| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/24/2008 | EP1364405A4 High voltage semiconductor device |
| 12/24/2008 | DE202008011917U1 Verstärktes Kühlmodul Increased cooling module |
| 12/24/2008 | DE202005021630U1 Biegbarer Wärmeverteiler mit metallischer Mikrostruktur auf Basis eines Drahtnetzes Bendable heat spreader with metallic microstructure on the basis of a wire net |
| 12/24/2008 | DE19581809B4 MOS-Zelle, Mehrfachzellentransistor und IC-Chip MOS cell, multicell transistor and IC chip |
| 12/24/2008 | DE102008026550A1 Halbleitereinrichtungen mit Schichten mit erweiterten Umfängen für eine verbesserte Kühlung und Verfahren zum Kühlen von Halbleitereinrichtungen Semiconductor devices with layers with extended features for improved cooling and method for cooling of semiconductor devices |
| 12/24/2008 | DE102008025279A1 Montagesockel für Leuchtdiode und Verfahren zu dessen Herstellung Mounting base for light-emitting diode and method for its production |
| 12/24/2008 | DE102008024802A1 CMOS-Bildsensor-Chip-Packung in Chipgröße mit Chip aufnehmendem Durchgangsloch und Verfahren derselben CMOS image sensor chip chip scale package with chip aufnehmendem through hole and method thereof |
| 12/24/2008 | DE102008013180A1 Struktur einer Halbleiterbausteinpackung und deren Verfahren Structure of a semiconductor device package and its method |
| 12/24/2008 | DE102007039754A1 Verfahren zur Herstellung von Substraten A process for the production of substrates |
| 12/24/2008 | DE102007028292A1 Bauelement mit spannungsreduzierter Befestigung Component with reduced voltage mounting |
| 12/24/2008 | DE102007027901A1 Leistungselektronikmodul Power electronics module |
| 12/24/2008 | DE102007027447B3 Schaltungsanordnung und integrierte Schaltung Circuitry and integrated circuit |
| 12/24/2008 | DE102005053398B4 Leistungshalbleitermodul The power semiconductor module |
| 12/24/2008 | DE102005046404B4 Verfahren zur Minderung von Streuungen in der Durchbiegung von gewalzten Bodenplatten und Leistungshalbleitermodul mit einer nach diesem Verfahren hergestellten Bodenplatte A method for reducing variations in the deflection of the rolled plates, and bottom power semiconductor module with a base plate prepared by this method |
| 12/24/2008 | DE102004011719B4 Halbleitervorrichtung Semiconductor device |
| 12/24/2008 | CN201171258Y Cooling unit |
| 12/24/2008 | CN201171257Y Package structure for cooling fin |
| 12/24/2008 | CN201171057Y High-power LED support |
| 12/24/2008 | CN201171056Y Power LED |
| 12/24/2008 | CN201171050Y Improved structure of microcircuit module |
| 12/24/2008 | CN201171049Y Luminous semiconductor component |
| 12/24/2008 | CN201171048Y Dual spring type holding structure for a chip radiator |
| 12/24/2008 | CN201171047Y Combined structure for a radiating device |
| 12/24/2008 | CN201171046Y Combined structure for a radiating device |
| 12/24/2008 | CN201171045Y Diffusion polishing sheet for <100> N<->N<+>/P<+> mesh reticulation buried layer |
| 12/24/2008 | CN201170534Y High-power LED heat radiator |
| 12/24/2008 | CN201170533Y High-power LED lamp with favorable heat dispersion |
| 12/24/2008 | CN201170532Y LED lighting lamp device |
| 12/24/2008 | CN201170529Y LED module group |
| 12/24/2008 | CN201170528Y Radiating structure |
| 12/24/2008 | CN201170527Y Heat emission type high-power integrated-semiconductor light source device for hot pipe |
| 12/24/2008 | CN201170514Y LED light source supporting body |
| 12/24/2008 | CN201170513Y LED light source module group |
| 12/24/2008 | CN201170512Y LED illumination device |
| 12/24/2008 | CN201170511Y LED light source module group |
| 12/24/2008 | CN201170510Y LED illumination device |
| 12/24/2008 | CN201170509Y LED light source supporting body |
| 12/24/2008 | CN101331818A Heat transfer member, protruding structural member, electronic device, and electric product |
| 12/24/2008 | CN101331681A Piezoelectric vibration piece and piezoelectric vibration device |
| 12/24/2008 | CN101331606A Enhanced substrate using metamaterials |
| 12/24/2008 | CN101331605A Module having built-in electronic parts and manufacture method thereof |
| 12/24/2008 | CN101331604A Circuit device and method for manufacturing circuit device |
| 12/24/2008 | CN101330817A Radiator and method for manufacturing fin component thereof |
| 12/24/2008 | CN101330816A Liquid cooling type radiating module |
| 12/24/2008 | CN101330815A Combination of radiating device |
| 12/24/2008 | CN101330814A Radiating device |
| 12/24/2008 | CN101330813A Radiating device and thermal fin thereof |
| 12/24/2008 | CN101330788A LED luminous element for integration bidirectional redundancy control apparatus |
| 12/24/2008 | CN101330208A Electrostatic discharge protecting circuit |
| 12/24/2008 | CN101330094A Organic light emitting diode display device and method of fabricating the same |
| 12/24/2008 | CN101330090A Solid-state imaging device and method for manufacturing the same |
| 12/24/2008 | CN101330089A Detection device and electronic apparatus |
| 12/24/2008 | CN101330088A Integrated circuit package body and preparation method thereof |
| 12/24/2008 | CN101330087A Array substrate, manufacturing method thereof and display device having the same |
| 12/24/2008 | CN101330086A Noise suppression for open bit line DRAM architectures |
| 12/24/2008 | CN101330081A LED array module and packaging method thereof |
| 12/24/2008 | CN101330080A High on-stage voltage right-handed LED integrated chip and manufacturing method thereof |
| 12/24/2008 | CN101330079A Semiconductor subassemblies with interconnects and methods for manufacturing the same |
| 12/24/2008 | CN101330078A High on-state voltage LED integrated chip with electrostatic protection and manufacturing method thereof |
| 12/24/2008 | CN101330077A Stacked semiconductor package and method for manufacturing the same |
| 12/24/2008 | CN101330076A Through silicon via chip stack package capable of facilitating chip selection during device operation |
| 12/24/2008 | CN101330075A Stereo encapsulation structure |
| 12/24/2008 | CN101330074A Protection circuit for semiconductor device and semiconductor device including the same |
| 12/24/2008 | CN101330073A Semiconductor device and method of manufacturing the same |
| 12/24/2008 | CN101330072A Semiconductor device including metal interconnection and manufacturing method thereof |
| 12/24/2008 | CN101330071A Mounting substrate and manufacturing method thereof |
| 12/24/2008 | CN101330070A Drive chip for LED |
| 12/24/2008 | CN101330069A Flip chip package and method for manufacturing the same |
| 12/24/2008 | CN101330068A Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package |
| 12/24/2008 | CN101330067A Self-aligning wafer or chip structure and self-aligning stacking structure and manufacturing method thereof |
| 12/24/2008 | CN101330066A Wafer structure for reducing occupation crystal particle volume and fine adjustment method thereof |
| 12/24/2008 | CN101330065A Method for preparing convex point, low metallic layer of convex point and production method thereof |
| 12/24/2008 | CN101330064A Semiconductor package and a method for manufacturing the same |
| 12/24/2008 | CN101330063A Active element array structure and manufacturing method thereof |
| 12/24/2008 | CN101330050A Compensating metal oxide semiconductor image sensor and manufacturing method thereof |
| 12/24/2008 | CN101330045A Manufacturing method of semiconductor device |
| 12/24/2008 | CN101330044A Method of cleaning surface of semiconductor substrate, method of manufacturing thin film, method of manufacturing semiconductor device, and semiconductor device |
| 12/24/2008 | CN101330042A Conductive plug and preparation method thereof |
| 12/24/2008 | CN101330041A Interconnecting hole of metal front medium layer and method for forming the same |
| 12/24/2008 | CN101330040A Interconnection layer top layer wiring layer of semiconductor device and method for forming the same |
| 12/24/2008 | CN101330039A Method for eliminating load effect using through-hole plug |
| 12/24/2008 | CN101330028A Electronic device manufacturing method and electronic device |
| 12/24/2008 | CN101330027A Electronic device manufacturing method and electronic device |
| 12/24/2008 | CN101330026A Electronic device and method of manufacturing the same |
| 12/24/2008 | CN101330000A Semiconductor wafer with id mark, equipment for and method of manufacturing semiconductor device from them |
| 12/24/2008 | CN101329999A Semiconductor substrate and method for manufacturing the same |
| 12/24/2008 | CN101329913A CMOS compatible single-layer polysilicon non-volatile memory |
| 12/24/2008 | CN101329144A Once forming and assembling method of radiating rib and hot pipe |
| 12/24/2008 | CN101329055A Heat radiator |
| 12/24/2008 | CN101329049A LED module group capable of radiating and manufacturing method thereof |
| 12/24/2008 | CN101329044A LED luminous element of integrated drive circuit |
| 12/24/2008 | CN101329024A Spotlight and water fountain |
| 12/24/2008 | CN101328268A Preparation of methyl phenyl hydrogen-containing silicone oil for LED encapsulation |
| 12/24/2008 | CN100446649C Heat radiator |
| 12/24/2008 | CN100446360C Semiconductor device and method of manufacturing semiconductor device |
| 12/24/2008 | CN100446260C Tft array panel and fabricating method thereof |
| 12/24/2008 | CN100446248C Process for producing microelectromechanical components |
| 12/24/2008 | CN100446246C Semiconductor device and method for producing the same |
| 12/24/2008 | CN100446245C Stacked dram memory chip for a dual inline memory module (dimm) |
| 12/24/2008 | CN100446243C Design of an insulated cavity |