| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/14/2009 | CN100452955C Passive radiating fan system and electronic system including the same system |
| 01/14/2009 | CN100452954C Heat radiation module and fastening assembly |
| 01/14/2009 | CN100452953C Housing arrangement |
| 01/14/2009 | CN100452600C Anti-distort casing for electronic circuit |
| 01/14/2009 | CN100452455C LED package frame and LED package having the same |
| 01/14/2009 | CN100452450C Optical surface mount technology package |
| 01/14/2009 | CN100452448C Light emitting element and light emitting device with the light emitting element and method for manufacturing the light emitting element |
| 01/14/2009 | CN100452433C Semiconductor device and high voltage p-type metal oxide semiconductor (HVPMOS) device |
| 01/14/2009 | CN100452428C Trench gate field effect devices |
| 01/14/2009 | CN100452422C Reliable semiconductor structure and method for fabricating |
| 01/14/2009 | CN100452412C Pixel structure and manufacture method and photoelectronic device with the pixel structure and manufacture method |
| 01/14/2009 | CN100452411C Semiconductor structure and producing method thereof |
| 01/14/2009 | CN100452398C Electrostatic prevention protection structure of grids coupling used for high voltage drain spreading NMOS |
| 01/14/2009 | CN100452396C Semiconductor device and manufacturing method therefor |
| 01/14/2009 | CN100452395C Housing device and contact element used therein |
| 01/14/2009 | CN100452394C Piled double-face electrode package and multi-chip assembly |
| 01/14/2009 | CN100452393C 存储器模块 Memory Modules |
| 01/14/2009 | CN100452392C Electrostatic discharge protection element and electronic device with thick diaphragm polysilicon and producing method thereof |
| 01/14/2009 | CN100452391C Semiconductor alignment detecting structure |
| 01/14/2009 | CN100452390C Integrated circuit element with fuse structure including buffering layer, and mfg. method thereof |
| 01/14/2009 | CN100452389C Semiconductor structure and manufacture method thereof |
| 01/14/2009 | CN100452388C Structure of semiconductor device and method for manufacturing the same |
| 01/14/2009 | CN100452387C Semiconductor device having multilevel copper wiring layers and its manufacture method |
| 01/14/2009 | CN100452386C Semiconductor device and fabrication method thereof |
| 01/14/2009 | CN100452385C Semiconductor element and manufacturing method thereof |
| 01/14/2009 | CN100452384C Semiconductor device and production method therefor |
| 01/14/2009 | CN100452383C Semiconductor device with aluminium distribution line |
| 01/14/2009 | CN100452382C Wiring board, semiconductor device, and method of manufacturing the same |
| 01/14/2009 | CN100452381C Wire rack type package of semiconductor, and wire rack |
| 01/14/2009 | CN100452380C Surface mount type semiconductor device and lead frame structure thereof |
| 01/14/2009 | CN100452379C Display panel and encapsulation structure of its control circuit |
| 01/14/2009 | CN100452378C 半导体器件 Semiconductor devices |
| 01/14/2009 | CN100452377C Chip and packaging structure |
| 01/14/2009 | CN100452376C Semiconductor device |
| 01/14/2009 | CN100452375C 半导体装置 Semiconductor device |
| 01/14/2009 | CN100452374C Semiconductor device |
| 01/14/2009 | CN100452373C Connecting structure of integrated circuit and its production |
| 01/14/2009 | CN100452372C Semiconductor device having tin-based solder layer and method for manufacturing the same |
| 01/14/2009 | CN100452371C Method and apparatus for chip cooling using a liquid metal thermal interface |
| 01/14/2009 | CN100452370C Increasing thermal conductivity of thermal interface using carbon nanotubes and CVD |
| 01/14/2009 | CN100452369C Semiconductor device and manufacturing method therefor |
| 01/14/2009 | CN100452368C Semiconductor device, method and apparatus for fabricating the same |
| 01/14/2009 | CN100452367C Semiconductor device packaged into chip size and manufacturing method thereof |
| 01/14/2009 | CN100452366C Adhesive film for manufacturing semiconductor device |
| 01/14/2009 | CN100452365C Cap for airtight sealing, process for producing the same and package for electronic part accommodation |
| 01/14/2009 | CN100452364C Semiconductor device |
| 01/14/2009 | CN100452363C Film transistor array substrate and mfg. method thereof |
| 01/14/2009 | CN100452349C Computer implemented method for designing a semiconductor device, an automated design system and a semiconductor device |
| 01/14/2009 | CN100452348C Method for manufacturing microelectronic circuit component and integrated circuit component |
| 01/14/2009 | CN100452347C Interlinkage structure and its forming method |
| 01/14/2009 | CN100452342C Method for manufacturing board with built-in device and board with built-in device, and method for manufacturing printed wiring board and printed wiring board |
| 01/14/2009 | CN100452330C The encapsulation structure of the optical component semiconductor and its encapsulation method |
| 01/14/2009 | CN100452329C Semiconductor packing substrate for forming presoldering tin material and its preparation method |
| 01/14/2009 | CN100452328C Fabrication of conductive metal layer on semiconductor devices |
| 01/14/2009 | CN100452292C Methods of forming metal-insulator-metal (mim) capacitors with passivation layers on dielectric layers and devices so formed |
| 01/14/2009 | CN100452163C Electro-optical device, method for making the same, and electronic apparatus |
| 01/14/2009 | CN100452089C Method for making an electronic module or label and medium containing such module or label |
| 01/14/2009 | CN100450473C Aseptic medicinal composition |
| 01/14/2009 | CN100450432C Soft physiological signal monitoring device |
| 01/13/2009 | US7477943 Medical device and method of manufacturing |
| 01/13/2009 | US7477520 Memory module |
| 01/13/2009 | US7477519 Electronic component package including heat spreading member |
| 01/13/2009 | US7477518 Sub-assembly |
| 01/13/2009 | US7477516 Air cooled computer chip |
| 01/13/2009 | US7477513 Dual sided board thermal management system |
| 01/13/2009 | US7477194 Conductive pattern and method of making |
| 01/13/2009 | US7476983 Semiconductor device including wire bonding pads and pad layout method |
| 01/13/2009 | US7476982 Fabricated adhesive microstructures for making an electrical connection |
| 01/13/2009 | US7476981 Electronic module with layer of adhesive and process for producing it |
| 01/13/2009 | US7476980 Die configurations and methods of manufacture |
| 01/13/2009 | US7476979 Chip scale surface mounted device and process of manufacture |
| 01/13/2009 | US7476977 Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip |
| 01/13/2009 | US7476976 Flip chip package with advanced electrical and thermal properties for high current designs |
| 01/13/2009 | US7476975 Semiconductor device and resin structure therefor |
| 01/13/2009 | US7476974 Method to fabricate interconnect structures |
| 01/13/2009 | US7476973 Method of manufacturing a semiconductor device having a silicidation blocking layer |
| 01/13/2009 | US7476972 Circuit device, manufacturing method thereof, and sheet-like board member |
| 01/13/2009 | US7476971 Via line barrier and etch stop structure |
| 01/13/2009 | US7476970 Composition for forming insulating film and method for fabricating semiconductor device |
| 01/13/2009 | US7476969 Semiconductor packages for surface mounting and method of producing same |
| 01/13/2009 | US7476968 Semiconductor device including an under electrode and a bump electrode |
| 01/13/2009 | US7476967 Composite carbon nanotube thermal interface device |
| 01/13/2009 | US7476966 Semiconductor module |
| 01/13/2009 | US7476965 Electronic device with integrated heat distributor |
| 01/13/2009 | US7476964 High voltage semiconductor device housing with increased clearance between housing can and die for improved flux flushing |
| 01/13/2009 | US7476963 Three-dimensional stack manufacture for integrated circuit devices and method of manufacture |
| 01/13/2009 | US7476962 Stack semiconductor package formed by multiple molding and method of manufacturing the same |
| 01/13/2009 | US7476961 Method and apparatus for forming a DMD window frame with molded glass |
| 01/13/2009 | US7476960 System and method for improved auto-boating |
| 01/13/2009 | US7476959 Encapsulated electronic device |
| 01/13/2009 | US7476955 Die package having an adhesive flow restriction area |
| 01/13/2009 | US7476952 Semiconductor input control device |
| 01/13/2009 | US7476945 Memory having reduced memory cell size |
| 01/13/2009 | US7476941 Semiconductor integrated circuit device and fabrication process thereof |
| 01/13/2009 | US7476922 Logic device having vertically extending metal-insulator-metal capacitor between interconnect layers and method of fabricating the same |
| 01/13/2009 | US7476915 Semiconductor integrated circuit including a first region and a second region |
| 01/13/2009 | US7476875 Contact opening metrology |
| 01/13/2009 | US7476816 Current sensor |
| 01/13/2009 | US7476813 Multilayer flip-chip substrate interconnect layout |
| 01/13/2009 | US7476702 Prepared from polymer composition comprising a base polymer matrix and a thermally-conductive, electrically-insulating material and reinforcing material such as glass; can be molded into packaging assemblies for electronic devices such as capacitors, transistors, and resistors |