| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/02/2009 | DE102007030286A1 Wafer-Anordnung und Verfahren zum Herstellen einer Wafer-Anordnung Wafer arrangement and method of manufacturing a wafer-arrangement |
| 01/02/2009 | DE102007029851A1 Elektrisches Speichermodul Electrical storage module |
| 01/02/2009 | DE102007025658A1 Contact wire arrangement has two electrically conducting elements, spacer and contact wire, where contact wire is bonded on former element in bonding area |
| 01/02/2009 | DE102007013913A1 Lüfter Fan |
| 01/02/2009 | DE102006058010B4 Halbleiterbauelement mit Hohlraumstruktur und Herstellungsverfahren A semiconductor device structure and manufacturing method with cavity |
| 01/02/2009 | DE102006011473B4 Mehrchipgehäuse und Verfahren zum Bilden von Mehrchipgehäusen für eine ausgeglichene Leistung Multi-chip package and method of forming of multi-chip packages for a balanced performance |
| 01/02/2009 | DE102005006638B4 Haftfeste Leiterbahn auf Isolationsschicht Tenacious conductor on insulating layer |
| 01/02/2009 | DE102004063994B4 Chipgroße Packungsstruktur Large chip package structure |
| 01/02/2009 | DE102004047753B4 Verbesserte Chip-Kontaktierungsanordnung für Chip-Träger für Flip-Chip-Anwendungen Improved chip-contacting arrangement for chip carriers for flip-chip applications |
| 01/02/2009 | DE10113110B4 Filmmaterial und Film mit niedriger Dielektrizitätskonstante Footage and low dielectric constant film |
| 01/01/2009 | US20090004846 Wiring board, manufacturing method thereof, semiconductor device and manufacturing method thereof |
| 01/01/2009 | US20090004845 Method for Making Semiconductor Structures Implementing Sacrificial Material |
| 01/01/2009 | US20090004805 Damage Implantation of a Cap Layer |
| 01/01/2009 | US20090004787 Thin film transistor array panel for liquid crystal display |
| 01/01/2009 | US20090004784 Method for fabricating semiconductor package free of substrate |
| 01/01/2009 | US20090004783 Method of package stacking using unbalanced molded tsop |
| 01/01/2009 | US20090004779 Fabrication method of semiconductor integrated circuit device |
| 01/01/2009 | US20090002961 Packaging system with hollow package |
| 01/01/2009 | US20090002012 Accurate Capacitance Measurement for Ultra Large Scale Integrated Circuits |
| 01/01/2009 | US20090001617 Alignment key, method for fabricating the alignment key, and method for fabricating thin film transistor substrate using the alignment key |
| 01/01/2009 | US20090001616 Method and apparatus for wafer marking |
| 01/01/2009 | US20090001615 Semiconductor test structures |
| 01/01/2009 | US20090001614 Semiconductor device with a buffer region with tightly-packed filler particles |
| 01/01/2009 | US20090001613 Integrated circuit package system with overhang die |
| 01/01/2009 | US20090001612 Integrated circuit package system with dual side connection |
| 01/01/2009 | US20090001611 Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method |
| 01/01/2009 | US20090001610 Semiconductor die having a redistribution layer |
| 01/01/2009 | US20090001609 Semiconductor Device and Method of Assembly |
| 01/01/2009 | US20090001608 Semiconductor device and wire bonding method |
| 01/01/2009 | US20090001607 Electronic Device Comprising an esd Device |
| 01/01/2009 | US20090001606 Semiconductor package and semiconductor device using the same |
| 01/01/2009 | US20090001605 Semiconductor package and method for manufacturing the same |
| 01/01/2009 | US20090001604 Semiconductor Package and Method for Producing Same |
| 01/01/2009 | US20090001603 High-Density Fine Line Structure And Method Of Manufacturing The Same |
| 01/01/2009 | US20090001602 Stack package that prevents warping and cracking of a wafer and semiconductor chip and method for manufacturing the same |
| 01/01/2009 | US20090001601 Memory array on more than one die |
| 01/01/2009 | US20090001600 Electronic device including a plurality of singulated die and methods of forming the same |
| 01/01/2009 | US20090001599 Die attachment, die stacking, and wire embedding using film |
| 01/01/2009 | US20090001598 Formation of Through Via before Contact Processing |
| 01/01/2009 | US20090001597 Semiconductor device having an interconnect electrically connecting a front and backside thereof and a method of manufacture therefor |
| 01/01/2009 | US20090001596 Conductive line structure |
| 01/01/2009 | US20090001595 Integrated Circuit, Intermediate Structure and a Method of Fabricating a Semiconductor Structure |
| 01/01/2009 | US20090001594 Airgap interconnect system |
| 01/01/2009 | US20090001593 Integrated circuit package system with overhanging connection stack |
| 01/01/2009 | US20090001592 Metal interconnect forming methods and ic chip including metal interconnect |
| 01/01/2009 | US20090001591 Reducing resistivity in metal interconnects by compressive straining |
| 01/01/2009 | US20090001590 Wiring structure and method of manufacturing the same |
| 01/01/2009 | US20090001589 Nor flash device and method for fabricating the device |
| 01/01/2009 | US20090001588 Metal and alloy silicides on a single silicon wafer |
| 01/01/2009 | US20090001587 Ta-TaN SELECTIVE REMOVAL PROCESS FOR INTEGRATED DEVICE FABRICATION |
| 01/01/2009 | US20090001586 Integrated circuit and seed layers |
| 01/01/2009 | US20090001585 Method of manufacturing flash memory device |
| 01/01/2009 | US20090001584 Semiconductor device and method for fabricating the same |
| 01/01/2009 | US20090001583 Method of manufacturing semiconductor device |
| 01/01/2009 | US20090001582 Semiconductor device with metal gate and method for fabricating the same |
| 01/01/2009 | US20090001581 Metal line of semiconductor device and method of forming the same |
| 01/01/2009 | US20090001580 METAL LINE OF SEMICONDUCTOR DEVICE HAVING A DIFFUSION BARRIER INCLUDING CRxBy AND METHOD FOR FORMING THE SAME |
| 01/01/2009 | US20090001579 Multi-layered metal line having an improved diffusion barrier of a semiconductor device and method for forming the same |
| 01/01/2009 | US20090001578 METAL LINE OF SEMICONDUCTOR DEVICE HAVING A DIFFUSION BARRIER WITH AN AMORPHOUS TaBN LAYER AND METHOD FOR FORMING THE SAME |
| 01/01/2009 | US20090001577 Metal line of semiconductor device with a triple layer diffusion barrier and method for forming the same |
| 01/01/2009 | US20090001576 Interconnect using liquid metal |
| 01/01/2009 | US20090001575 Printed Circuit Board, Mounting Method of Electronic Component, and Electronic Apparatus |
| 01/01/2009 | US20090001574 Multi-chips Stacked package structure |
| 01/01/2009 | US20090001573 Structure and method for wire bond integrity check on BGA substrates using indirect electrical interconnectivity pathway between wire bonds and ground |
| 01/01/2009 | US20090001572 Semiconductor device and method of manufacturing the same |
| 01/01/2009 | US20090001571 Semiconductor device and method of manufacturing the same |
| 01/01/2009 | US20090001570 Electronic device and method of manufacturing the same |
| 01/01/2009 | US20090001569 Semiconductor device and method for manufacturing the same |
| 01/01/2009 | US20090001568 Wafer-level solder bumps |
| 01/01/2009 | US20090001567 IC chip with finger-like bumps |
| 01/01/2009 | US20090001566 Semiconductor Device Having Improved Gate Electrode Placement and Decreased Area Design |
| 01/01/2009 | US20090001565 Mems device formed inside hermetic chamber having getter film |
| 01/01/2009 | US20090001564 Package substrate dynamic pressure structure |
| 01/01/2009 | US20090001563 Integrated circuit package in package system with adhesiveless package attach |
| 01/01/2009 | US20090001562 Semiconductor device |
| 01/01/2009 | US20090001561 High Thermal Performance Packaging for Circuit Dies |
| 01/01/2009 | US20090001560 Embedded Heat Pipe In A Hybrid Cooling System |
| 01/01/2009 | US20090001559 Semiconductor device, a method of manufacturing the same and an electronic device |
| 01/01/2009 | US20090001558 Lamp Seat for a Light Emitting Diode and Capable of Heat Dissipation, and Method of Manufacturing the Same |
| 01/01/2009 | US20090001557 Forming a semiconductor package including a thermal interface material |
| 01/01/2009 | US20090001556 Low temperature thermal interface materials |
| 01/01/2009 | US20090001555 Semiconductor device having metal cap |
| 01/01/2009 | US20090001554 Semiconductor device |
| 01/01/2009 | US20090001553 Mems Package and Method for the Production Thereof |
| 01/01/2009 | US20090001552 Semiconductor package having through holes for molding back side of package |
| 01/01/2009 | US20090001551 Novel build-up-package for integrated circuit devices, and methods of making same |
| 01/01/2009 | US20090001550 Method of Forming a Multilayer Substrate Core Structure Using Sequential Microvia Laser Drilling And Substrate Core Structure Formed According to the Method |
| 01/01/2009 | US20090001549 Integrated circuit package system with symmetric packaging |
| 01/01/2009 | US20090001548 Semiconductor package |
| 01/01/2009 | US20090001547 High-Density Fine Line Structure And Method Of Manufacturing The Same |
| 01/01/2009 | US20090001546 Ultra-thick thick film on ceramic substrate |
| 01/01/2009 | US20090001545 Integrated circuit package system with side substrate |
| 01/01/2009 | US20090001544 Chip stacked structure and method of fabricating the same |
| 01/01/2009 | US20090001543 Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the same |
| 01/01/2009 | US20090001542 Semiconductor package and multi-chip semiconductor package using the same |
| 01/01/2009 | US20090001541 Method and apparatus for stackable modular integrated circuits |
| 01/01/2009 | US20090001540 Stackable Package by Using Internal Stacking Modules |
| 01/01/2009 | US20090001539 Integrated circuit package system with top and bottom terminals |
| 01/01/2009 | US20090001538 Printed wiring board structure, electronic component mounting method and electronic apparatus |
| 01/01/2009 | US20090001537 Gettering material for encapsulated microdevices and method of manufacture |