| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 12/24/2008 | CN100446242C Lsi package with interface module, transmission line package, and ribbon optical transmission line |
| 12/24/2008 | CN100446241C Semiconductor device capable of holding large size chip and producing method and relative carrier thereof |
| 12/24/2008 | CN100446240C Electrostatic protection circuit in integrated circuit |
| 12/24/2008 | CN100446239C Electrostatic protection circuit in integrated circuit |
| 12/24/2008 | CN100446238C Input/output cell with robust electrostatic discharge protection |
| 12/24/2008 | CN100446237C Interlinking line structure and its forming method |
| 12/24/2008 | CN100446236C Transistor array and active-matrix substrate |
| 12/24/2008 | CN100446235C Lead pin for mounting semiconductor and printed wiring board |
| 12/24/2008 | CN100446234C Method of fabricating lead frame and method of fabricating semiconductor device using the same |
| 12/24/2008 | CN100446233C Semiconductor device and manufacturing method therefor |
| 12/24/2008 | CN100446232C Surface structure of flip-chip substrate |
| 12/24/2008 | CN100446231C Semiconductor encapsulation structure and its making method |
| 12/24/2008 | CN100446230C Semiconductor encapsulation structure and its making method |
| 12/24/2008 | CN100446229C Semiconductor device and manufacturing method of the same |
| 12/24/2008 | CN100446228C Liquid-cooled radiating system |
| 12/24/2008 | CN100446227C Radiator and its production |
| 12/24/2008 | CN100446226C Semiconductor device and method for manufacturing same |
| 12/24/2008 | CN100446225C A substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same |
| 12/24/2008 | CN100446224C Wiring substrate and method of fabricating the same |
| 12/24/2008 | CN100446223C Semiconductor device, manufacturing method of semiconductor device and module for optical device |
| 12/24/2008 | CN100446218C Method of forming metal film and tungsten film |
| 12/24/2008 | CN100446204C 集成传感器芯片单元 Integrated sensor chip unit |
| 12/24/2008 | CN100446203C Apparatus and method for mounting or wiring semiconductor chips |
| 12/24/2008 | CN100446201C Manufacturing method of a semiconductor device |
| 12/24/2008 | CN100446200C Heat radiation type packaging structure and its making method |
| 12/24/2008 | CN100446187C Semiconductor device and manufacturing method of the same |
| 12/24/2008 | CN100446174C Method of producing an element comprising an electrical conductor encircled by magnetic material |
| 12/24/2008 | CN100446139C Conducting polymer composite and solid electrolytic capacitor using the same |
| 12/24/2008 | CN100445688C Heat exchanger |
| 12/24/2008 | CN100445131C Control unit and method for producing the same |
| 12/24/2008 | CA2690339A1 Split wave compensation for open stubs |
| 12/24/2008 | CA2689346A1 Microwave integrated circuit package and method for forming such package |
| 12/24/2008 | CA2689162A1 Method for packaging semiconductors at a wafer level |
| 12/23/2008 | US7468890 Graphics card heat-dissipating device |
| 12/23/2008 | US7468888 Heatsink assembly structure |
| 12/23/2008 | US7468887 Plasma display device |
| 12/23/2008 | US7468886 Method and structure to improve thermal dissipation from semiconductor devices |
| 12/23/2008 | US7468885 Cooling device for interface card |
| 12/23/2008 | US7468560 Semiconductor device with micro connecting elements and method for producing the same |
| 12/23/2008 | US7468559 Semiconductor integrated circuit package having electrically disconnected solder balls for mounting |
| 12/23/2008 | US7468558 Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof |
| 12/23/2008 | US7468557 Method of producing an ultra thin electrically conducting film with very low electrical resistance |
| 12/23/2008 | US7468556 Packaging of hybrid integrated circuits |
| 12/23/2008 | US7468555 Heat dissipation structure of an electronic device |
| 12/23/2008 | US7468554 Heat sink board and manufacturing method thereof |
| 12/23/2008 | US7468553 Stackable micropackages and stacked modules |
| 12/23/2008 | US7468552 Physical quantity sensor |
| 12/23/2008 | US7468550 High-performance semiconductor package |
| 12/23/2008 | US7468549 Method for producing a package for an electronic circuit and a substrate for a package |
| 12/23/2008 | US7468548 Thermal enhanced upper and dual heat sink exposed molded leadless package |
| 12/23/2008 | US7468547 RF-coupled digital isolator |
| 12/23/2008 | US7468546 Semiconductor device with a noise prevention structure |
| 12/23/2008 | US7468544 Structure and process for WL-CSP with metal cover |
| 12/23/2008 | US7468331 Angled elongated features for improved alignment process integration |
| 12/23/2008 | US7468329 Dedoping of organic semiconductors |
| 12/23/2008 | US7468321 Application of impressed-current cathodic protection to prevent metal corrosion and oxidation |
| 12/23/2008 | US7468320 Reduced electromigration and stressed induced migration of copper wires by surface coating |
| 12/23/2008 | US7468318 Method for manufacturing mold type semiconductor device |
| 12/23/2008 | US7468316 Low fabrication cost, fine pitch and high reliability solder bump |
| 12/23/2008 | US7468294 Semiconductor device and a method of manufacturing the same |
| 12/23/2008 | US7468292 Method of making wafer level package structure by grinding the backside thereof and then forming metal layer on the ground side |
| 12/23/2008 | US7468289 Solid-state imaging device and method for manufacturing the same |
| 12/23/2008 | US7467464 Method of manufacturing a memory card |
| 12/18/2008 | WO2008154582A2 Semiconductor die coating and interconnection fixture and method |
| 12/18/2008 | WO2008154580A2 Method for optimized integrated circuit chip interconnection |
| 12/18/2008 | WO2008154538A1 System and method for preventing copying of electronic component designs |
| 12/18/2008 | WO2008154434A1 Combined pressure compensator and cooling unit |
| 12/18/2008 | WO2008154265A1 Insulated gate bipolar transistor assembly |
| 12/18/2008 | WO2008154124A1 Circuit assembly including a metal core substrate and process for preparing the same |
| 12/18/2008 | WO2008153245A2 Semiconductor package module using anodized oxide layer and manufacturing method thereof |
| 12/18/2008 | WO2008153172A1 Structure for cooling semiconductor element |
| 12/18/2008 | WO2008153125A1 Sealing agent for optical semiconductor element, and optical semiconductor element |
| 12/18/2008 | WO2008153082A1 Resin composition, embedding material, insulating layer, and semiconductor device |
| 12/18/2008 | WO2008153026A1 Metallized substrate and process for producing the same |
| 12/18/2008 | WO2008152560A1 Lighting device with pulsating fluid cooling |
| 12/18/2008 | WO2008151649A1 Method for marking wafers |
| 12/18/2008 | WO2008114381A8 Heat sink, electronic device, and method of manufacturing electronic device |
| 12/18/2008 | WO2008112643A3 Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components |
| 12/18/2008 | WO2007030596A3 Printed circuit board |
| 12/18/2008 | WO2005048314A3 Tapered dielectric and conductor structures and applications thereof |
| 12/18/2008 | US20080311740 Power composite integrated semiconductor device and manufacturing method thereof |
| 12/18/2008 | US20080311737 Manufacturing method for semiconductor device containing stacked semiconductor chips |
| 12/18/2008 | US20080311705 Lead frame and method for fabricating semiconductor package employing the same |
| 12/18/2008 | US20080311703 Lead frame and a method of manufacturing the same |
| 12/18/2008 | US20080311702 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
| 12/18/2008 | US20080311685 Methods relating to the reconstruction of semiconductor wafers for wafer level processing |
| 12/18/2008 | US20080311381 Enhanced thermal conducting formulations |
| 12/18/2008 | US20080310231 Optimization of critical dimensions and pitch of patterned features in and above a substrate |
| 12/18/2008 | US20080309839 Thin film transistor array panel and liquid crystal display including the panel |
| 12/18/2008 | US20080309459 Method Of Manufacturing A Fingerprint Sensor And Corresponding Sensor |
| 12/18/2008 | US20080309442 Semiconductor power device having a stacked discrete inductor structure |
| 12/18/2008 | US20080309372 Semiconductor memory device |
| 12/18/2008 | US20080308954 Semiconductor device and method of forming the same |
| 12/18/2008 | US20080308953 Fabricated adhesive microstructures for making an electrical connection |
| 12/18/2008 | US20080308952 Method for Reliably Positioning Solder on a Die Pad for Attaching a Semiconductor Chip to the Die Pad and Molding Die for Solder Dispensing Apparatus |
| 12/18/2008 | US20080308951 Semiconductor package and fabrication method thereof |
| 12/18/2008 | US20080308950 Semiconductor package and method for manufacturing thereof |
| 12/18/2008 | US20080308949 Flip chip package and method for manufacturing the same |
| 12/18/2008 | US20080308948 Wafer-to-wafer alignments |
| 12/18/2008 | US20080308947 Die offset die to die bonding |