| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/13/2009 | US7476619 Semiconductor device |
| 01/13/2009 | US7476611 Semiconductor device and manufacturing method thereof |
| 01/13/2009 | US7476596 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors, and fabricating such devices |
| 01/13/2009 | US7476595 Method for the molecular bonding of microelectronic components to a polymer film |
| 01/13/2009 | US7476569 Leadframe enhancement and method of producing a multi-row semiconductor package |
| 01/13/2009 | US7476567 Midair semiconductor device and manufacturing method of the same |
| 01/13/2009 | US7476566 Electronic and optoelectronic component packaging technique |
| 01/13/2009 | US7476564 Flip-chip packaging process using copper pillar as bump structure |
| 01/13/2009 | US7476470 Method for manufacturing thin film semiconductor device and method for forming resist pattern thereof |
| 01/08/2009 | WO2009006284A2 Semiconductor die having a redistribution layer |
| 01/08/2009 | WO2009006242A1 Conductor paste for ceramic substrate and electric circuit |
| 01/08/2009 | WO2009006024A1 System and method for passive cooling using a non-metallic wick |
| 01/08/2009 | WO2009005490A1 Fan and storage device mounting assembly for electronic device |
| 01/08/2009 | WO2009005477A1 Separation of semiconductor devices |
| 01/08/2009 | WO2009005462A1 Low resistance through-wafer via |
| 01/08/2009 | WO2009005017A1 Semiconductor package and method for manufacturing the same |
| 01/08/2009 | WO2009004878A1 Electronic part package, package parts and electronic device having the package, and package part manufacturing method |
| 01/08/2009 | WO2009004870A1 Semiconductor package |
| 01/08/2009 | WO2009004808A1 Method for manufacturing electronic component package |
| 01/08/2009 | WO2009003972A1 A method for producing a copper contact |
| 01/08/2009 | WO2009003879A1 Method for fabricating a security-protected electronic system, corresponding integrated circuit security protection device and corresponding electronic system |
| 01/08/2009 | WO2009003791A1 Electronic module and method for producing an electronic module |
| 01/08/2009 | WO2009003565A1 Method for packing semiconductor components, and product produced according to the method |
| 01/08/2009 | WO2008122624A3 Method for producing an electric carrier wafer contact for a front-sided connection |
| 01/08/2009 | WO2007130938A3 Semiconductor package-on-package system including integrated passive components |
| 01/08/2009 | US20090012439 Attachment Member for Semiconductor Sensor Device |
| 01/08/2009 | US20090011592 Method of manufacture of semiconductor integrated circuit device and semiconductor integrated circuit device |
| 01/08/2009 | US20090011591 Film substrate, fabrication method thereof, and image display substrate |
| 01/08/2009 | US20090011576 Ultra-Violet Protected Tamper Resistant Embedded EEPROM |
| 01/08/2009 | US20090011554 Component With Sensitive Component Structures and Method for the Production Thereof |
| 01/08/2009 | US20090011548 Hybrid integrated circuit device and manufacturing method thereof |
| 01/08/2009 | US20090011542 Structure and manufactruing method of chip scale package |
| 01/08/2009 | US20090011540 Die-wafer package and method of fabricating same |
| 01/08/2009 | US20090010526 Tungsten plug deposition quality evaluation method by ebace technology |
| 01/08/2009 | US20090009972 Heat dissipation module |
| 01/08/2009 | US20090009917 Electrostatic discharge device |
| 01/08/2009 | US20090008804 Power semiconductor package |
| 01/08/2009 | US20090008803 Layout of dummy patterns |
| 01/08/2009 | US20090008802 Flexible carrier for high volume electronic package fabrication |
| 01/08/2009 | US20090008801 Semiconductor device and method for fabricating the same |
| 01/08/2009 | US20090008800 Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus |
| 01/08/2009 | US20090008799 Dual mirror chips, wafer including the dual mirror chips, multi-chip packages, methods of fabricating the dual mirror chip, the wafer, and multichip packages, and a method for testing the dual mirror chips |
| 01/08/2009 | US20090008798 Semiconductor device suitable for a stacked structure |
| 01/08/2009 | US20090008797 Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices |
| 01/08/2009 | US20090008796 Copper on organic solderability preservative (osp) interconnect |
| 01/08/2009 | US20090008795 Stackable microelectronic device carriers, stacked device carriers and methods of making the same |
| 01/08/2009 | US20090008794 Thickness Indicators for Wafer Thinning |
| 01/08/2009 | US20090008793 Semiconductor device |
| 01/08/2009 | US20090008792 Three-dimensional chip-stack package and active component on a substrate |
| 01/08/2009 | US20090008791 Circuit Structure with Low Dielectric Constant Regions |
| 01/08/2009 | US20090008790 Semiconductor device having through electrode and method of fabricating the same |
| 01/08/2009 | US20090008789 Method of manufacturing micro tunnel-junction circuit and micro tunnel-junction circuit |
| 01/08/2009 | US20090008788 Method of forming a semiconductor device |
| 01/08/2009 | US20090008787 High efficiency solar cell fabrication |
| 01/08/2009 | US20090008786 Sputtering Target |
| 01/08/2009 | US20090008785 Etch process for improving yield of dielectric contacts on nickel silicides |
| 01/08/2009 | US20090008784 Power semiconductor substrates with metal contact layer and method of manufacture thereof |
| 01/08/2009 | US20090008783 Semiconductor device with pads of enhanced moisture blocking ability |
| 01/08/2009 | US20090008782 Integrated circuit structure and manufacturing method thereof |
| 01/08/2009 | US20090008780 Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods |
| 01/08/2009 | US20090008779 Composite Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices |
| 01/08/2009 | US20090008778 Structure and manufactruing method of chip scale package |
| 01/08/2009 | US20090008777 Inter-connecting structure for semiconductor device package and method of the same |
| 01/08/2009 | US20090008776 Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method |
| 01/08/2009 | US20090008775 Semiconductor device with welded leads and method of manufacturing the same |
| 01/08/2009 | US20090008774 Semiconductor device |
| 01/08/2009 | US20090008773 Mounted Semiconductor Device And A Method For Making The Same |
| 01/08/2009 | US20090008772 Semiconductor Switching Module |
| 01/08/2009 | US20090008771 Semiconductor module device, method of manufacturing the same, flat panel display, and plasma display panel |
| 01/08/2009 | US20090008770 Heat dissipation plate and semiconductor device |
| 01/08/2009 | US20090008769 Semiconductor module |
| 01/08/2009 | US20090008768 Semiconductor package system with patterned mask over thermal relief |
| 01/08/2009 | US20090008767 Integrated circuit package with sputtered heat sink for improved thermal performance |
| 01/08/2009 | US20090008766 High-Density Fine Line Structure And Method Of Manufacturing The Same |
| 01/08/2009 | US20090008765 Chip embedded substrate and method of producing the same |
| 01/08/2009 | US20090008764 Ultra-Thin Wafer-Level Contact Grid Array |
| 01/08/2009 | US20090008763 Semiconductor package |
| 01/08/2009 | US20090008762 Ultra slim semiconductor package and method of fabricating the same |
| 01/08/2009 | US20090008761 Integrated circuit package system with flex bump |
| 01/08/2009 | US20090008760 Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant |
| 01/08/2009 | US20090008759 Semiconductor device, lead frame, and manufacturing method for the lead frame |
| 01/08/2009 | US20090008758 Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package |
| 01/08/2009 | US20090008757 Method of fabricating substrate for package of semiconductor light-emitting device |
| 01/08/2009 | US20090008756 Multi-Chip Electronic Package with Reduced Stress |
| 01/08/2009 | US20090008755 Structure and method for manufacturing smd diode frame |
| 01/08/2009 | US20090008754 Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads |
| 01/08/2009 | US20090008753 Integrated circuit with intra-chip and extra-chip rf communication |
| 01/08/2009 | US20090008752 Ceramic Thin Film On Various Substrates, and Process for Producing Same |
| 01/08/2009 | US20090008751 Method for Producing an Area having Reduced Electrical Conductivity Within a Semiconductor Layer and Optoelectronic Semiconductor Element |
| 01/08/2009 | US20090008750 Seal ring for semiconductor device |
| 01/08/2009 | US20090008747 Semiconductor device and method for manufacturing thereof |
| 01/08/2009 | US20090008742 Semiconductor device including memory cell and anti-fuse element |
| 01/08/2009 | US20090008741 Semiconductor device including memory cell and anti-fuse element |
| 01/08/2009 | US20090008732 Semiconductor package |
| 01/08/2009 | US20090008709 Power Semiconductor Devices with Trenched Shielded Split Gate Transistor and Methods of Manufacture |
| 01/08/2009 | US20090008706 Power Semiconductor Devices with Shield and Gate Contacts and Methods of Manufacture |
| 01/08/2009 | US20090008693 Semiconductor device and method of manufacturing same |
| 01/08/2009 | US20090008641 Probe resistance measurement method and semiconductor device with pads for probe resistance measurement |
| 01/08/2009 | US20090008640 Semiconductor device |
| 01/08/2009 | US20090008141 Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof |