Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2008
12/30/2008US7471534 Inverter type motor drive unit
12/30/2008US7471517 Heat sink retention module having force-adjustable wire modules
12/30/2008US7471184 Robust MEMS actuator for relays
12/30/2008US7471137 Frequency-independent voltage divider
12/30/2008US7470999 Glass for semiconductor encapsulation and outer tube for semiconductor encapsulation, and semiconductor electronic parts
12/30/2008US7470998 Semiconductor device and method of manufacturing the same
12/30/2008US7470997 Wirebond pad for semiconductor chip or wafer
12/30/2008US7470996 Packaging method
12/30/2008US7470995 Integrated circuit (IC) carrier assembly with suspension means
12/30/2008US7470994 Bonding pad structure and method for making the same
12/30/2008US7470993 Semiconductor component with passivation layer
12/30/2008US7470992 Barrier layer stack to prevent Ti diffusion
12/30/2008US7470991 Integrated high voltage capacitor having capacitance uniformity structures and a method of manufacture therefor
12/30/2008US7470990 Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same
12/30/2008US7470989 Technique for perfecting the active regions of wide bandgap semiconductor nitride devices
12/30/2008US7470988 Chip structure and process for forming the same
12/30/2008US7470987 Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate
12/30/2008US7470986 Mounting structure, electro-optical device, and electronic apparatus
12/30/2008US7470985 Solder connector structure and method
12/30/2008US7470984 Perpendicularly oriented electrically active element method and system
12/30/2008US7470983 Semiconductor device reducing warping due to heat production
12/30/2008US7470982 Substrate for semiconductor device and semiconductor device
12/30/2008US7470981 Semiconductor device with varying dummy via-hole plug density
12/30/2008US7470980 Apparatus and method for manufacturing a display device substrate
12/30/2008US7470979 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
12/30/2008US7470978 Sawn power package and method of fabricating same
12/30/2008US7470977 Modular board device, high frequency module, and method of manufacturing same
12/30/2008US7470976 Organic electroluminescent device, manufacturing method therefor, and electronic devices therewith
12/30/2008US7470975 Composition for forming insulation film, insulation film for semiconductor device, and fabrication method and semiconductor device thereof
12/30/2008US7470974 Substantially transparent material for use with light-emitting device
12/30/2008US7470971 Anodically bonded ultra-high-vacuum cell
12/30/2008US7470969 Semiconductor device and fabrication method thereof
12/30/2008US7470959 Integrated circuit structures for preventing charging damage
12/30/2008US7470958 Semiconductor device
12/30/2008US7470942 Thin film transistor array and electrostatic discharge protective device thereof
12/30/2008US7470904 Infrared camera packaging
12/30/2008US7470865 Multilayer printed wiring board and a process of producing same
12/30/2008US7470754 Phenolic resins; polysiloxanes; improved solder heat resistance productivity; lightweight
12/30/2008US7470613 Dual damascene multi-level metallization
12/30/2008US7470611 In situ deposition of a low K dielectric layer, barrier layer, etch stop, and anti-reflective coating for damascene application
12/30/2008US7470609 Semiconductor device and method for manufacturing the same
12/30/2008US7470598 Semiconductor layer structure and method of making the same
12/30/2008US7470597 Method of fabricating a multilayered dielectric diffusion barrier layer
12/30/2008US7470590 Methods of forming semiconductor constructions
12/30/2008US7470580 Fabrication method of a semiconductor device
12/30/2008US7470568 Method of manufacturing a semiconductor device
12/30/2008US7470563 Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages
12/30/2008US7470147 Spring biased socket system
12/30/2008US7470142 Wafer bonding method
12/30/2008CA2628882A1 Led lamp module
12/25/2008US20080319292 Analyte monitoring device and methods of use
12/25/2008US20080318429 Fabrication method of semiconductor integrated circuit device
12/25/2008US20080318419 Charge dissipation of cavities
12/25/2008US20080318055 Recoverable electronic component
12/25/2008US20080318054 Low-temperature recoverable electronic component
12/25/2008US20080318049 Single-Walled Carbon Nanotube and Aligned Single-Walled Carbon Nanotube Bulk Structure, and Their Production Process, Production Apparatus and Application Use
12/25/2008US20080316708 Low cost cold plate with film adhesive
12/25/2008US20080316608 Micro-lens fabricated from semiconductor wafer
12/25/2008US20080316504 Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
12/25/2008US20080315978 Method and apparatus for non-conductively interconnecting integrated circuits
12/25/2008US20080315440 Method of Manufacturing a Plurality of Semiconductor Devices and Carrier Substrate
12/25/2008US20080315439 Quad flat non-leaded chip package
12/25/2008US20080315438 Semiconductor device including a stress buffer
12/25/2008US20080315437 Tape wiring substrate and chip-on-film package using the same
12/25/2008US20080315436 Semiconductor wafer that supports multiple packaging techniques
12/25/2008US20080315435 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
12/25/2008US20080315434 Wafer level surface passivation of stackable integrated circuit chips
12/25/2008US20080315433 Self-aligned wafer or chip structure, self-aligned stacked structure and methods for fabircating the same
12/25/2008US20080315432 Electrical Shielding in Stacked Dies by Using Conductive Die Dttach Adhesive
12/25/2008US20080315431 Mounting substrate and manufacturing method thereof
12/25/2008US20080315429 Method for improving the selectivity of a cvd process
12/25/2008US20080315428 Thin Film Transistor and Display Device, and Method for Manufacturing Thereof
12/25/2008US20080315427 Substrate bonding method and semiconductor device
12/25/2008US20080315426 METAL CAP WITH ULTRA-LOW k DIELECTRIC MATERIAL FOR CIRCUIT INTERCONNECT APPLICATIONS
12/25/2008US20080315425 Semiconductor Devices and Methods for Fabricating the Same
12/25/2008US20080315424 Structure and manufactruing method of chip scale package
12/25/2008US20080315423 Semiconductor device
12/25/2008US20080315422 Methods and apparatuses for three dimensional integrated circuits
12/25/2008US20080315421 Die backside metallization and surface activated bonding for stacked die packages
12/25/2008US20080315420 Metal pad formation method and metal pad structure using the same
12/25/2008US20080315419 Chromium/titanium/aluminum-based semiconductor device contact
12/25/2008US20080315418 Methods of post-contact back end of line through-hole via integration
12/25/2008US20080315417 Chip package
12/25/2008US20080315416 A semiconductor package with passive elements embedded within a semiconductor chip
12/25/2008US20080315415 Semiconductor device and manufacturing method thereof
12/25/2008US20080315414 Electronic device manufacturing method and electronic device
12/25/2008US20080315413 Electronic device manufacturing method and electronic device
12/25/2008US20080315412 Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the Same
12/25/2008US20080315411 Integrated circuit package system employing device stacking
12/25/2008US20080315410 Substrate Including Barrier Solder Bumps to Control Underfill Transgression and Microelectronic Package including Same
12/25/2008US20080315409 Direct edge connection for multi-chip integrated circuits
12/25/2008US20080315408 Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same
12/25/2008US20080315407 Three-dimensional circuitry formed on integrated circuit device using two-dimensional fabrication
12/25/2008US20080315406 Integrated circuit package system with cavity substrate
12/25/2008US20080315405 Heat spreader in a flip chip package
12/25/2008US20080315404 Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system
12/25/2008US20080315403 Apparatus and methods for cooling semiconductor integrated circuit chip packages
12/25/2008US20080315402 Printed circuit board, memory module having the same and fabrication method thereof
12/25/2008US20080315401 Power Semiconductor Module And Method of Manufacturing the Power Semiconductor Module
12/25/2008US20080315400 Microelectromechanical systems design feature
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