Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2008
12/31/2008CN201173436Y Luminous body merging assembling structure
12/31/2008CN201173415Y Integral large power LED road lamp holder
12/31/2008CN101336569A Ground shields for semiconductors
12/31/2008CN101336477A Chip stage integrated radio frequency passive device, manufacturing method thereof and system comprising the same
12/31/2008CN101336475A Integrated circuits with antennas formed from package lead wires
12/31/2008CN101336474A A component casing comprising a micro circuit
12/31/2008CN101336465A Low area screen printed metal contact structure and method
12/31/2008CN101336068A Superconductive temperature equalizing radiating module
12/31/2008CN101336067A Mechanism of media for vacuum sealed radiating and method thereof
12/31/2008CN101336066A Heat radiator
12/31/2008CN101336065A Radiating device for electronic appliances and method of use thereof
12/31/2008CN101336063A Heat radiating device, two-phase type thermal transmission element and preparation thereof
12/31/2008CN101336062A Combination of cooling device
12/31/2008CN101336061A Radiating device
12/31/2008CN101336059A Fan fixer
12/31/2008CN101335323A Transparent substrate heat dissipater
12/31/2008CN101335321A Method for manufacturing light emitting device
12/31/2008CN101335320A Method for manufacturing light emitting device
12/31/2008CN101335319A High-power LED ceramic package base
12/31/2008CN101335316A LED encapsulation having cooling pin and manufacturing method therefor
12/31/2008CN101335292A Luminous element panel
12/31/2008CN101335291A Light emitting display and method of manufacturing the same
12/31/2008CN101335290A Organic electroluminescent device
12/31/2008CN101335288A Magnetic random access memory and manufacturing method therefor
12/31/2008CN101335280A Image sensor package and fabrication method thereof
12/31/2008CN101335278A Sensing type encapsulation piece and manufacturing method thereof
12/31/2008CN101335277A 半导体集成电路装置 The semiconductor integrated circuit device
12/31/2008CN101335272A Thin-film transistor and method of manufacture thereof
12/31/2008CN101335270A Semiconductor storage device and manufacturing method thereof
12/31/2008CN101335269A Transistor of semiconductor device and method for fabricating the same
12/31/2008CN101335268A Metal insulator metal capacitor and method of manufacturing the same
12/31/2008CN101335267A Image sensing module having crystal three-dimensional stacking construction
12/31/2008CN101335265A Semiconductor device package having pseudo chips
12/31/2008CN101335264A Chip stacked structure and method of fabricating the same
12/31/2008CN101335263A Semiconductor module and manufacturing method thereof
12/31/2008CN101335262A Stack package and method for manufacturing the same
12/31/2008CN101335261A Formation of through via before contact processing
12/31/2008CN101335260A Aluminum interconnecting construction and making method thereof
12/31/2008CN101335259A Fuse for semiconductor device
12/31/2008CN101335258A Laser fuse device capable of reprogramming and method for continuously regulating resistance of fuse wire
12/31/2008CN101335257A Semiconductor apparatus and manufacturing method thereof
12/31/2008CN101335256A NOR flash device and method for fabricating the device
12/31/2008CN101335255A Integrated circuit construction
12/31/2008CN101335254A Construction of embedded type word line
12/31/2008CN101335253A Semiconductor package and semiconductor device using the same
12/31/2008CN101335252A Semiconductor device and wire bonding method
12/31/2008CN101335251A Semiconductor device, lead frame, and manufacturing method for the lead frame
12/31/2008CN101335250A Wiring construction between low temperature cold platform and room temperature outer housing and method
12/31/2008CN101335249A 半导体器件 Semiconductor devices
12/31/2008CN101335248A Cam construction
12/31/2008CN101335247A Semiconductor device and manufacture method thereof
12/31/2008CN101335240A Semiconductor device and method of fabricating the same
12/31/2008CN101335238A Method for manufacturing image sensor
12/31/2008CN101335233A Semiconductor device and method for fabricating the same
12/31/2008CN101335225A Metal pad formation method and metal pad structure using the same
12/31/2008CN101335224A Stress relieving layer for flip chip packaging
12/31/2008CN101335217A Semiconductor package and manufacturing method thereof
12/31/2008CN101335216A Heat radiating type package construction and manufacturing method thereof
12/31/2008CN101335215A Semiconductor package and manufacturing method thereof
12/31/2008CN101335213A Method of manufacturing radiating plate and semiconductor apparatus using the same
12/31/2008CN101335203A Layered structure and its manufacturing method
12/31/2008CN101335202A Method for manufacturing display apparatus
12/31/2008CN101335195A Semiconductor wafer with id mark, equipment for and method of manufacturing semiconductor device form them
12/31/2008CN101335189A Method for forming aligning key of semiconductor device
12/31/2008CN101334965A El display panel, power supply line drive apparatus, and electronic device
12/31/2008CN101334804A Direct inserting device packaging and its design method
12/31/2008CN101334686A Redundancy cooling system and its operation method
12/31/2008CN101334679A Temperature sensing device for powered electronic apparatus
12/31/2008CN101334155A High radiation led lamp radiating module
12/31/2008CN101334154A Large power LED lamp possessing radiating module structure
12/31/2008CN101334153A Self radiation type luminous diode lamp fluorescent lamp
12/31/2008CN101334147A Sticker type LED capable of bidirectionally light emitting and producing rectangular optical spot
12/31/2008CN100448045C Thermoelectric material, thermoelectric element and thermoelectric module, and method for manufacturing same
12/31/2008CN100448040C LED device with temp. control function
12/31/2008CN100448018C Displaying panel of display device
12/31/2008CN100448007C Grid-shaped electrostatic discharge protection device
12/31/2008CN100448006C Semiconductor unit
12/31/2008CN100448003C 半导体器件 Semiconductor devices
12/31/2008CN100448002C Method for producing stacked wafer
12/31/2008CN100448001C Semiconductor apparatus having stacked semiconductor components
12/31/2008CN100448000C Symmetrical high frequency SCR structure and method
12/31/2008CN100447999C Semiconductor integrated circuit device and audio appliance employing it
12/31/2008CN100447998C Lead frame for integrated circuit or discrete components ultra-thin non-pin packing
12/31/2008CN100447997C Electronic device
12/31/2008CN100447996C Physical quantity sensor, lead frame, and manufacturing method therefor
12/31/2008CN100447995C Semiconductor device and manufacturing method therefor
12/31/2008CN100447994C Structure of package
12/31/2008CN100447993C Electroosmotic pumps using porous frits for cooling integrated circuit stacks
12/31/2008CN100447992C Heat radiation module and its heat pipe
12/31/2008CN100447991C Cooling device of thin plate type for preventing dry-out
12/31/2008CN100447990C Circuit-component-containing module
12/31/2008CN100447989C Integrated circuit packaging and manufacturing method
12/31/2008CN100447974C Bonding pad, method for fabricating a bonding pad and an electronic device, and its fabricating method
12/31/2008CN100447971C Method for mounting semiconductor device, semiconductor device and its mounting structure
12/31/2008CN100447967C Manufacturing method of a semiconductor device
12/31/2008CN100447966C Integrated ball and via package and formation process
12/31/2008CN100447955C PE-ALD of TaN diffusion barrier region on low-K materials
12/31/2008CN100447573C Fiducial alignment mark on microelectronic spring contact
12/31/2008CN100447480C LED illuminator having high power and high radiation efficiency
12/30/2008US7471965 Mobile terminal having a heat releasing member
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