| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/01/2009 | US20090001536 Electronic Component and a Method of Fabricating an Electronic Component |
| 01/01/2009 | US20090001535 Semiconductor Module for a Switched-Mode Power Supply and Method for Its Assembly |
| 01/01/2009 | US20090001534 Two-sided die in a four-sided leadframe based package |
| 01/01/2009 | US20090001533 Multi-chip packaging in a tsop package |
| 01/01/2009 | US20090001532 Plastic-Encapsulated Semiconductor Device with an Exposed Radiator at the Top and Manufacture Thereof |
| 01/01/2009 | US20090001531 Integrated circuit package system with integral inner lead and paddle |
| 01/01/2009 | US20090001530 Semiconductor device |
| 01/01/2009 | US20090001529 Package stacking using unbalanced molded tsop |
| 01/01/2009 | US20090001528 Lowering resistance in a coreless package |
| 01/01/2009 | US20090001526 Technique for forming an interlayer dielectric material of increased reliability above a structure including closely spaced lines |
| 01/01/2009 | US20090001525 High-k dual dielectric stack |
| 01/01/2009 | US20090001524 Generation and distribution of a fluorine gas |
| 01/01/2009 | US20090001521 Semiconductor wafer |
| 01/01/2009 | US20090001520 Thinned wafer having stress dispersion parts and method for manufacturing semiconductor package using the same |
| 01/01/2009 | US20090001515 Semiconductor device and method for manufacturing the same |
| 01/01/2009 | US20090001508 Semiconductor device including fuse elements and bonding pad |
| 01/01/2009 | US20090001507 Semiconductor device |
| 01/01/2009 | US20090001506 Dual stress liner efuse |
| 01/01/2009 | US20090001505 Semiconductor device and method for forming device isolation film of semiconductor device |
| 01/01/2009 | US20090001497 Semiconductor integrated circuit device |
| 01/01/2009 | US20090001490 Optoelectronic Component that Emits Electromagnetic Radiation and Illumination Module |
| 01/01/2009 | US20090001472 Electrostatic discharge protection devices and methods for fabricating semiconductor devices including the same |
| 01/01/2009 | US20090001447 Semiconductor device with dummy electrode |
| 01/01/2009 | US20090001432 Channel layer for a thin film transistor, thin film transistor including the same, and methods of manufacturing the same |
| 01/01/2009 | US20090001426 Integrated Fin-Local Interconnect Structure |
| 01/01/2009 | US20090001396 Semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode |
| 01/01/2009 | US20090001370 Method and apparatus for extracting properties of interconnect wires and dielectrics undergoing planarization process |
| 01/01/2009 | US20090001369 Evaluation method for interconnects interacted with integrated-circuit manufacture |
| 01/01/2009 | US20090001368 Semiconductor device including semiconductor evaluation element, and evaluation method using semiconductor device |
| 01/01/2009 | US20090001367 Semiconductor device, method of fabricating the same, stacked module including the same, card including the same, and system including the stacked module |
| 01/01/2009 | US20090001366 Wafer Arrangement and Method for Manufacturing a Wafer Arrangement |
| 01/01/2009 | US20090001365 Memory card fabricated using sip/smt hybrid technology |
| 01/01/2009 | US20090001364 Semiconductor Device |
| 01/01/2009 | US20090001348 Semiconductor device |
| 01/01/2009 | US20090001329 Rare earth-oxides, rare earth-nitrides, rare earth-phosphies, and ternary alloys with silicon |
| 01/01/2009 | US20090000498 Printing device, production unit, and production method of electronic parts |
| 12/31/2008 | WO2009003018A2 Conformal shielding process using process gases |
| 12/31/2008 | WO2009002905A1 Array-molded package-on-package having redistribution lines |
| 12/31/2008 | WO2009002812A1 Method and apparatus for monitoring vias in a semiconductor fab |
| 12/31/2008 | WO2009002728A2 Land grid array (lga) socket loading mechanism for mobile platforms |
| 12/31/2008 | WO2009002536A1 Method for preventing void formation in a solder joint |
| 12/31/2008 | WO2009002392A2 Rf transistor packages with internal stability network and methods of forming rf transistor packages with internal stability networks |
| 12/31/2008 | WO2009002387A2 Rf power transistor packages with internal harmonic frequency reduction and methods of forming rf power transistor packages with internal harmonic frequency reduction |
| 12/31/2008 | WO2009002381A2 Mold compound circuit structure for enhanced electrical and thermal performance |
| 12/31/2008 | WO2009002343A1 Inhibition of copper dissolution for lead-free soldering |
| 12/31/2008 | WO2009002271A1 A wafer arrangement and a method for manufacturing the wafer arrangement |
| 12/31/2008 | WO2009001982A2 Metal-based photonic device package module and manufacturing method thereof |
| 12/31/2008 | WO2009001896A1 Filming method, and treating system |
| 12/31/2008 | WO2009001832A1 Display device and sputtering target |
| 12/31/2008 | WO2009001780A1 Semiconductor device and method for manufacturing the same |
| 12/31/2008 | WO2009001773A1 Bonded structure or sealed structure, and bonding method or sealing method and electronic part utilizing the structure |
| 12/31/2008 | WO2009001756A1 Heat spreader for semiconductor device |
| 12/31/2008 | WO2009001695A1 Semiconductor device |
| 12/31/2008 | WO2009001564A1 Semiconductor element mounting structure, method for manufacturing the semiconductor element mounting structure, semiconductor element mounting method and pressurizing tool |
| 12/31/2008 | WO2009001554A1 Circuit device |
| 12/31/2008 | WO2009001312A2 Packaged device for common mode filtering and esd protection |
| 12/31/2008 | WO2009001280A2 A method for the production of a microelectronic sensor device |
| 12/31/2008 | WO2009000105A1 A light-emitting diode lighting device |
| 12/31/2008 | WO2008137585A3 Circuit and method for interconnecting stacked integrated circuit dies |
| 12/31/2008 | WO2008135142A3 Method for producing a circuit board having a cavity for the integration of components and circuit board and application |
| 12/31/2008 | WO2008131713A3 Apparatus for the production of a rigid power module |
| 12/31/2008 | WO2008122959A3 Package, method of manufacturing a package and frame |
| 12/31/2008 | WO2007139852A8 Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modules |
| 12/31/2008 | WO2007120296A3 Electronic device and a process for forming the electronic device |
| 12/31/2008 | EP2009693A1 Method of fabricating a secured electronic system, corresponding device for securing an integrated circuit, and corresponding electronic system |
| 12/31/2008 | EP2009692A1 Electronic module and fabrication method thereof |
| 12/31/2008 | EP2009691A1 Semiconductor device |
| 12/31/2008 | EP2009690A2 Series-shunt switch with thermal terminal |
| 12/31/2008 | EP2009688A2 Semiconductor device and method of manufacturing the same |
| 12/31/2008 | EP2009684A1 Semiconductor device |
| 12/31/2008 | EP2008304A2 Improved chip-scale package |
| 12/31/2008 | EP2008303A1 Elastically deformable integrated-circuit device |
| 12/31/2008 | EP2008301A2 Method and structure for eliminating aluminum terminal pad material in semiconductor devices |
| 12/31/2008 | EP2007671A2 Inter-layer connection for foil mems technology |
| 12/31/2008 | EP1551211B1 Solder-coated ball and method for manufacture thereof, and method for forming semiconductor interconnecting structure |
| 12/31/2008 | EP1171915B1 Electrical conductor system of a semiconductor device and manufacturing method thereof |
| 12/31/2008 | CN201174855Y Radiator assembly |
| 12/31/2008 | CN201174853Y High-efficient cooling brushless controller |
| 12/31/2008 | CN201174852Y Combined construction of radiating rib module group |
| 12/31/2008 | CN201174851Y Wind guiding cover |
| 12/31/2008 | CN201174850Y Improved construction of water cooling head of heat radiating device |
| 12/31/2008 | CN201174849Y Heat radiating module and assembly for the same and circuit board |
| 12/31/2008 | CN201174848Y Heat radiating fin |
| 12/31/2008 | CN201174588Y Electrostatic discharging circuit |
| 12/31/2008 | CN201174387Y High-efficient LED |
| 12/31/2008 | CN201174385Y Array substrate of thin-film transistor |
| 12/31/2008 | CN201174383Y Combined semiconductor luminous tube |
| 12/31/2008 | CN201174382Y Conductive wire rack |
| 12/31/2008 | CN201174381Y Construction reducing thickness of integrated circuit package |
| 12/31/2008 | CN201174284Y High voltage insulating tube |
| 12/31/2008 | CN201173471Y LED lamp |
| 12/31/2008 | CN201173470Y LED lighting lamp modified type component type light source structure |
| 12/31/2008 | CN201173469Y Explosion-proof lamp light source |
| 12/31/2008 | CN201173467Y Split joint type LED illumination heat radiator unit |
| 12/31/2008 | CN201173466Y LED flood light |
| 12/31/2008 | CN201173465Y LED floodlight |
| 12/31/2008 | CN201173464Y LED flood light assembly |
| 12/31/2008 | CN201173463Y Reflection-free double image-free integral radiation high light efficiency high power LED road lamp |
| 12/31/2008 | CN201173462Y Large power LED lamp |
| 12/31/2008 | CN201173461Y LED lighting lamp possessing heat radiating device |