| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/07/2009 | CN101338889A Heatsink and cooling apparatus |
| 01/07/2009 | CN101338888A Street light fitting with luminous diode heat radiating device |
| 01/07/2009 | CN101338887A Energy-saving environment-friendly LED reflectoscope and its making process |
| 01/07/2009 | CN101338885A LED lamp |
| 01/07/2009 | CN101337308A 焊料 Solder |
| 01/07/2009 | CN100450336C Single-phase ultrahigh heat flow micro-column heat exchanger |
| 01/07/2009 | CN100450330C Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device |
| 01/07/2009 | CN100449932C Power module and electric transportation apparatus incorporating the same |
| 01/07/2009 | CN100449871C Anisotropic conductive connector and circuit-device electrical-inspection device |
| 01/07/2009 | CN100449776C Interlayer dielectric and pre-applied die attach adhesive materials |
| 01/07/2009 | CN100449763C A memory device and method of manufacturing same |
| 01/07/2009 | CN100449762C Semiconductor chip and method for manufacturing the same and semiconductor device |
| 01/07/2009 | CN100449756C Electric motor and method for producing said motor |
| 01/07/2009 | CN100449755C Three-dimensional semiconductor package, and spacer chip used therein |
| 01/07/2009 | CN100449754C Semiconductor device and its aking method |
| 01/07/2009 | CN100449753C Capsulation structure of luminous secondary body |
| 01/07/2009 | CN100449752C Method for manufacturing circuit device |
| 01/07/2009 | CN100449751C Surface mount solder method and apparatus for decoupling capacitance and process of making |
| 01/07/2009 | CN100449750C Semiconductor structure and manufacture method thereof |
| 01/07/2009 | CN100449749C Differential input and output grade with static discharging protective circuit |
| 01/07/2009 | CN100449748C Making contact with the emitter contact of a semiconductor |
| 01/07/2009 | CN100449747C Chip scale stacking system and method |
| 01/07/2009 | CN100449746C High-power land grid array package and socket |
| 01/07/2009 | CN100449745C Thermally enhanced electronic flip-chip packaging with external-connector-side die and method |
| 01/07/2009 | CN100449744C Integrated circuit packaging structure with pin on the chip and its chip supporting member |
| 01/07/2009 | CN100449743C Chip structure and stacked chip packing structure |
| 01/07/2009 | CN100449742C Cooling unit and flow distributing element for use in such unit |
| 01/07/2009 | CN100449740C Cooling method for reducing semiconductor device heating, manufacturing method and corresponding semiconductor device |
| 01/07/2009 | CN100449739C Electrical circuit apparatus and methods for assembling same |
| 01/07/2009 | CN100449738C Semiconductor chip and circuit board, manufacturing method of same, and electronic equipment |
| 01/07/2009 | CN100449737C Film transistor array substrate and its manufacturing method |
| 01/07/2009 | CN100449734C 半导体器件 Semiconductor devices |
| 01/07/2009 | CN100449721C Structure and method for packaging image sensor |
| 01/07/2009 | CN100449717C A making method for thermal sediment of GaAs single-chip microwave integration circuit power amplifier |
| 01/07/2009 | CN100449707C 半导体器件 Semiconductor devices |
| 01/07/2009 | CN100449650C Test structure for a single-sided buried strap dram memory cell data array |
| 01/07/2009 | CN100449640C Ferroelectric or electret memory circuit |
| 01/07/2009 | CN100449247C Heat transport apparatus and heat transport apparatus manufacturing method |
| 01/07/2009 | CN100448909C Light sensitive element packaging material combination and using method thereof |
| 01/06/2009 | USRE40618 Integrated cooling system |
| 01/06/2009 | US7475175 Multi-processor module |
| 01/06/2009 | US7474538 Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor package |
| 01/06/2009 | US7474532 Heat sink restraints for calibrated mating pressure and shock absorption |
| 01/06/2009 | US7474530 High-load even pressure heatsink loading for low-profile blade computer applications |
| 01/06/2009 | US7474526 Electronic apparatus |
| 01/06/2009 | US7474104 Wafer-to-wafer alignments |
| 01/06/2009 | US7474010 Systems and methods for performing quantum computations |
| 01/06/2009 | US7474009 Optoelectronic molding compound that transmits visible light and blocks infrared light |
| 01/06/2009 | US7474008 Semiconductor device with reduced electromigration |
| 01/06/2009 | US7474007 Semiconductor package |
| 01/06/2009 | US7474006 Package board and semiconductor device |
| 01/06/2009 | US7474005 Microelectronic element chips |
| 01/06/2009 | US7474004 Three dimensional structure memory |
| 01/06/2009 | US7474003 Semiconductor integrated circuit device |
| 01/06/2009 | US7474002 Semiconductor device having dielectric film having aperture portion |
| 01/06/2009 | US7474000 High density contact to relaxed geometry layers |
| 01/06/2009 | US7473998 Method for forming bump protective collars on a bumped wafer |
| 01/06/2009 | US7473997 Method for forming robust solder interconnect structures by reducing effects of seed layer underetching |
| 01/06/2009 | US7473996 Signal transfer film, display apparatus having the same and method of manufacturing the same |
| 01/06/2009 | US7473995 Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
| 01/06/2009 | US7473994 Method of producing insulator thin film, insulator thin film, method of manufacturing semiconductor device, and semiconductor device |
| 01/06/2009 | US7473993 Semiconductor stack package and memory module with improved heat dissipation |
| 01/06/2009 | US7473992 Multi-layer interconnection circuit module and manufacturing method thereof |
| 01/06/2009 | US7473991 Semiconductor device and electric apparatus |
| 01/06/2009 | US7473990 Semiconductor device featuring electrode terminals forming superior heat-radiation system |
| 01/06/2009 | US7473989 Flip-chip package |
| 01/06/2009 | US7473988 Wiring board construction including embedded ceramic capacitors(s) |
| 01/06/2009 | US7473987 Semiconductor device |
| 01/06/2009 | US7473978 Semiconductor device and method of manufacturing the same |
| 01/06/2009 | US7473974 Semiconductor circuit device including a protection circuit |
| 01/06/2009 | US7473958 Electronic memory component with protection against light attack |
| 01/06/2009 | US7473954 Bitline of semiconductor device having stud type capping layer and method for fabricating the same |
| 01/06/2009 | US7473953 Method for fabricating metallic bit-line contacts |
| 01/06/2009 | US7473911 Specimen current mapper |
| 01/06/2009 | US7473903 Method and apparatus for deposited hermetic cover for digital X-ray panel |
| 01/06/2009 | US7473845 Structural unit and method for the production of a structural unit |
| 01/06/2009 | US7473633 Method for making integrated circuit chip having carbon nanotube composite interconnection vias |
| 01/06/2009 | US7473628 Method of manufacturing semiconductor device and semiconductor device |
| 01/06/2009 | US7473617 Integrated circuit chip manufacturing method and semiconductor device |
| 01/06/2009 | US7473582 Method for fabricating semiconductor component with thinned substrate having pin contacts |
| 01/06/2009 | US7473580 Temporary chip attach using injection molded solder |
| 01/06/2009 | US7473578 Encapsulation for particle entrapment |
| 01/06/2009 | US7473476 Prevents deterioration of a soldering portion and improved strength of thermal fatigue resistance, electronic circuit board |
| 01/06/2009 | US7473460 Ceramic substrate, electronic apparatus, and method for producing ceramic substrate |
| 01/06/2009 | US7473319 Apparatus and method for manufacturing semiconductor device incorporating fuse elements |
| 01/02/2009 | DE4338432B4 Integrierte Halbleiterschaltungsbaueinheit, Herstellungsverfahren dafür und Montageverfahren dafür Integrated Halbleiterschaltungsbaueinheit, manufacturing method thereof, and assembly method thereof |
| 01/02/2009 | DE19856331B4 Verfahren zur Eingehäusung elektronischer Bauelemente Method for Eingehäusung electronic components |
| 01/02/2009 | DE10319782B4 Optoelektronisches Halbleiterbauelement mit einem Chipträgerelement An optoelectronic semiconductor device comprising a chip carrier element |
| 01/02/2009 | DE10313917B4 Halbleitervorrichtung Semiconductor device |
| 01/02/2009 | DE10309502B4 Verfahren zur Herstellung einer Lothügelstruktur und Lothügelstruktur A process for preparing a Lothügelstruktur and Lothügelstruktur |
| 01/02/2009 | DE10306227B4 Leistungsmodul und Umrichter Power module and inverter |
| 01/02/2009 | DE10234951B4 Verfahren zur Herstellung von Halbleiterschaltungsmodulen A method for manufacturing semiconductor circuit modules |
| 01/02/2009 | DE102008029813A1 Halbleiterbauteil und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same |
| 01/02/2009 | DE102008028943A1 Halbleiterbauelement mit einem Beanspruchungspuffer A semiconductor device comprising a stress buffer |
| 01/02/2009 | DE102008028942A1 Halbleiterbauelement Semiconductor device |
| 01/02/2009 | DE102008026786A1 Elektronische Hochfrequenzvorrichtung in Verbindung mit einer Radaranlage Electronic high-frequency device in conjunction with a radar system |
| 01/02/2009 | DE102008023127A1 Halbleiterbauelement Semiconductor device |
| 01/02/2009 | DE102008002425A1 Elektromagnetische Bandabstandstruktur und Leiterplatte Electromagnetic bandgap structure and printed circuit board |
| 01/02/2009 | DE102007050241A1 Wärmeübertragungsvorrichtung und Speichermodul Heat transfer device and memory module |
| 01/02/2009 | DE102007032142A1 Elektronikmodul und Verfahren zur Herstellung eines Elektronikmoduls Electronic module and method for producing an electronic module |