| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/31/2014 | US20140210093 Semiconductor device and method of manufacturing semiconductor device |
| 07/31/2014 | US20140210091 Method of manufacturing semiconductor device and semiconductor device |
| 07/31/2014 | US20140210090 Circuit module and method of manufacturing the same |
| 07/31/2014 | US20140210089 Copper interconnect structure and its formation |
| 07/31/2014 | US20140210088 Method for reducing wettability of interconnect material at corner interface and device incorporating same |
| 07/31/2014 | US20140210087 Interconnection structures for semiconductor devices and methods of fabricating the same |
| 07/31/2014 | US20140210086 Semiconductor device and method of manufacturing the semiconductor device |
| 07/31/2014 | US20140210085 Capping Layer for Improved Deposition Selectivity |
| 07/31/2014 | US20140210084 Semiconductor device connected by anisotropic conductive film |
| 07/31/2014 | US20140210083 Thermally and electrically enhanced ball grid array package |
| 07/31/2014 | US20140210082 Semiconductor device |
| 07/31/2014 | US20140210081 Packaging Methods and Packaged Semiconductor Devices |
| 07/31/2014 | US20140210080 PoP Device |
| 07/31/2014 | US20140210079 Method for designing power distribution network of circuit system and related circuit system |
| 07/31/2014 | US20140210078 RFID Chip Module |
| 07/31/2014 | US20140210077 Integrated circuit system with distributed power supply |
| 07/31/2014 | US20140210076 Flip-chip hybridization of microelectronic components by local heating of connecting elements |
| 07/31/2014 | US20140210074 Semiconductor Devices, Methods of Manufacture Thereof, and Semiconductor Device Packages |
| 07/31/2014 | US20140210072 Semiconductor module |
| 07/31/2014 | US20140210071 Integrated structure with improved heat dissipation |
| 07/31/2014 | US20140210070 Friction Stir Welding Structure and Power Semiconductor Device |
| 07/31/2014 | US20140210069 Chip package and manufacturing method thereof |
| 07/31/2014 | US20140210068 Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance |
| 07/31/2014 | US20140210067 Semiconductor device and method for manufacturing semiconductor device |
| 07/31/2014 | US20140210066 Semiconductor package and method of manufacturing the same |
| 07/31/2014 | US20140210065 Semiconductor package |
| 07/31/2014 | US20140210064 Wire bonding method and structure |
| 07/31/2014 | US20140210063 Semiconducitive catechol group encapsulant adhesion promoter for a packaged electronic device |
| 07/31/2014 | US20140210062 Leadframe-Based Semiconductor Package Having Terminals on Top and Bottom Surfaces |
| 07/31/2014 | US20140210061 Chip arrangement and chip package |
| 07/31/2014 | US20140210060 Semiconductor device |
| 07/31/2014 | US20140210059 Organic module emi shielding structures and methods |
| 07/31/2014 | US20140210058 Semiconductor device and method of fabricating the same |
| 07/31/2014 | US20140210056 Semiconductor device |
| 07/31/2014 | US20140210055 Method of forming micropattern, method of forming damascene metallization, and semiconductor device and semiconductor memory device fabricated using the same |
| 07/31/2014 | US20140210054 Semiconductor Devices and Methods of Producing These |
| 07/31/2014 | US20140210053 Bi-directional esd protection circuit |
| 07/31/2014 | US20140210046 Semiconductor device having high frequency wiring and dummy metal layer at multilayer wiring structure |
| 07/31/2014 | US20140210043 Integrated circuit device featuring an antifuse and method of making same |
| 07/31/2014 | US20140210042 Semiconductor device |
| 07/31/2014 | US20140210041 Electronic fuse having an insulation layer |
| 07/31/2014 | US20140210040 Electronic fuse line with modified cap |
| 07/31/2014 | US20140210026 Short circuit reduction in a ferroelectric memory cell comprising a stack of layers arranged on a flexible substrate |
| 07/31/2014 | US20140209990 Semiconductor device and method of manufacturing thereof |
| 07/31/2014 | US20140209984 Semiconductor Device With Multi Level Interconnects And Method Of Forming The Same |
| 07/31/2014 | US20140209968 Primer composition and optical semiconductor apparatus using same |
| 07/31/2014 | US20140209926 Semiconductor integrated circuit |
| 07/31/2014 | US20140209908 Flattened substrate surface for substrate bonding |
| 07/31/2014 | US20140209905 Integrated Circuit, Semiconductor Device and Method of Manufacturing a Semiconductor Device |
| 07/31/2014 | US20140209666 3d assembly for interposer bow |
| 07/31/2014 | US20140209663 Wire bonder and method of calibrating a wire bonder |
| 07/31/2014 | US20140209284 Manufacturing process and heat dissipating device for forming interface for electronic component |
| 07/31/2014 | US20140209215 Copper-based alloy wire and methods for manufaturing the same |
| 07/31/2014 | DE112012004377T5 Leistungswandler mit integrierten Kondensatoren Power converter with integrated capacitors |
| 07/31/2014 | DE112012004285T5 Auf Wafer-Ebene aufgebrachte RF-Abschirmungen To applied RF shields wafer level |
| 07/31/2014 | DE112011105738T5 Halbleitermodul Semiconductor module |
| 07/31/2014 | DE10223850B4 Verfahren zum Verbinden eines optoelektrischen Moduls mit einem Halbleitergehäuse A method for connecting an optoelectric module with a semiconductor package |
| 07/31/2014 | DE102014201521A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation |
| 07/31/2014 | DE102014101076A1 Halbleiterbauelemente und Verfahren zu deren Herstellung Semiconductor devices and processes for their preparation |
| 07/31/2014 | DE102014100897A1 Integrierte Prüfschaltung und Verfahren zur Herstellung einer integrierten Prüfschaltung Integrated test circuit and method for fabricating an integrated test circuit |
| 07/31/2014 | DE102014100878A1 Chipanordnung und Chipbaugruppe Chip array and chip assembly |
| 07/31/2014 | DE102014100877A1 Integrierte Schaltung, Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung An integrated circuit semiconductor device and method of manufacturing a semiconductor device |
| 07/31/2014 | DE102014100522A1 Leistungshalbleitervorrichtung mit einem kühlmaterial Power semiconductor device with a cool material |
| 07/31/2014 | DE102013201622A1 Kühlvorrichtung mit speziellem Kühlkörper Cooler with special heat sink |
| 07/31/2014 | DE102013201327A1 Leiterplatte, optoelektronisches Bauteil und Anordnung optoelektronischer Bauteile PCB, optoelectronic device and arrangement of optoelectronic components |
| 07/31/2014 | DE102013104455A1 PoP-Gerät PoP device |
| 07/31/2014 | DE102013103812A1 Halbleiterbauteil mit Verbindungen über mehrere Ebenen sowie Verfahren zur Ausbildung desselben The same semiconductor component with connections across multiple layers and method of forming |
| 07/31/2014 | DE102011076879B4 Anordnung zum Anpressen eines elektronischen Bauteils an einen Kühlkörper Arrangement for pressing an electronic component to a heat sink |
| 07/31/2014 | DE102009042600B4 Herstellungsverfahren für ein Leistungshalbleitermodul Manufacturing method for a power semiconductor module |
| 07/31/2014 | DE102009037257B4 Leistungshalbleitermodul mit Schaltungsträger und Lastanschlusselement sowie Herstellungsverfahren hierzu Power semiconductor module with circuit carriers and load connection element and manufacturing method therefor |
| 07/31/2014 | DE102006006820B4 IC-Chip-Beschichtungsmaterial sowie Zwischenprodukt und Verfahren zur Herstellung einer Vakuumfluoreszenzdisplayvorrichtung IC-chip-coating material, as well as intermediate and process for producing a vacuum fluorescent display device |
| 07/31/2014 | DE102004042348B4 ESD-Halbleiterbauelement mit erhöhter ESD-Robustheit ESD semiconductor device with increased ESD robustness |
| 07/30/2014 | EP2760045A1 Elastomer product |
| 07/30/2014 | EP2760044A1 Embedded package on package systems |
| 07/30/2014 | EP2760043A1 Integrated core microelectronic package |
| 07/30/2014 | EP2759935A2 Storage device, flash memory, and operating method |
| 07/30/2014 | EP2759874A1 Circuit for preventing static electricity and display device having the same |
| 07/30/2014 | EP2759782A1 Cooling apparatus using electro-hydrodynamic air moving means |
| 07/30/2014 | CN203747396U 功率模块保护装置 Power module protection |
| 07/30/2014 | CN203746853U 阵列基板和显示装置 An array substrate and a display device |
| 07/30/2014 | CN203746852U 一种平板式功率半导体模块 A flat-type power semiconductor module |
| 07/30/2014 | CN203746844U 功率模块封装结构 Power module package structure |
| 07/30/2014 | CN203746843U 一种功率半导体模块 A power semiconductor module |
| 07/30/2014 | CN203746842U 一种散热一体化功率模块的封装结构 A package structure integrated power module cooling |
| 07/30/2014 | CN203746841U 功率半导体模块 Power semiconductor module |
| 07/30/2014 | CN203746840U 一种大功率半桥模块 One kind of high-power half-bridge module |
| 07/30/2014 | CN203746839U 高功率塑封瞬时抑制二极管 Plastic high power transient suppression diodes |
| 07/30/2014 | CN203746838U 新型复合二极管 New composite diode |
| 07/30/2014 | CN203746837U 一种容量为4G×16bit的立体封装NAND FLASH存储器 One kind of capacity for 4G × 16bit stereo package NAND FLASH memory |
| 07/30/2014 | CN203746836U 功率模块焊接结构 Power Modules welded structures |
| 07/30/2014 | CN203746835U 封装结构 Package structure |
| 07/30/2014 | CN203746834U 封装结构 Package structure |
| 07/30/2014 | CN203746833U 在功率半导体封装中使用的焊接用信号引线 Welding wire for use in signal power semiconductor package |
| 07/30/2014 | CN203746832U 半导体芯片和半导体器件 Semiconductor chips and semiconductor devices |
| 07/30/2014 | CN203746831U 一种柔性显示器 A flexible display |
| 07/30/2014 | CN203746830U 一种利用水冷散热器双面散热的模块功率封装结构 A use of double-sided cooling water cooler module power package |
| 07/30/2014 | CN203746829U 一种小功率绝缘栅双极性晶体管全桥模块 A small-power insulated gate bipolar transistor full bridge modules |
| 07/30/2014 | CN203746828U 一种高频大功率碳化硅mosfet模块 A high-frequency power SiC mosfet module |
| 07/30/2014 | CN203746827U 半导体装置 Semiconductor device |
| 07/30/2014 | CN203746826U 芯片封装结构 Chip package structure |