Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2008
12/25/2008US20080315399 Semiconductor Device Having Through Contacts Through a Plastic Housing Composition and Method for the Production Thereof
12/25/2008US20080315398 Packaging substrate with embedded chip and buried heatsink
12/25/2008US20080315397 Die mounting stress isolator
12/25/2008US20080315396 Mold compound circuit structure for enhanced electrical and thermal performance
12/25/2008US20080315395 Stacked semiconductor package and method for manufacturing the same
12/25/2008US20080315394 Semiconductor package and a method for manufacturing the same
12/25/2008US20080315393 Rf transistor packages with internal stability network and methods of forming rf transistor packages with internal stability networks
12/25/2008US20080315392 Rf power transistor packages with internal harmonic frequency reduction and methods of forming rf power transistor packages with internal harmonic frequency reduction
12/25/2008US20080315391 Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layer
12/25/2008US20080315390 Chip Scale Package For A Micro Component
12/25/2008US20080315389 Bumpless Flip-Chip Assembly With a Complaint Interposer Contractor
12/25/2008US20080315388 Vertical controlled side chip connection for 3d processor package
12/25/2008US20080315387 Semiconductor Package-on-Package System Including Integrated Passive Components
12/25/2008US20080315386 Semiconductor device
12/25/2008US20080315385 Array molded package-on-package having redistribution lines
12/25/2008US20080315384 Apparatuses and methods for forming electronic assemblies
12/25/2008US20080315383 Chip frame for optical digital processor
12/25/2008US20080315382 Multiple die integrated circuit package
12/25/2008US20080315381 Lead frame, semiconductor device using same and manufacturing method thereof
12/25/2008US20080315380 Integrated circuit package system having perimeter paddle
12/25/2008US20080315379 Semiconductor packages including thermal stress buffers and methods of manufacturing the same
12/25/2008US20080315378 Semiconductor device with surface mounting terminals
12/25/2008US20080315377 Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system
12/25/2008US20080315376 Conformal EMI shielding with enhanced reliability
12/25/2008US20080315375 Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system
12/25/2008US20080315374 Integrated circuit package-in-package system with magnetic film
12/25/2008US20080315373 Method of enabling alignment of wafer in exposure step of ic process after uv-blocking metal layer is formed over the whole wafer
12/25/2008US20080315372 Wafer Level Integration Package
12/25/2008US20080315371 Methods and apparatus for emi shielding in multi-chip modules
12/25/2008US20080315369 Semiconductor device and semiconductor package having the same
12/25/2008US20080315368 Silicon Wafer Having Through-Wafer Vias
12/25/2008US20080315367 Wiring substrate
12/25/2008US20080315366 Semiconductor device
12/25/2008US20080315365 Method for designing dummy pattern, exposure mask, semiconductor device, method for manufacturing semiconductor device, and storage medium
12/25/2008US20080315358 Capacitive element, method of manufacture of the same, and semiconductor device
12/25/2008US20080315355 Semiconductor device and method of manufacturing the same
12/25/2008US20080315353 Empty vias for electromigration during electronic-fuse re-programming
12/25/2008US20080315348 Pitch by Splitting Bottom Metallization Layer
12/25/2008US20080315345 Technique for Stable Processing of Thin/Fragile Substrates
12/25/2008US20080315344 Semiconductor integrated circuit
12/25/2008US20080315334 Packaged chip devices with atomic layer deposition protective films
12/25/2008US20080315333 Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device
12/25/2008US20080315322 Method for reliably removing excess metal during metal silicide formation
12/25/2008US20080315321 System and Method for Forming a Semiconductor Device Source/Drain Contact
12/25/2008US20080315276 Capacitor pair structure for increasing the match thereof
12/25/2008US20080315275 Capacitor pair structure for increasing the match thereof
12/25/2008US20080315242 System, apparatus and method of selective laser repair for metal bumps of semiconductor device stack
12/25/2008US20080315239 Thin double-sided package substrate and manufacture method thereof
12/25/2008US20080315230 Electronic component package and method of manufacturing the same, and electronic component device
12/25/2008US20080315215 Semiconductor Module
12/25/2008US20080315196 Technique for evaluating a fabrication of a die and wafer
12/25/2008US20080315195 Method and Apparatus for Monitoring VIA's in a Semiconductor Fab
12/24/2008WO2008157722A1 Wafer level surface passivation of stackable integrated circuit chips
12/24/2008WO2008157675A1 Insulation paste for a metal core substrate and electronic device
12/24/2008WO2008157215A1 Method for packaging semiconductors at a wafer level
12/24/2008WO2008157214A1 Microwave integrated circuit package and method for forming such package
12/24/2008WO2008157108A2 Metal plugged substrates with no adhesive between metal and polyimide
12/24/2008WO2008157001A1 Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
12/24/2008WO2008156943A1 Methods and apparatus for emi shielding in multi-chip modules
12/24/2008WO2008156940A1 Heat pipe dissipating system and method
12/24/2008WO2008156932A2 System and method for mounting a cooling device and method of fabrication
12/24/2008WO2008156658A1 Split wave compensation for open stubs
12/24/2008WO2008156565A1 Semiconductor die with backside passive device integration
12/24/2008WO2008156443A1 Benzoxazine containing compositions of matter and curable compositions made therewith
12/24/2008WO2008156190A1 Process for producing semiconductor device
12/24/2008WO2008156093A1 Method of forming film, heat transfer member, power module, inverter for vehicle and vehicle
12/24/2008WO2008156029A1 Process for producing semiconductor device, insulating film for semiconductor device, and apparatus for producing the insulating film
12/24/2008WO2008155896A1 Electronic device manufacturing method
12/24/2008WO2008155895A1 Electronic device manufacturing method
12/24/2008WO2008155726A2 A carrier for electric packages and a method of structuring a carrier
12/24/2008WO2008155685A1 Testable integrated circuit and test method
12/24/2008WO2008155233A1 Method of producing a via in a reconstituted substrate
12/24/2008WO2008155231A1 Device including integrated components imbedded in cavities of a reception semi-conductor plate and corresponding method
12/24/2008WO2008155086A1 Semi-conductor component having a ring-shaped closed contact
12/24/2008WO2008155085A1 Electric circuit with vertical contacts
12/24/2008WO2008134426A3 Leadframe configuration to enable strip testing of sot-23 packages and the like
12/24/2008WO2008132656A3 A biosensor chip and a method of manufacturing the same
12/24/2008WO2008127313A3 Electrically conducting and optically transparent nanowire networks
12/24/2008WO2008108970A3 Chips having rear contacts connected by through vias to front contacts
12/24/2008WO2008021501A3 Apparatus and method for ultra-shallow implantation in a semiconductor device
12/24/2008WO2008000457A3 Coated molecular sieve
12/24/2008EP2007185A1 Low cost cold plate with film adhesive
12/24/2008EP2007180A1 Circuit board, electronic circuit device, and display
12/24/2008EP2006911A2 Wiring substrate
12/24/2008EP2006910A2 Power electronics module
12/24/2008EP2006909A2 Heat dissipating wiring board and method for manufacturing same
12/24/2008EP2006908A2 Electronic device and method of manufacturing the same
12/24/2008EP2006906A2 Electronic component and method for manufacturing same
12/24/2008EP2006902A2 Method of producing an electric connection based on individually sheathed nanotubes
12/24/2008EP2006901A2 Method of producing an electric connection based on carbon nanotubes
12/24/2008EP2006696A1 Testable integrated circuit and test method
12/24/2008EP2005807A2 Method and process of manufacturing robust high temperature solder joints
12/24/2008EP2005487A1 System and method for producing a solar cell array
12/24/2008EP2005472A2 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
12/24/2008EP2005471A1 Stand, in particular for power electronic component, power module comprising such a stand, assembly comprising the module and electrical member controlled by said module
12/24/2008EP2005470A2 Lead frame based, over-molded semiconductor package with integrated through hole technology (tht) heat spreader pin(s) and associated method of manufacturing
12/24/2008EP2005469A2 Carrierless chip package for integrated circuit devices, and methods of making same
12/24/2008EP2005467A1 Methods for making a starting substrate wafer for semiconductor engineering having wafer through connections
12/24/2008EP2005370A2 Transfer tape strap process
12/24/2008EP1911089B1 Electronic component
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