Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2008
12/18/2008US20080308946 Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
12/18/2008US20080308945 Semiconductor Integrated Circuit
12/18/2008US20080308944 Method for eliminating duo loading effect using a via plug
12/18/2008US20080308943 Wiring structure and semiconductor device, and their fabrication methods
12/18/2008US20080308942 novolak resin, polybenzocyclobutene, polyhydroxystyrene, polyacrylate, polymethacrylate, alicyclic polymer, and epoxy resin; integrated circuits; semiconductors
12/18/2008US20080308940 Lateral current carrying capability improvement in semiconductor devices
12/18/2008US20080308939 Semiconductor device and method for fabricating semiconductor device
12/18/2008US20080308938 Under bump metallurgy structure and wafer structure using the same and method of manufacturing wafer structure
12/18/2008US20080308937 Copper-free semiconductor device interface and methods of fabrication and use thereof
12/18/2008US20080308936 Method and sturcture for self-aligned device contacts
12/18/2008US20080308935 Semiconductor chip package, semiconductor package including semiconductor chip package, and method of fabricating semiconductor package
12/18/2008US20080308934 Solder bump interconnect for improved mechanical and thermo-mechanical performance
12/18/2008US20080308933 Integrated circuit package system with different connection structures
12/18/2008US20080308932 Semiconductor package structures
12/18/2008US20080308931 Electronic Structures Including Barrier Layers Defining Lips
12/18/2008US20080308930 Semiconductor device mounting structure, manufacturing method, and removal method of semiconductor device
12/18/2008US20080308929 Semiconductor device, chip package and method of fabricating the same
12/18/2008US20080308928 Image sensor module with a three-dimensional die-stacking structure
12/18/2008US20080308927 Semiconductor device with heat sink plate
12/18/2008US20080308926 Heat dissipation package structure and method for fabricating the same
12/18/2008US20080308925 Fabricating process and structure of thermal enhanced substrate
12/18/2008US20080308924 Circuit Module Having Force Resistant Construction
12/18/2008US20080308923 High performance chip carrier substrate
12/18/2008US20080308922 Method for packaging semiconductors at a wafer level
12/18/2008US20080308921 Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package
12/18/2008US20080308920 System and method of fabricating micro cavities
12/18/2008US20080308919 Hollow sealing structure and manufacturing method for hollow sealing structure
12/18/2008US20080308918 Semiconductor package with passive elements
12/18/2008US20080308917 Embedded chip package
12/18/2008US20080308916 Chip package
12/18/2008US20080308915 Chip package
12/18/2008US20080308914 Chip package
12/18/2008US20080308913 Stacked semiconductor package and method of manufacturing the same
12/18/2008US20080308912 Emi shielded semiconductor package
12/18/2008US20080308910 Seminconductor device including through-wafer interconnect structure
12/18/2008US20080308898 Plasma Excited Chemical Vapor Deposition Method Silicon/Oxygen/Nitrogen-Containing-Material and Layered Assembly
12/18/2008US20080308868 High voltage metal oxide semiconductor transistor and fabrication method thereof
12/18/2008US20080308801 Structure for stochastic integrated circuit personalization
12/18/2008US20080308800 Method of evaluating thermal stress resistance of semiconductor device, and semiconductor wafer having test element
12/18/2008US20080308799 Wiring structure and manufacturing method therefor
12/18/2008US20080308798 Semiconductor Device
12/18/2008US20080308717 Camera module with window mechanical attachment
12/18/2008US20080307992 Charge system for destroying chips on a circuit board and method for destroying chips on a circuit board
12/18/2008US20080307644 Metal plugged substrates with no adhesive between metal and polyimide
12/18/2008DE202008013995U1 Kühlmodul Cooling module
12/18/2008DE10303446B4 Vorrichtung zum Schutz von auf Flachbaugruppen verwendeten elektronischen Bauteilen vor einer Zerstörung durch elektrostatische Entladungsvorgänge Protection device for use on printed circuit boards electronic components from damage by electrostatic discharge processes
12/18/2008DE10239843B4 Verfahren zur Ausbildung eines Kontaktes A method of forming a contact
12/18/2008DE102008027999A1 Halbleitersensor Semiconductor sensor
12/18/2008DE102008027422A1 Integrierte Schaltung mit mehrstufiger Anpassungsschaltung An integrated circuit with a multi-stage matching circuit
12/18/2008DE102008025465A1 Steuerschaltung für eine Halbleitereinrichtung mit einer Überhitzungsschutzfunktion A control circuit for a semiconductor device having an overheating protection function
12/18/2008DE102008025223A1 Eingebetteter Chipbaustein Embedded chip package
12/18/2008DE102008024443A1 Semiconductor package for electronic system comprises electrode having first part extending through second surface of semiconductor substrate and second part extending from first part through compositional layer to contact conductive pad
12/18/2008DE102007027435A1 Verfahren und Vorrichtung zur strukturierten Schichtabscheidung auf prozessierten Mikrosystemtechnikwafern Method and device for patterned layer deposition on the processed wafers Microsystems Technology
12/18/2008DE102007027434A1 Verfahren zur Herstellung von Justagestrukturen für eine strukturierte Schichtabscheidung auf einem Mikrosystemtechnikwafer mittels einer Beschichtungsmaske A process for producing calibration structures for a patterned layer deposition on a wafer by means of microsystem technology of a coating mask
12/18/2008DE102006015975B4 Halbleitervorrichtungen mit mehreren Ebenen und Verfahren zur Herstellung derselben Semiconductor devices with multiple layers and method of producing same
12/18/2008DE102006009978B4 Leistungshalbleitermodul The power semiconductor module
12/18/2008DE102004064081B4 Gehäuse für einen optischen Empfänger Housing for an optical receiver
12/18/2008DE10044422B4 Elektrisches Bauelement Electrical component
12/17/2008EP2003944A2 Method of ebullient cooling, ebullient cooling apparatus, flow channel structure and application product thereof
12/17/2008EP2003693A2 Pressure contact three-phase converter module
12/17/2008EP2003691A2 Base for power module
12/17/2008EP2003690A2 Metal screen and adhesive composite thermal interface
12/17/2008EP2003689A1 Header, especially for electronic packages
12/17/2008EP2003687A1 Semiconductor device and method for manufacturing semiconductor device
12/17/2008EP2003123A2 Thin-film materials, thin films and producing method thereof
12/17/2008EP2002478A1 Electrically enhanced wirebond package
12/17/2008EP2002477A2 Low ohmic through substrate interconnection for semiconductor carriers
12/17/2008EP2002476A2 Carrier body for components or circuits
12/17/2008EP2002466A2 Gaas integrated circuit device and method of attaching same
12/17/2008EP1316995B1 Semiconductor device and method for manufacturing the same
12/17/2008EP1279197B1 Encapsulated display device
12/17/2008EP1127375B1 Bumped contacts for metal-to-semiconductor connections, and methods for fabricating same
12/17/2008CN201167452Y Radiating device
12/17/2008CN201167451Y Plate type heat radiating device
12/17/2008CN201167450Y Combined structure of heat radiator
12/17/2008CN201167449Y Fin slice structure for heat radiator module
12/17/2008CN201167448Y Radiating device
12/17/2008CN201167447Y Radiating device for electronic appliances
12/17/2008CN201167446Y Radiating module
12/17/2008CN201167445Y Heat radiator
12/17/2008CN201167443Y Fixed assembly
12/17/2008CN201167094Y LCOS pixel unit device structure
12/17/2008CN201167093Y Side-glance type LED structure
12/17/2008CN201167092Y LED packaging structure
12/17/2008CN201167091Y Encapsulation carrier and electronic packaging body
12/17/2008CN201167090Y Encapsulation structure for semiconductor devices
12/17/2008CN201167089Y CPU radiating device
12/17/2008CN201166995Y Special-shaped copper belt material
12/17/2008CN201166348Y High heat radiation performance LED illuminating apparatus
12/17/2008CN201166347Y High power hot pipe LED illuminating apparatus
12/17/2008CN201166346Y Heat radiator for high power LED road lamp
12/17/2008CN201166344Y Luminous body assembly structure
12/17/2008CN201166342Y Dense type high luminance LED lighting lamp with self-convection heat radiation body
12/17/2008CN201166341Y Surface type SMD LCD lamp with high heat radiation performance
12/17/2008CN201166324Y Encapsulated circuit using LED chip light fitting
12/17/2008CN201166321Y High power LED cup lamp
12/17/2008CN201166318Y Casing for LED illuminating apparatus and LED illuminating apparatus thereof
12/17/2008CN201166311Y Diode point matrix / nixie tube high heat conducting metallic reflection cap with clamping structure
12/17/2008CN201166286Y Ceiling light
12/17/2008CN101326867A Arrangement comprising at least one electronic component
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