and electronic equipment components
07/30/2014CN203746823U 一种pin二极管散热装置 One kind of pin diode heat sink
07/30/2014CN203746822U 带有双周期图形的蓝宝石衬底 Sapphire substrate with a two-cycle pattern
07/30/2014CN203746821U 一种便于安装的功率半导体模块 A power semiconductor module is easy to install
07/30/2014CN203746820U 半导体封装单元 Semiconductor packaging unit
07/30/2014CN203745776U 阵列基板、液晶面板及显示装置 An array substrate, a liquid crystal panel and a display device
07/30/2014CN1949952B 多层配线板、使用多层配线板的半导体器件及其制造方法 Multi-layer wiring board, a semiconductor device and a manufacturing method of the multilayer wiring board
07/30/2014CN1668461B 层压玻璃窗板 Laminated glazing panels
07/30/2014CN103959555A 电容性盲插模块互连 Capacitive blindmate module interconnection
07/30/2014CN103959466A 摄像元件收纳用封装及摄像装置 The imaging element and the imaging device with a sealing housing
07/30/2014CN103959463A 片上电容器及其组装方法 The on-chip capacitor and method of assembly
07/30/2014CN103959462A 用于集成电路（ic）芯片的散热结构设计 Integrated circuit design for heat dissipation structure (ic) chips
07/30/2014CN103959461A 陶瓷封装 Ceramic package
07/30/2014CN103959460A 整合多个苯并环丁烯层与基底的方法和相关器件 Integration of multiple benzocyclobutene layer and the substrate methods and related devices
07/30/2014CN103959449A 用于接触半导体的方法和用于半导体的接触组件 The method of contacting the semiconductor and a contact assembly for a semiconductor
07/30/2014CN103959448A 金属配线形成用的转印基板及基于所述转印用基板的金属配线的形成方法 The method of forming a metal wiring formed on the substrate and the transfer substrate for transferring a metal wiring
07/30/2014CN103958719A 防篡改的无定形合金接合部 Amorphous alloy joined tamperproof
07/30/2014CN103958578A 导热片、led安装用基板以及led模块 Thermally conductive sheet, led mounting substrate and led module
07/30/2014CN103958234A 电气设备的冷却装置 Cooling apparatus for electrical equipment
07/30/2014CN103956360A 集成音乐封装的引脚式led Integrated music style led pin package
07/30/2014CN103956354A 以石墨烯为金属化层和扩散势垒层的互连线及其制备方法 Graphene metallization layer and a diffusion barrier layer of interconnecting lines and preparation method
07/30/2014CN103956353A 半导体器件及其形成方法 Semiconductor device and method for forming
07/30/2014CN103956352A 功率半导体芯片的铜金属化结构及其制作方法 Copper metallization structure and method of making power semiconductor chips
07/30/2014CN103956351A 边长渐变多边形平面螺旋电感及其生成方法 Gradient polygon side spiral inductor and Generation
07/30/2014CN103956350A 包括将半导体芯片键合至铜表面的烧结接合部的模块 Comprising a semiconductor chip bonded to the copper surface of a sintered joint module
07/30/2014CN103956349A 功率半导体芯片的铜金属化结构及其制作方法 Copper metallization structure and method of making power semiconductor chips
07/30/2014CN103956348A 一种核心电路模块端口的安全布局新方法 Security layout of the new method of core circuit module ports
07/30/2014CN103956347A 一种3d封装芯片 One kind of 3d chip package
07/30/2014CN103956346A 一种制作3d封装芯片的散热方法 A cooling method 3d packaged chip production
07/30/2014CN103956345A 集成电路芯片、嵌入式设备及集成电路加工方法 Integrated circuit chips, embedded devices and integrated circuits processing method
07/30/2014CN103956344A 一种适合平行封焊工艺的陶瓷管帽及其制造方法 A parallel closure welding process and method of manufacturing the ceramic cap fit
07/30/2014CN103956343A 一种芯片封装结构及其制作工艺 A chip package structure and manufacturing process
07/30/2014CN103956342A 内含固体金属导热填充物的高导热陶瓷基板及其制备工艺 Containing high thermal conductivity of the ceramic substrate and preparation process of the solid metal thermal filler
07/30/2014CN103956341A 一种汽车发电机用旋接式二极管 An automobile generators screwing diode
07/30/2014CN103956331A 一种用于多孔互连介质表面封孔的薄膜及其制备方法 Film and preparation method for surface sealing of porous media interconnects
07/30/2014CN103956330A 用于集成电路及类似物的侧堆叠互连 Integrated circuits and the like for the side of the stack of interconnect
07/30/2014CN103956326A 无源集成转接板的制作方法及所对应的无源集成转接板 Production methods of passive integrated adapter plate and the corresponding passive integrated adapter plate
07/30/2014CN103955738A 双界面智能卡封装工艺及双界面智能卡 Dual interface smart card packaging technology and dual interface smart card
07/30/2014CN103954162A 一种强化微通道换热的低阻水力空化结构 An enhanced low resistance microchannel heat hydrodynamic cavitation structure
07/30/2014CN103951828A 有机硅树脂 Silicone resin
07/30/2014CN103262671B 适合于卷取大规模制造的电桥的制造方法 Suitable for large scale manufacturing method for manufacturing the winding of the bridge
07/30/2014CN103021989B 一种多组件的芯片封装结构 A multi-chip package assembly
07/30/2014CN102978430B 一种引线支架的制造方法 The method of manufacturing a lead frame
07/30/2014CN102884135B 印刷电路板用树脂组合物 A printed circuit board with a resin composition
07/30/2014CN102834534B 镁基复合构件、散热构件和半导体装置 Magnesium matrix composite components, cooling components and semiconductor devices
07/30/2014CN102637612B 固设半导体芯片于线路基板的方法及其结构 Fixing the semiconductor chip to the circuit substrate is provided a method and structure
07/30/2014CN102543841B 半导体器件、形成栓塞的方法 A semiconductor device, method for forming plug
07/30/2014CN102484099B 用于不同半导体裸片和/或晶片的半导体晶片到晶片结合 The semiconductor wafer is used for different semiconductor die and / or wafer to wafer bonding
07/30/2014CN102473686B 元件收纳用封装及安装结构体 Element housing and the mounting structure with a sealing
07/30/2014CN102456653B 凸点下金属化层(ubm)结构及其形成方法 The under bump metallization layer (ubm) Structure and forming method
07/30/2014CN102439715B 热交换器及其制造方法 And a method of manufacturing a heat exchanger
07/30/2014CN102433105B 导热片、其制造方法以及使用了导热片的散热装置 Thermally conductive sheet, and a method of manufacturing a heat sink using a heat conductive sheet
07/30/2014CN102422413B 热交换器、半导体装置及它们的制造方法 A heat exchanger, a semiconductor device and production method thereof
07/30/2014CN102420223B 电路装置及其制造方法 Circuit device and manufacturing method thereof
07/30/2014CN102420203B 微电子封装中焊料凸点/金属化层连接结构体及其应用 Microelectronic package solder bump / metallization layer connection structure and its application
07/30/2014CN102379038B 电子器件安装构造及电子器件安装方法 The electronic component mounting structure and an electronic device mounting method
07/30/2014CN102362346B 通孔结构及其方法 The through-hole structure and a method
07/30/2014CN102308435B 高频模块 High-frequency module
07/30/2014CN102280434B 真空气密的有机封装载体与传感器组件封装结构 Organic package carrier and sensor assembly package structure vacuumtight
07/30/2014CN102214616B 金属导电结构及其制作方法 Metal conductive structure and production methods
07/30/2014CN101924044B 制造大功率半导体模块的方法和大功率半导体模块 Method of manufacturing high-power semiconductor module and power semiconductor module
07/30/2014CN101771068B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
07/30/2014CN101621048B 复合半导体器件、印头以及图像形成装置 Compound semiconductor devices, print head and an image forming apparatus
07/30/2014CN101257973B 固化催化剂、组合物、电子器件和相关方法 The catalyst composition of electronic devices and related methods curing
07/29/2014US8792238 Heat-dissipating module having loop-type vapor chamber
07/29/2014US8792034 Solid-state imaging device with charge transfer transistor on different substrates
07/29/2014US8791583 Apparatus for molding a semiconductor wafer and process therefor
07/29/2014US8791582 Integrated circuit package with voltage distributor
07/29/2014US8791581 Three dimensional structure memory
07/29/2014US8791580 Integrated circuit packages having redistribution structures
07/29/2014US8791579 Adjusting sizes of connectors of package components
07/29/2014US8791578 Through-silicon via structure with patterned surface, patterned sidewall and local isolation
07/29/2014US8791577 Bit cell with triple patterned metal layer structures
07/29/2014US8791576 Semiconductor device having groove-shaped via-hole
07/29/2014US8791575 Microelectronic elements having metallic pads overlying vias
07/29/2014US8791573 Skewed partial column input/output floorplan
07/29/2014US8791572 Buried metal-semiconductor alloy layers and structures and methods for fabrication thereof
07/29/2014US8791571 System and method for preventing etch arcing during semiconductor processing
07/29/2014US8791569 Semiconductor apparatus
07/29/2014US8791568 Semiconductor device
07/29/2014US8791567 Semiconductor device
07/29/2014US8791566 Aluminum nitride substrate, aluminum nitride circuit board, semiconductor apparatus, and method for manufacturing aluminum nitride substrate
07/29/2014US8791565 Electrode foil and organic device
07/29/2014US8791564 Method of Manufacturing a semiconductor module and device for the same
07/29/2014US8791563 Semiconductor device and manufacturing method thereof
07/29/2014US8791562 Stack package and semiconductor package including the same
07/29/2014US8791561 Semiconductor device and its manufacture method
07/29/2014US8791560 Interdigitated conductive support for GaN semiconductor die
07/29/2014US8791559 Semiconductor package with package on package structure
07/29/2014US8791558 Stacked semiconductor package
07/29/2014US8791557 Microelectromechanical device with integrated package
07/29/2014US8791556 Integrated circuit packaging system with routable circuitry and method of manufacture thereof
07/29/2014US8791555 Semiconductor device and lead frame
07/29/2014US8791554 Substrates for semiconductor devices including internal shielding structures and semiconductor devices including the substrates
07/29/2014US8791550 Hybrid conductor through-silicon-via for power distribution and signal transmission
07/29/2014US8791549 Wafer backside interconnect structure connected to TSVs
07/29/2014US8791532 Sensor mounted in flip-chip technology on a substrate
07/29/2014US8791528 Methods of manufacturing metal-silicide features
07/29/2014US8791513 Metal wiring and method of manufacturing the same, and metal wiring substrate and method of manufacturing the same
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