Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2008
12/17/2008CN101326648A Light emitting device, semiconductor device, and its manufacturing method
12/17/2008CN101326646A 单片集成的半导体材料和器件 Monolithically integrated semiconductor materials and devices
12/17/2008CN101326638A Guardwall structures for ESD protection
12/17/2008CN101326637A Method for manufacturing electronic component and thermal conduction component as well as method for installing thermal conduction component for electronic component
12/17/2008CN101326636A Device and method for assembling a top and bottom exposed packaged semiconductor
12/17/2008CN101326634A Reflective sensor
12/17/2008CN101326213A Epoxy resin composition for encapsulation and electronic component device
12/17/2008CN101325863A Radiator for cooling automatic cycle liquid
12/17/2008CN101325862A Cabinet, radiating device and method for installing the radiating device
12/17/2008CN101325860A Electronic device with passive heat radiation mechanism
12/17/2008CN101325859A Radiating device
12/17/2008CN101325846A 多层配线基板及其制造方法 A multilayer wiring board and its manufacturing method
12/17/2008CN101325845A Multilayer printed circuit board and method of fabricating the same
12/17/2008CN101325310A Light emitting device and method of fabricating a light emitting device
12/17/2008CN101325233A Encapsulation structure and light source of luminous element
12/17/2008CN101325228A LED structure and combination method thereof
12/17/2008CN101325207A Thin-film transistor array substrate for X-ray detector and x-ray detector
12/17/2008CN101325205A Encapsulation structure of image sensing chip
12/17/2008CN101325204A Sensing chip structure with overlapping pattern layer, sensing chip encapsulation and preparation method
12/17/2008CN101325202A Thin film transistor array panel and manufacturing method thereof
12/17/2008CN101325201A Array substrate structure of transparent film transistor and manufacturing method thereof
12/17/2008CN101325199A ROM structure and corresponding ROM
12/17/2008CN101325197A High voltage and high power boost conveter with co-packaged schottky diode
12/17/2008CN101325196A Boost converter with integrated high power discrete fet and low voltage controller
12/17/2008CN101325194A Stacking encapsulation structure with symmetric multi-chip migration up and down
12/17/2008CN101325192A Substrate easy to measure temperature and manufacturing method thereof
12/17/2008CN101325191A Square flat non-pin encapsulation structure with pattern on chip
12/17/2008CN101325190A Square flat non-pin encapsulation structure with pattern on the conductor frame
12/17/2008CN101325189A 半导体器件 Semiconductor devices
12/17/2008CN101325188A Wafer level semiconductor package with dual side build-up layers and method thereof
12/17/2008CN101325187A Multi-layer substrate surface treating layer structure and manufacturing method thereof
12/17/2008CN101325186A Insulating sheet and method for producing it, and power module comprising the insulating sheet
12/17/2008CN101325185A Heat pipe radiator and method of processing the same
12/17/2008CN101325184A Semiconductor device and manufacturing method thereof
12/17/2008CN101325183A Ultra-thin cavity type power module and encapsulation method thereof
12/17/2008CN101325182A Wiring substrate with reinforcing member
12/17/2008CN101325179A Method of fabricating semiconductor memory device having self-aligned electrode
12/17/2008CN101325177A Method for producing conductor structures and applications thereof
12/17/2008CN101325174A Method for forming Ti film and TiN film, contact structure, computer readable storing medium and computer program
12/17/2008CN101325167A Method of manufacturing a semiconductor device having an even coating thickness and related device
12/17/2008CN101325166A Structure of IC and forming method thereof
12/17/2008CN101325165A Method for joining radiator and power component with low heat
12/17/2008CN101325163A Memory card and manufacturing method thereof
12/17/2008CN101324325A LED module unit
12/17/2008CN100444714C Radiator
12/17/2008CN100444520C Surface acoustic wave device, package for the device, and method of fabricating the device
12/17/2008CN100444417C Led package with metal reflection layer and method of manufacturing the same
12/17/2008CN100444415C Air tight high-heat conducting chip packaging assembly
12/17/2008CN100444402C Semiconductor device
12/17/2008CN100444400C Power semiconductor device and method therefor
12/17/2008CN100444396C Solid-state imaging apparatus, wiring substrate and methods of manufacturing the same
12/17/2008CN100444392C Solid-state imaging method and apparatus
12/17/2008CN100444386C Guard rings on semiconductor substrate
12/17/2008CN100444384C RF signal integration static release protection circuit realized by the inductor
12/17/2008CN100444383C Thin film transistor, pixel structure, and method for repairing pixel structure
12/17/2008CN100444379C Stacked semiconductor device and semiconductor chip control method
12/17/2008CN100444378C Electrostatic protection circuit
12/17/2008CN100444377C Static discharge protection circuit and method for providing semiconductor circuit
12/17/2008CN100444376C Semiconductor device and manufacturing method thereof
12/17/2008CN100444375C Integrated circuit with additional mini-pads connected by an under-bump metallization and method for production thereof
12/17/2008CN100444374C Printed circuit board and electronic apparatus including printed circuit board
12/17/2008CN100444373C Void-free circuit board and semiconductor package having the same
12/17/2008CN100444372C Semiconductor package and manufacturing method therefor
12/17/2008CN100444371C 功率半导体封装 Power semiconductor packages
12/17/2008CN100444370C Semiconductor device, circuit substrate, electro-optic device and electronic appliance
12/17/2008CN100444369C High power integrated ciruit chip cooling device
12/17/2008CN100444368C Integrated liquid cooling heat abstractor
12/17/2008CN100444367C Heat pipe radiator and mounting method thereof
12/17/2008CN100444366C Fastener of radiator
12/17/2008CN100444365C Thermal interface material and heat sink configuration
12/17/2008CN100444364C Heat pipe radiator
12/17/2008CN100444363C Radiator cover and radiator assembly
12/17/2008CN100444362C Radiator
12/17/2008CN100444361C Chip packing structure
12/17/2008CN100444360C Solid-state optical device
12/17/2008CN100444359C Electronic part and method of manufacturing the same
12/17/2008CN100444358C Insulated power semiconductor module with reduced partial discharge and manufacturing method
12/17/2008CN100444357C Chip package structure
12/17/2008CN100444356C Power module and method of manufacturing the same
12/17/2008CN100444355C Thin film transistor array base plate and its manufacturing method
12/17/2008CN100444345C Method and apparatus for bonding electronic components
12/17/2008CN100444344C Electrical interconnection structure formation
12/17/2008CN100444341C Device having a compliant electrical interconnects and compliant sealing element
12/17/2008CN100444340C Manufacturing method of semiconductor device and semiconductor device
12/17/2008CN100444339C Lead frame for semiconductor package and method of fabricating semiconductor package
12/17/2008CN100444314C Semiconductor device and manufacturing method thereof
12/17/2008CN100444292C Sheet solid electrolytic condensor with small size and simple structure
12/17/2008CN100444072C Fan controlling equipment and method
12/17/2008CN100444011C Lower substrate, display apparatus having the same and method of manufacturing the same
12/16/2008US7467360 LSI design support apparatus and LSI design support method
12/16/2008US7466618 Current limiting antifuse programming path
12/16/2008US7466577 Semiconductor storage device having a plurality of stacked memory chips
12/16/2008US7466553 Cooling system
12/16/2008US7466550 Integrated heat dissipating assembly
12/16/2008US7466549 Cooling arrangement for server blades
12/16/2008US7466031 Structure and method of forming metal buffering layer
12/16/2008US7466030 Semiconductor device and fabrication process thereof
12/16/2008US7466029 Chip on chip device including basic chips capable of functioning independently from each other, and a system in package device including the chip on chip device
12/16/2008US7466028 Semiconductor contact structure
12/16/2008US7466027 Interconnect structures with surfaces roughness improving liner and methods for fabricating the same