| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/08/2009 | US20090008128 Electronic apparatus |
| 01/08/2009 | US20090008067 Heat dissipation device |
| 01/08/2009 | DE4481362B4 Temperaturkompensationsschaltung für IC-Baustein Temperature compensation circuit for IC package |
| 01/08/2009 | DE19927727B4 Spannungsstoßverhinderungsschaltung für Transistoren mit isoliertem Gate und Verfahren zur Festlegung eines zugehörigen Widerstandswertes Surge prevention circuit for insulated gate transistors and procedures defining an associated resistance value |
| 01/08/2009 | DE19903342B4 Multi-Chipmodul-Gehäuse für Mikrowellenanwendungen mit Hochfrequenz-Anschlußstift-Gitteranordnung Multi-chip module housing for microwave applications with high frequency pin grid array |
| 01/08/2009 | DE10345157B4 Wärmeleitende Verpackung von elektronischen Schaltungseinheiten Thermally conductive packaging electronic circuit units |
| 01/08/2009 | DE102008031358A1 Zwischenverbindungsstruktur für ein Halbleiterpackage und Verfahren zu deren Herstellung Interconnect structure for a semiconductor package and method for their preparation |
| 01/08/2009 | DE102008029792A1 NOR-flash-Bauelement und Verfahren zur Herstellung des Bauelementes NOR flash device and process for the preparation of the component |
| 01/08/2009 | DE102008027703A1 Halbleiterbauelement Semiconductor device |
| 01/08/2009 | DE102008026981A1 Halbleiterbauelement und zugehöriges Verfahren zu Drahtisolation Semiconductor device and associated method for wire insulation |
| 01/08/2009 | DE102007031562A1 Gehäuse mit einem elektrischen Modul Housing, with an electrical module |
| 01/08/2009 | DE102007030799A1 Device, has circuit having electrical component irreversibly alterable by current pulse, and externally accessible electrical interface is connected for supply of electrically conducting current pulse to component |
| 01/08/2009 | DE102007029720A1 Baugruppe mit einem ASIC und einem Gehäuse für den ASIC Assembly having an ASIC and a housing for the ASIC |
| 01/08/2009 | DE102006061586B4 Verbindungsnetzwerk zwischen Halbleiterstrukturen sowie damit ausgestatteter Schaltkreis und Verfahren zur Datenübertragung Interconnection network between semiconductor structures, and hence equipped circuit and method for transmitting data |
| 01/08/2009 | DE102004033106B4 System und Verfahren für eine verbesserte thermische LED-Leitfähigkeit System and method for improved thermal conductivity LED |
| 01/08/2009 | CA2692595A1 Low resistance through-wafer via |
| 01/07/2009 | EP2012574A1 Heat transfer member, protruding structural member, electronic device, and electric product |
| 01/07/2009 | EP2012357A2 Method of manufacturing a semi conductor device |
| 01/07/2009 | EP2012356A2 Heatsink and cooling apparatus |
| 01/07/2009 | EP2012355A2 Heat dissipation plate and semiconductor device |
| 01/07/2009 | EP2012354A1 Aluminum/silicon carbide composite and radiating part comprising the same |
| 01/07/2009 | EP2012352A1 Electronic component, electronic component device using same, and method for manufacturing same |
| 01/07/2009 | EP2011149A2 Apparatus and method for use in mounting electronic elements |
| 01/07/2009 | EP2011148A2 Micro device with microtubes |
| 01/07/2009 | EP2010500A1 Layout of power semiconductor contacts on a cooling surface |
| 01/07/2009 | EP1769538A4 Semiconductor package having integrated metal parts for thermal enhancement |
| 01/07/2009 | EP1547144A4 Reduced splattering of unpassivated laser fuses |
| 01/07/2009 | EP1356511B1 Use of protective caps as masks at a wafer scale |
| 01/07/2009 | EP1110238B1 Method of etching doped silicon dioxide with selectivity to undoped silicon dioxide with a high density plasma etcher |
| 01/07/2009 | EP1105191B2 Safety unit |
| 01/07/2009 | EP0910121B1 Semiconductor device |
| 01/07/2009 | CN201178552Y Heat Radiating device |
| 01/07/2009 | CN201178551Y Fixing structure of heat radiator |
| 01/07/2009 | CN201178550Y Heat radiator for electric and electronic application |
| 01/07/2009 | CN201178549Y Fixing construction of electronic element and apparatus applying the same |
| 01/07/2009 | CN201178548Y Combined construction of heat radiator |
| 01/07/2009 | CN201178547Y Fin construction of heat radiator module |
| 01/07/2009 | CN201178546Y Improved construction of heat radiating module |
| 01/07/2009 | CN201178545Y Radiating module construction |
| 01/07/2009 | CN201178543Y Heat radiating apparatus having vibration absorbing construction |
| 01/07/2009 | CN201178542Y Heat radiating apparatus having curved temperature equalizing board |
| 01/07/2009 | CN201178523Y Single surface pasting circuit board |
| 01/07/2009 | CN201178100Y Organic electro-luminescence display screen having organic solar cell |
| 01/07/2009 | CN201178099Y LED and thermistor of positive temperature coefficient |
| 01/07/2009 | CN201178098Y Semi-conductor conducting wire frame apparatus |
| 01/07/2009 | CN201178097Y Wind cooling radiating component of plate-belt type integrated circuit |
| 01/07/2009 | CN201178096Y Radiating construction of inserting pin type LED |
| 01/07/2009 | CN201178095Y Surface adhesive type radiating construction of LED |
| 01/07/2009 | CN201178094Y Bearing seat construction |
| 01/07/2009 | CN201177247Y LED lamps heat radiator |
| 01/07/2009 | CN201177246Y LED fluorescent lamp |
| 01/07/2009 | CN201177245Y LED light source tower type elastic heat radiator |
| 01/07/2009 | CN201177225Y Large power LED lamp |
| 01/07/2009 | CN101341809A An electronic device, a housing part, and a method of manufacturing a housing part |
| 01/07/2009 | CN101341594A Integrated circuit comprising at least one integrated transmission line |
| 01/07/2009 | CN101341593A Multiple die integrated circuit package |
| 01/07/2009 | CN101341592A Semiconductor module |
| 01/07/2009 | CN101341501A Method of manufacturing rfid devices |
| 01/07/2009 | CN101340805A Heat radiating assembly |
| 01/07/2009 | CN101340804A Surface processing method of heat radiating module |
| 01/07/2009 | CN101340803A Fixture construction |
| 01/07/2009 | CN101340802A Heat radiating module |
| 01/07/2009 | CN101340800A Pin shape/composite fin radiator added with hot pipe technique |
| 01/07/2009 | CN101340799A Streamline shaped heat radiator for electronic equipment |
| 01/07/2009 | CN101340798A Evaporative condensing cooler and application thereof |
| 01/07/2009 | CN101340796A Heat radiating device |
| 01/07/2009 | CN101340795A Heat radiating device |
| 01/07/2009 | CN101339957A Power fet with low on-resistance using merged metal layers |
| 01/07/2009 | CN101339951A Image sensor package utilizing a removable protection film and method of making the same |
| 01/07/2009 | CN101339950A Active element array substrate and liquid crystal display panel |
| 01/07/2009 | CN101339947A Semiconductor device |
| 01/07/2009 | CN101339946A Semiconductor integrated circuit device and fabrication method for the same |
| 01/07/2009 | CN101339944A Electrostatic discharge protecting circuit capable of saving chip area |
| 01/07/2009 | CN101339942A Semi-conductor encapsulation connecting construction avoiding welding defect induced by warp of substrate |
| 01/07/2009 | CN101339941A Electrostatic discharging protection circuit |
| 01/07/2009 | CN101339940A Encapsulation construction and encapsulation method |
| 01/07/2009 | CN101339939A Encapsulation construction and encapsulation method |
| 01/07/2009 | CN101339938A Driving IC chip and display substrate of planar display |
| 01/07/2009 | CN101339937A Flexible wiring board for tape carrier package |
| 01/07/2009 | CN101339936A Board having buried patterns and manufacturing method thereof |
| 01/07/2009 | CN101339935A Connection structure between printed circuit board and electronic component |
| 01/07/2009 | CN101339934A Semiconductor device with welded leads and method of manufacturing the same |
| 01/07/2009 | CN101339933A Semiconductor device and method for manufacturing semiconductor device |
| 01/07/2009 | CN101339932A Support construction LED |
| 01/07/2009 | CN101339931A Semiconductor package having copper wire and throwing method |
| 01/07/2009 | CN101339930A Flip chip packaging body and manufacturing method thereof |
| 01/07/2009 | CN101339929A Ultra-thin wafer-level contact grid array |
| 01/07/2009 | CN101339928A Inter-connecting structure for semiconductor device package and method of the same |
| 01/07/2009 | CN101339927A 半导体器件 Semiconductor devices |
| 01/07/2009 | CN101339926A Method of manufacturing nitride substrate for semiconductors, and nitride semiconductor substrate |
| 01/07/2009 | CN101339925A 半导体装置 Semiconductor device |
| 01/07/2009 | CN101339924A 半导体器件 Semiconductor devices |
| 01/07/2009 | CN101339919A Semiconductor device and method for fabricating the same |
| 01/07/2009 | CN101339911A Mounted semiconductor device and a method for making the same |
| 01/07/2009 | CN101339908A Electroplating method of electric contact mat and semi-conductor substrate having the electric contact mat |
| 01/07/2009 | CN101339907A Electronic substrate and method for mounting electronic components on substrates |
| 01/07/2009 | CN101339735A Organic el device and organic el display apparatus |
| 01/07/2009 | CN101339726A Address driver and its manufacture method and display device employing the same |
| 01/07/2009 | CN101339625A Storage apparatus and its encapsulation method |
| 01/07/2009 | CN101339444A Voltage regulator and its manufacture method |